FPDs and TFTs

FPDS AND TFTS ARTICLES



Gigaphoton first to introduce new excimer laser to flat panel display industry

06/23/2016  Gigaphoton Inc., a major semiconductor lithography light source manufacturer, announced the successful development of a new series of excimer lasers, the GIGANEX series.

Wide color gamut displays to comprise 17% of display shipment area in 2018

06/14/2016  Shipment area of wide color gamut (WCG) displays is expected to reach 32 million square meters in 2018, which represents 17 percent of total display shipment area.

Solid State Watch: June 3-9, 2016

06/10/2016  Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

Solid State Watch: May 27-June 2, 2016

06/03/2016  GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive products; UT Dallas physicists research topological insulators

Solid State Watch: May 20-26, 2016

05/31/2016  SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find new method for doping single crystals of diamond

AGC develops amorphous thin film using unique sputtering target material

05/26/2016  GC Asahi Glass (AGC) today announced it has developed a uniform amorphous thin film using a unique sputtering target material, and has started industrialization and commercial production of the material.

Solid State Watch: May 13-19, 2016

05/23/2016  IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments; New type of graphene-based transistor will increase the clock speed of processors

As large display unit shipments decline, shipment area rises with aggressive size migration for TVs

05/20/2016  Despite unit-shipment declines, large thin-film transistor (TFT) liquid crystal display (LCD) shipment area is expected to grow 5 percent year over year, to reach 168 million square meters in 2016.

ORNL demonstrates large-scale technique to produce quantum dots

05/20/2016  A method to produce significant amounts of semiconducting nanoparticles for light-emitting displays, sensors, solar panels and biomedical applications has gained momentum with a demonstration by researchers at the Department of Energy's Oak Ridge National Laboratory.

The CEA announces expanded collaboration with Intel

05/18/2016  The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

John Caldwell appointed as chairman of AMD Board of Directors

05/13/2016  AMD today announced that its Board of Directors has appointed Board member John Caldwell as Chairman.

After three months of declines, monthly LCD TV unit shipments resumed growth in March

05/12/2016  Chinese brands have had a significant impact on the global TV market recently, due to their aggressive pursuit of export growth. In large part because of these efforts, monthly liquid crystal display (LCD) TV unit shipments returned to positive year-over-year growth in March 2016 after three months of declines.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor's SLIM and SWIFT Packaging Technologies

05/05/2016  Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor's SLIM and SWIFT advanced fan-out package technologies.

How to Boost Verification Productivity with SystemVerilog/UVM and Emulation

05/03/2016  Use of emulation for hardware-assisted testbench acceleration is growing as design verification teams find that simulation alone cannot deliver the coverage or performance needed to get large, complex designs to market on time. If your design requires millions of clock cycles to fully verify, you need both simulation and emulation.

AMOLED growth is a bright spot for the display industry

04/28/2016  Active matrix organic light-emitting diode (AMOLED) displays are rising fast, thanks to lowering costs, wider use in end-market consumer electronics devices and the ramp-up of new manufacturing capacities.

Leti's CoolCube 3D Transistor Stacking Improves with Qualcomm Help

04/27/2016  Collaborating to build out design to fabrication ecosystem.

With AMOLED shipments rising, Samsung Display led the small-medium display market in 2015

04/22/2016  Year-over-year unit-shipment growth in the small and medium display market was flat in 2015, reaching 2.8 billion units; revenue rose 4 percent over the previous year, to reach $43.9 billion.




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS