02/25/2014 Dow Corning today introduced new Dow Corning EA-2000 Silicone Adhesive, a high-performance terminal sealant for faster, more cost-effective manufacturing of thin-film transistor (TFT) LCD displays.
01/23/2014 The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.
10/16/2013 Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.
09/10/2013 OLED, a self-light-emitting diode, has been touted as the next big thing in display technology for its exceptional properties including no need for a backlight, wide viewing angle, quick responding speed and low current consumption.
Weak demand and rising production in China, combined with efforts by South Korean suppliers to cut manufacturing charges in order to stimulate demand, is resulting in pronounced price reductions in the third quarter for popular sizes of liquid-crystal display television (LCD TV) panels.
In a season when their sales should be rising sharply, suppliers of large-sized liquid-crystal (LCD) panels instead are encountering weak demand growth in the third quarter, exacerbating the glut already plaguing the market.
Making a stellar debut, high-resolution liquid-crystal display (LCD) panels featuring resolutions of 300 pixels per inch (ppi) or more are appearing in media tablets for the first time this year, with shipments set to approach 13 million units.
This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014Sponsored by Phoseon Technology
Electronic systems have revolutionized our lives. We use
them in nearly all of our daily activities, for communication,
computing, navigation, entertainment, payment processing,
and more. They are the workhorses in many medical,
transportation, aerospace, and military systems, performing
functions such as automated control, data analysis, and
pattern recognition.February 10, 2014Sponsored by Master Bond, Inc.,
Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014Sponsored by Master Bond, Inc.,
April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.
May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.
May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.