FPDs and TFTs

MAGAZINE



FPDS AND TFTS ARTICLES



Demand for higher resolution oxide panels expected to grow 30% in 2018

04/19/2018  Rise in LCD and OLED display applications has contributed to momentum in demand growth for panels using this technology.

Flexible TVs and high performance wearable smart tech one step closer

04/19/2018  Flexible televisions, tablets and phones as well as 'truly wearable' smart tech are a step closer thanks to a nanoscale transistor created by researchers at The University of Manchester and Shandong University in China.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Apple developing all key elements of microLED display technology

03/29/2018  If we did not know before, now we are all aware: microLEDs for display applications is a very hot topic and Apple is strongly commited to the development of its own technology.

Market for organic materials used to manufacture OLED panels showed remarkable growth in second half of 2017

03/28/2018  Revenue of OLED materials increased by 20 percent in second half of 2017, following a slump from 2016.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

Growth of AMOLED display manufacturing capacity slowing in South Korea while accelerating in China

03/15/2018  After two years of unprecedented capacity expansion, South Korean flat panel display (FPD) manufacturers will essentially halt new active-matrix organic light-emitting diode (AMOLED) panel factory construction for mobile applications in 2018.

Flexible AMOLED market more than tripled to $12B in 2017

03/06/2018  Thanks to a sudden increase in demand , shipment revenue of flexible active-matrix organic light-emitting diode (AMOLED) displays more than tripled in 2017, accounting for 54.6 percent of total AMOLED panel shipment revenue.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Experimentally demonstrated a toffoli gate in a semiconductor three-qubit system

02/28/2018  A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.

Individual quantum dots imaged in 3-D for first time

02/27/2018  Researchers have developed an imaging technique that uses a tiny, super sharp needle to nudge a single nanoparticle into different orientations and capture 2-D images to help reconstruct a 3-D picture. The method demonstrates imaging of individual nanoparticles at different orientations while in a laser-induced excited state.

Driven by size migration and high-end products, large TFT display market continued to grow in 2017

02/16/2018  Despite slower demand from end market and panel price erosion, the large thin-film transistor (TFT) display market expanded in 2017 in all three aspects -- unit shipments, area shipments and revenue.

MORE FPDS-AND-TFTS ARTICLES

TWITTER


WEBCASTS



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

VIDEOS