FPDs and TFTs

FPDS AND TFTS ARTICLES



Global, U.S. electronics supply chains see healthy midyear business conditions

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

LG Display retains its lead in area shipments of large displays in first quarter of 2018

05/15/2018  Large display panel shipments show better-than-expected results compared to previous first quarters.

Researchers offer new technology for liquid-crystal displays

05/11/2018  An international research team from Russia, France, and Germany has proposed a new method for orienting liquid crystals.

Tech bends light more efficiently, offers wider angles for light input

05/08/2018  Engineering and physics researchers at North Carolina State University have developed a new technology for steering light that allows for more light input and greater efficiency - a development that holds promise for creating more immersive augmented-reality display systems.

Shipment area of AMOLED panel expected to more than quadruple by 2024

04/23/2018  With demand growing for active matrix organic light-emitting diode (AMOLED) TV panels, shipments of overall AMOLED panels by area is forecast to more than quadruple to 22.4 million square meters by 2024 from 5.0 million square meters in 2017.

Demand for higher resolution oxide panels expected to grow 30% in 2018

04/19/2018  Rise in LCD and OLED display applications has contributed to momentum in demand growth for panels using this technology.

Flexible TVs and high performance wearable smart tech one step closer

04/19/2018  Flexible televisions, tablets and phones as well as 'truly wearable' smart tech are a step closer thanks to a nanoscale transistor created by researchers at The University of Manchester and Shandong University in China.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

Apple developing all key elements of microLED display technology

03/29/2018  If we did not know before, now we are all aware: microLEDs for display applications is a very hot topic and Apple is strongly commited to the development of its own technology.

Market for organic materials used to manufacture OLED panels showed remarkable growth in second half of 2017

03/28/2018  Revenue of OLED materials increased by 20 percent in second half of 2017, following a slump from 2016.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

Growth of AMOLED display manufacturing capacity slowing in South Korea while accelerating in China

03/15/2018  After two years of unprecedented capacity expansion, South Korean flat panel display (FPD) manufacturers will essentially halt new active-matrix organic light-emitting diode (AMOLED) panel factory construction for mobile applications in 2018.

Flexible AMOLED market more than tripled to $12B in 2017

03/06/2018  Thanks to a sudden increase in demand , shipment revenue of flexible active-matrix organic light-emitting diode (AMOLED) displays more than tripled in 2017, accounting for 54.6 percent of total AMOLED panel shipment revenue.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Experimentally demonstrated a toffoli gate in a semiconductor three-qubit system

02/28/2018  A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.

Individual quantum dots imaged in 3-D for first time

02/27/2018  Researchers have developed an imaging technique that uses a tiny, super sharp needle to nudge a single nanoparticle into different orientations and capture 2-D images to help reconstruct a 3-D picture. The method demonstrates imaging of individual nanoparticles at different orientations while in a laser-induced excited state.

Driven by size migration and high-end products, large TFT display market continued to grow in 2017

02/16/2018  Despite slower demand from end market and panel price erosion, the large thin-film transistor (TFT) display market expanded in 2017 in all three aspects -- unit shipments, area shipments and revenue.

Chinese panel makers catching up fast in LTPS LCD panel shipments for mobile phones

02/12/2018  Total shipments of mobile phone displays, including thin-film transistor liquid crystal display (TFT LCD) and active matrix organic light-emitting diode (AMOLED) panels, reached 2.01 billion units in 2017, up 3 percent from 2016.

MicroLED displays: the patent landscape reflects the dynamism of the sector

01/31/2018  This year again, the Las Vegas Consumer Electronics Show, 2018 edition allowed us to discover the latest innovations in numerous fields including the microLED displays sector.




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Enabling EUV and the patterning roadmap

Tuesday, June 5, 2018 at 1:00 p.m. ET

EUV lithography has steadily been gaining momentum in recent years and edges closer and closer to insertion in manufacturing. While considerable progress has been made and the first uses of EUV appear imminent, there remain some difficulties that will challenge the rate and degree to which EUV can be employed. This talk will aim to explore the patterning-related challenges that remain, summarize some of the ongoing efforts to tackle these challenges, and give an outlook towards the future.

Sponsored By:

Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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