FPDs and TFTs

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DISPLAYS BLOGS



FPDS AND TFTS ARTICLES



In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

06/23/2014  Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Dow Corning releases new terminal sealant for manufacturing TFT LCD displays

02/25/2014  Dow Corning today introduced new Dow Corning EA-2000 Silicone Adhesive, a high-performance terminal sealant for faster, more cost-effective manufacturing of thin-film transistor (TFT) LCD displays.

CPI presents ultra-flexible OTFT device array suitable for foldable AMOLED displays of the future

01/23/2014  The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.

Applied Materials launches new metal oxide display tech

10/16/2013  Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.

AMOLED compensation circuit patent analysis

09/10/2013  OLED, a self-light-emitting diode, has been touted as the next big thing in display technology for its exceptional properties including no need for a backlight, wide viewing angle, quick responding speed and low current consumption.

Price erosion accelerates for LCD TV open call panels in Q3

08/13/2013 

Weak demand and rising production in China, combined with efforts by South Korean suppliers to cut manufacturing charges in order to stimulate demand, is resulting in pronounced price reductions in the third quarter for popular sizes of liquid-crystal display television (LCD TV) panels.

MORE FPDS-AND-TFTS ARTICLES

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014
SEMICON Europa
Grenoble, France
http://www.semiconeuropa.org
October 07, 2014 - October 09, 2014
MEMS Executive Congress US 2014
Scottsdale, AZ
http://us2014.memscongress.com
November 05, 2014 - November 07, 2014