FPDs and TFTs

FPDS AND TFTS ARTICLES



In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

06/23/2014  Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Dow Corning releases new terminal sealant for manufacturing TFT LCD displays

02/25/2014  Dow Corning today introduced new Dow Corning EA-2000 Silicone Adhesive, a high-performance terminal sealant for faster, more cost-effective manufacturing of thin-film transistor (TFT) LCD displays.

CPI presents ultra-flexible OTFT device array suitable for foldable AMOLED displays of the future

01/23/2014  The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.

Applied Materials launches new metal oxide display tech

10/16/2013  Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.

AMOLED compensation circuit patent analysis

09/10/2013  OLED, a self-light-emitting diode, has been touted as the next big thing in display technology for its exceptional properties including no need for a backlight, wide viewing angle, quick responding speed and low current consumption.

Price erosion accelerates for LCD TV open call panels in Q3

08/13/2013 

Weak demand and rising production in China, combined with efforts by South Korean suppliers to cut manufacturing charges in order to stimulate demand, is resulting in pronounced price reductions in the third quarter for popular sizes of liquid-crystal display television (LCD TV) panels.

Weak increase in TV demand spurs larger-than-expected glut of LCD panels in Q3

07/26/2013 

In a season when their sales should be rising sharply, suppliers of large-sized liquid-crystal (LCD) panels instead are encountering weak demand growth in the third quarter, exacerbating the glut already plaguing the market.

High-resolution tablet panels debut with strong shipments in 2013

07/19/2013 

Making a stellar debut, high-resolution liquid-crystal display (LCD) panels featuring resolutions of 300 pixels per inch (ppi) or more are appearing in media tablets for the first time this year, with shipments set to approach 13 million units.

LCD TV panel inventory rises to excess level, spurring price drops

07/19/2013 

Global inventory of liquid-crystal display television (LCD TV) panels is set to rise to its highest level in 19 months in August, with the elevated stockpiles expected to contribute to a decline in prices in the second half of the year.

BOE Technology Group and Applied Materials to deliver leading-edge display technologies

07/03/2013 

BOE Technology Group announced that it has placed significant orders for advanced Gen 8.5 and Gen 5.5 display production equipment from Applied Materials for use in multiple facilities.

Displaybank releases new industry analysis of glass slimming market

06/18/2013 

The glass slimming market topped $600 million in value in 2012 and is forecast to continuously grow to surpass $1 billion in 2014, according to a new report released by Displaybank.

ISORG and Plastic Logic co-develop the world’s first image sensor on plastic

06/11/2013 

ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element.

Shipments of large-sized LCD display panels outpace production in March

05/29/2013 

Shipments in March of large-sized liquid crystal displays (LCD) exceeded total production when measured in terms of area, the result of a deliberate move by panel manufacturers to digest accumulated inventory.

Patent analysis: Flexible OLED structures

05/28/2013 

A new report from IHS Displaybank analyzes the scope of the flexible OLED patents issued.

AMOLED displays to have major influence on innovation in the cloud computer era

05/22/2013 

During the keynote speech, Kim said that the future of displays will change considerably, with special attention to be given for the virtually infinite number of imaging possibilities in AMOLED (Active Matrix Organic Light Emitting Diode) display technology.

TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market

05/13/2013 

TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.

AMOLED panel makers: To chase or to lead, that is the question

04/19/2013 

In recent years, TFT-LCD technology has dominated the display panel market, everything from small, medium and large screens, to the point where all other rival display technologies such as e-paper, PDP, and CRT have steadily been losing their positioning.

Singapore researchers unveil glasses-free 3D display tech

04/02/2013 

Ditch the 3D glasses. Thanks to a simple plastic filter, mobile device users can now view unprecedented, distortion-free, brilliant 3D content with the naked eye.

AMOLED display shipments to grow to 447.7M units in 2017

03/25/2013 

Within the mobile handset display market, the market share for AMOLED displays is forecast to grow from 7.9% in 2013 to 15.2% in 2017, as presented in the figure below. AMOLED’s market share for 4-inch or larger handset displays employed in smartphones is set to increase to 24.4% in 2017, up from 23.0% in 2013.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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VIDEOS