Flexible Displays

FLEXIBLE DISPLAYS ARTICLES



Functionalized graphene ink opens door to innovative screen-printing applications

09/29/2015  A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink.

CMP Technology Evolving to Engineer Surfaces

09/28/2015  New devices, materials, and substrates challenge atomic-scale integration.

SEMI Conference Addresses Issues in Semiconductor Materials

09/25/2015  The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

Linde Electronics Presents 2014 Global Supplier Awards

09/25/2015  Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.

GlobalFoundries CTO Calls for Innovation in Chip Materials

09/24/2015  Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

Dialog Semiconductor to acquire Atmel for $4.6 billion

09/21/2015  Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Rising Flexible Display Technology Patents Herald Future Market Growth

09/15/2015  With a recent sharp rise in the number of patent applications for flexible display technologies, the market for various types of flexible displays is expected to broaden.

Turning clothing into information displays

09/03/2015  Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec’s associated lab at Ghent University, have demonstrated the world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles.

Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

09/02/2015  Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Flexible 7 inch touch panel with integrated OLED display developed

09/01/2015  Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device.

Solid State Watch: August 21-27, 2015

08/31/2015  New ams fab going to Marcy, NY: Startups and small electronics companies spent $78.3 billion on semiconductors in 2014; Pure-play foundry sales forecast to grow to all-time high in 4Q15; University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics

FlexTech Alliance receives $75M Department of Defense Award

08/28/2015  The U.S. Department of Defense (DoD) today awarded FlexTech Alliance a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII).

Comfortable Consumer EEG Headset Shown by Imec and Holst Centre

08/27/2015  Medical-quality data acquisition of signals tracing emotions and moods.

Managing Dis-Aggregated Data for SiP Yield Ramp

08/24/2015  In general, there is an accelerating trend toward System-in-Package (SiP) chip designs including Package-On-Package (POP) and 3D/2.5D-stacks where complex mechanical forces—primarily driven by the many Coefficient of Thermal Expansion (CTE) mismatches within and between chips and packages—influence the electrical properties of ICs.

Status of flexible encapsulation to enable flexible electronics

08/24/2015  In 2020, flexible barrier manufacturing for flexible electronic devices such as displays will be a market worth more than US$184 million, according to IDTechEx Research.

Traditional notebook display shipments drop as Chromebooks rise

08/14/2015  Global consumers have lately become less interested in acquiring conventional notebooks with 15-inch displays, and they are instead shifting their spending to smaller product segments.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).




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Flawless Execution at Fairchild: How Change to Modern MES Enables Agility, Quality and Productivity

August 9, 2016 at 1 PM ET / Sponsored by Epicor and Siemens

In this high-pressure environment, leading semiconductor companies are swapping out older manufacturing executions systems (MES) for modern MES. Surprised? True, the perceived risk of changing out MES in a semiconductor facility is high. Yet companies have done it with great success and enormous business benefits. Fairchild Semiconductor’s positive experiences as it strives for quality, on-time delivery, new product introduction success, improved productivity and quality are indicative. In just one year, Fairchild switched out aging systems for a new MES at a plant in China – and the following month, they got it up at a second plant. Learn what they did to ensure the change happened quickly and without a hitch. In addition to this case study, you’ll hear from a leading industry analyst who has interviewed dozens of people from semiconductor companies that have succeeded with the move to modern MES.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

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