FPDs and TFTs

FPDS AND TFTS ARTICLES



Driven by TV size migration, large TFT display market continues to grow 6% by area in 2017

09/15/2017  The large thin film transistor (TFT) display market is expected to continue to expand in 2017 despite slower end-market demand, according to IHS Markit.

TV market: Quantum dots reinforce LCD positioning, faced with the OLED solutions

08/31/2017  How will the competitive landscape evolve, especially with OLED solutions?

Panel makers forecast to maintain high fab utilization rates in Q3

08/29/2017  The overall utilization rate of display panel fabrication (fab) plants is expected to remain high in the third quarter of 2017, recording similar levels for the fifth consecutive quarter.

OLED encapsulation materials market to grow 16% CAGR to $233M by 2021

08/21/2017  The popularity of organic light-emitting diode (OLED) TVs and smartphones has boosted not only the OLED display market but also the OLED encapsulation materials market.

OLED TV expected to grow to more than 50% of $1,000-plus market by 2019

08/01/2017  As the global TV market continues to struggle with unit volume growth overall in 2017 -- now projected to decline for the second year in a row -- attention has turned to the most profitable market segments.

Flexible AMOLED display manufacturing capacity to grow 91% CAGR between 2016 and 2020

07/26/2017  In the current, unprecedented phase of active matrix organic light emitting diode (AMOLED) panel factory build-out, flexible AMOLED capacity will expand from 1.5 million square meters to 20.1 million square meters between 2016 and 2020, at a compound annual growth rate of 91 percent.

AMOLED panel market to surge 63% in 2017

07/20/2017  The global active-matrix organic light-emitting diode (AMOLED) panel market is forecast to surge 63 percent in 2017 from a year ago to $25.2 billion on growing demand for AMOLED panels in the smartphone and TV industries.

AMOLED fine metal mask market expected to reach $1.2B by 2022

07/20/2017  As active-matrix organic light-emitting diode (AMOLED) displays quickly displace liquid crystal displays (LCDs) in smartphones, panel makers are rapidly adding new production capacity, accelerating the demand for the fine metal mask.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

Air Products invests in six industrial gas plants to support electronics manufacturing industry in China

06/05/2017  Air Products announced it has recently received multiple, long-term supply awards from semiconductor and flat panel display manufacturers in China as the country's electronics manufacturing industry continues to boom.

Primary automotive display systems market valued at $11.6B globally in 2017

05/08/2017  Will grow to nearly $21 billion in 2022, IHS Markit says.

Discovery of new transparent thin film material could improve electronics and solar cells

05/08/2017  Conductivity is highest-ever for thin film oxide semiconductor material.

Panel shipment forecast rises for Q2, 2017 ahead of new product model launches

05/03/2017  Global liquid crystal display (LCD) and organic light-emitting diode (OLED) panel shipments are expected to increase by 7 percent in the second quarter of 2017 quarter to quarter to 646.7 million units, a rebound from a 9 percent quarter-to-quarter decrease in the first quarter, according to IHS Markit.

ASML, ZEISS file joint patent infringement lawsuits against Nikon

04/28/2017  ASML and ZEISS today announced that both companies are filing initial legal claims against Nikon for infringement of more than 10 patents.

Entegris acquires MicroElectronics filtration product line from W. L. Gore & Associates

04/25/2017  The transaction expands Entegris' portfolio of filtration solutions for semiconductor, OLED and flat panel display applications.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

New quantum liquid crystals may play role in future of computers

04/21/2017  New state of matter may have applications in ultrafast quantum computers.

Graphene Flagship researches create thin film transistors printed with layered materials

04/07/2017  Graphene Flagship researchers from AMBER at Trinity College Dublin have fabricated printed transistors consisting entirely of layered materials.

Mentor Graphics Team Receives the Harvey Rosten Award for Thermal Heatsink Optimization Methodology

03/23/2017  Mentor Graphics Corporation today announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics.

Linde Invests Over EUR 110M in China to Strengthen Position as Supplier of Choice for Electronics Manufacturers

03/22/2017  Gases and engineering company The Linde Group, through its electronics gases joint venture in China, Linde LienHwa, is expanding its commitment to China and the Asia Pacific region through investments of over EUR 110 million.




TWITTER


WEBCASTS



3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS