Flexible Displays


UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

04/20/2016  A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

What screens are made of: New twists (and bends) in LCD research

04/18/2016  Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

Roll-to-Roll Coating Technology: It's a Different Ball of Wax

04/18/2016  Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IoT Demands Part 2: Test and Packaging

04/15/2016  To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

IoT Demands Part 1: EDA and Fab Nodes

04/14/2016  To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

Presto Engineering and Peraso Technologies Develop Innovative Test Solution for 60 GHz Transceiver

04/12/2016  Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, today jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.

Cadence to Acquire Rocketick

04/11/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has entered into a definitive agreement to acquire Rocketick Technologies Ltd.

Mentor Graphics U2U Meeting April 26 in Santa Clara

04/11/2016  Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

The future is here: Interactive screens on your packages

04/08/2016  Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.

Cadence and University of Oxford Foster the Advancement of Formal Verification Innovation

04/07/2016  Cadence Design Systems, Inc. and the University of Oxford today announced a move to foster the advancement of formal verification innovation with the appointment of Dr. Ziyad Hanna, Cadence vice president of R&D, as a visiting professor in Oxford's Department of Computer Science for the next three years.

Synopsys Debuts Tools at Users Group Meeting

03/30/2016  Aart de Geus, the chairman and co-chief executive officer of Synopsys, used his keynote address at the 2016 Synopsys Users Group conference in Silicon Valley to tout a pair of new products.

Effective graphene doping depends on substrate material

03/29/2016  Juelich physicists have discovered unexpected effects in doped graphene - i.e. graphene that is mixed with foreign atoms.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

03/17/2016  Mentor Graphics Corporation today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification.

Replacement for silicon devices looms big with ORNL discovery

03/17/2016  Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

Linde Supports New Wave of PV Plants in SE Asia

03/17/2016  The Linde Group supports the expansion of photovoltaic solar cell manufacturing in Southeast Asia by offering its full portfolio of gases and wet chemicals, along with engineering services, to help the new PV cell plants being established in the region.

New MEMS Design Contest Encourages Advances in MEMS Technology

03/16/2016  Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017