Flexible Displays


NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Sussex physicists have breakthrough on brittle smart phone screens

10/25/2017  New 'potato stamp' technique combining silver and graphene may create cheaper, more flexible and eco-friendly screens.

SEMICON Japan brings smart applications and IoT

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Flexible display shipments will increase to 643M units annually by 2022

10/04/2017  In 2017, key flexible display components achieved cost and performance parity with their rigid counterparts for the first time, thus removing a key market barrier and opening the door to rapid adoption in a variety of otherwise-rigid devices such as e-readers and wearables.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

SEMICON Europa moves to Munich: Empowering innovation and shaping the value chain

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

Driven by TV size migration, large TFT display market continues to grow 6% by area in 2017

09/15/2017  The large thin film transistor (TFT) display market is expected to continue to expand in 2017 despite slower end-market demand, according to IHS Markit.

Flex Logix joins TSMC IP Alliance Program

09/05/2017  Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.

Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

Ultrathin Layers with Large Contact Area on Carbon Fibers as High-Performance Electrode

08/15/2017  To meet the novel functions of next-generation electronics, including foldable displays, flexible power sources are needed.

Ultrathin device harvests electricity from human motion

07/24/2017  A new electrochemical energy harvesting device developed at Vanderbilt University can generate electrical current from the full range of human motions and is thin enough to embed in clothing.

AMOLED panel market to surge 63% in 2017

07/20/2017  The global active-matrix organic light-emitting diode (AMOLED) panel market is forecast to surge 63 percent in 2017 from a year ago to $25.2 billion on growing demand for AMOLED panels in the smartphone and TV industries.

AMOLED fine metal mask market expected to reach $1.2B by 2022

07/20/2017  As active-matrix organic light-emitting diode (AMOLED) displays quickly displace liquid crystal displays (LCDs) in smartphones, panel makers are rapidly adding new production capacity, accelerating the demand for the fine metal mask.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

New class of 'soft' semiconductors could transform HD displays

06/29/2017  Berkeley Lab researchers find tunable halide perovskites could usher in new generation of optoelectronic devices.

To connect biology with electronics, be rigid, yet flexible

06/19/2017  Researchers uncover design principles to make polymers that can transport both ions and electrons.

The first nanometrically-sized superelastic alloy

06/09/2017  UPV/EHU-University of the Basque Country's researchers have explored superelasticity properties on a nanometric scale based on shearing an alloy's pillars down to nanometric size.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

2017FLEX Korea: First flexible hybrid electronics conference in Korea

05/10/2017  Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 in Seoul at COEX Exhibition Center.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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