Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Arizona State and PARC produce world’s largest flexible X-ray detector

03/13/2013 

The Flexible Electronics and Display Center (FEDC) at Arizona State University and PARC, a Xerox company, today announced that they successfully manufactured the world's largest flexible X-ray detector prototype using advanced thin film transistors (TFTs).

Printed electronics sector takes hard look at the flexible future

03/12/2013 

The flexible and printed electronics community reports encouraging progress in the materials and process ecosystem needed for commercial production — and an increasingly realistic focus on applications that best capitalize on the technology’s strengths. Best near-term prospects now look to be sturdy light-weight displays, smart sensor systems, and flexible and large area biomedical sensors and imagers.

Corning believes flexible displays with Willow glass are still three years out

03/01/2013 

CEO believes that the technology may be made available in simple products this year.

New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications

02/26/2013 

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.

FlexTech Alliance elects Keith Rollins Chairman of the Board

02/20/2013 

FlexTech Alliance, a developer of the flexible and printed electronics industry supply chain, announced today that Dr. Keith Rollins has been elected chairman of the Governing Board.

Production process doubles speed and efficiency of flexible electronics

02/20/2013 

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.

ISSCC 2013: Imagers, MEMS, medical and displays

02/11/2013 

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.

ISSCC 2013: Large-area flexible electronics

02/11/2013 

Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.

Patent analysis: Flexible roll-to-roll processing

02/05/2013 

A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.

Is Apple changing its mind on touch panel structures?

01/22/2013 

Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.

Fraunhofer IAP opens pilot line for organic electronics

01/22/2013 

The Fraunhofer Institute for Applied Polymer Research (IAP) in Potsdam-Golm and fab/cleanroom developer MBRAUN have commissioned a new "near industrial-scale" pilot line for organic light-emitting diodes (OLEDs) and organic solar cells.

Report: "Glaring imbalances" in printed electronics venture funding

01/17/2013 

Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks at who's getting attention and who's not.

CES: Phablets and table PCs break the PC mold

01/11/2013 

Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.

Look for 4K LCDs, OLEDs at CES

01/07/2013 

As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.

Small, medium-size AMOLED displays doubling by 2015

01/03/2013 

Active matrix OLED (AMOLED) displays will continue to encroach upon LCD technology through small and medium-sized (9-in. and smaller) displays used in mobile phones, according to recent analysis by NPD DisplaySearch.

FlexTech Alliance, 4D Technology developing R2R surface metrology system

12/28/2012 

The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.

Tablet PCs are shifting supply chain strategies...can you say 100M iPads?

12/12/2012 

Increased tablet adoption, with Apple's continued dominance and emergence by new players (see Google, Microsoft) are changing the mobile PC competitive landscape -- and supply-chain partners are having to rethink their strategies to stay atop the game.

Process Watch: Cycle time’s paradoxical relationship to inspection

12/11/2012 

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

Breakthrough in contact lens displays unveiled

12/05/2012 

A new breakthrough in contact lens displays can turn your eyes in to dollar signs, but they aren’t an alternative to Google glasses.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014