FPDs and TFTs

FPDS AND TFTS ARTICLES



AMOLED growth is a bright spot for the display industry

04/28/2016  Active matrix organic light-emitting diode (AMOLED) displays are rising fast, thanks to lowering costs, wider use in end-market consumer electronics devices and the ramp-up of new manufacturing capacities.

With AMOLED shipments rising, Samsung Display led the small-medium display market in 2015

04/22/2016  Year-over-year unit-shipment growth in the small and medium display market was flat in 2015, reaching 2.8 billion units; revenue rose 4 percent over the previous year, to reach $43.9 billion.

Slowing notebook PC replacement cycle leading to higher resolution displays

04/21/2016  The global notebook PC display market fell 23 percent year over year in the first quarter (Q1) of 2016.

What screens are made of: New twists (and bends) in LCD research

04/18/2016  Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

Update on neon shortage 2016 highlighted at the Critical Materials Conference

04/04/2016  Communication with suppliers in the Ukraine and China have continued to verify expected shortages occurring toward the end of 2016. Although supply appears stable now, inventories purchased during the second half of 2015 will deplete inventories on the supplier side toward the end of this year.

LCD glass area demand to rise 13% from 2015 to 2018

03/23/2016  Unit demand for display glass used for liquid crystal display (LCD) TVs, desktop monitors, mobile PCs and other major large panel applications is forecast to fall in 2016.

Declining flat panel display revenue to reach lowest level since 2012

03/08/2016  Global flat panel display (FPD) market revenue is expected to shrink by 6 percent year over year in 2016 to $120 billion.

Inventory adjustments causing TV and IT display shipments to decline in Q1 2016

03/02/2016  LCD manufacturer inventory adjustments and continued slowing demand are causing TV and IT display prices to fall, further eroding panel makers’ profitability.

Wearable device display unit shipments to hit $39M by 2016

02/26/2016  The growing popularity of wearable applications is driving up shipments of the displays used in these devices.

Flat panel display equipment spending to reach to $11.2B by 2016

02/18/2016  Flat-panel display (FPD) equipment spending this year will reach its highest level since 2011, according to IHS Inc.

New thin film transistor may lead to flexible devices

02/10/2016  An engineering research team at the University of Alberta has invented a new transistor that could revolutionize thin-film electronic devices.

Oversupply to overshadow LCD market in 2016

01/26/2016  The ongoing issue of liquid crystal display (LCD) oversupply -- exacerbated by China’s aggressive investment in production capacity as well as high fab utilization -- will continue well into 2016.

China to dominate flat panel display manufacturing by 2018, says IHS

11/13/2015  While conventional thin film transistor liquid crystal (TFT LCD) displays are rapidly trending towards commoditization and currently suffering from declining prices and margins, China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

Turning clothing into information displays

09/03/2015  Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec’s associated lab at Ghent University, have demonstrated the world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles.

Cima NanoTech announces joint venture with Foxconn

08/26/2015  Cima NanoTech, a developer and manufacturer of transparent conductive film solutions, announced today that it has entered into a joint venture with Foxconn, the world’s largest ICT technology provider and vertically integrated device manufacturer, to deliver the industry’s first cost-competitive, projected capacitive (pro-cap) solution for large format touch screens.

Inventory levels at LCD TV panel makers are forecast to surge in the second half of 2015

08/19/2015  LCD TV panel makers’ inventory levels will be greater than normal in the second half of 2015, due to softening demand and increased output from new LCD panel manufacturing lines (fabs).

Demand for novel display materials set to surge in second half of 2015

08/17/2015  Starting in the second half of 2015, the overall consumption of active-matrix organic light-emitting diode (AMOLED) materials will surge, as LG Display increases the production of white organic light-emitting diode (WOLED) TV panels

Traditional notebook display shipments drop as Chromebooks rise

08/14/2015  Global consumers have lately become less interested in acquiring conventional notebooks with 15-inch displays, and they are instead shifting their spending to smaller product segments.

Weak IT market drags down large-area display market

08/14/2015  Due to decreased information technology (IT) demand, and global currency issues that resulted in higher import prices in most regions, overall large-area TFT LCD unit shipments in the first half (H1) of 2015 fell 2 percent year over year to reach 340 million units.

New research may enhance display & LED lighting technology

08/10/2015  Researchers from the University of Illinois at Urbana-Champaign have produced some promising results toward that goal, developing a new method to extract more efficient and polarized light from quantum dots (QDs) over a large-scale area.




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WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS