FPDs and TFTs

FPDS AND TFTS ARTICLES



Flat panel display area demand growing rapidly

01/29/2015  Increasing sizes of display panels for TVs, smartphones, mobile PCs and automotive displays are driving increases in total flat-panel-display area demand growth.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

Quantum Materials increasing quantum dot production capacity to meet 4K LCD TV and display demand

01/08/2015  North American quantum dot manufacturer Quantum Materials Corp today announced it is increasing production capacity to 2000 kilograms (2 metric tons) of quantum dots and nanoparticles per annum in Q2 2015.

Global diagnostic display shipments are on the rise

01/07/2015  Global shipments of diagnostic displays are forecast to grow at a 5 percent compound annual growth rate (CAGR), between 2014 and 2018.

Explosive growth forecast for quantum dot LCD TV technology

01/07/2015  LCD TV makers are responding to the challenge of OLED, with quantum dot (QD) technology, curved screens and other innovations.

Solid Doping for Bulk FinFETs

01/05/2015  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

The desktop display market shows signs of life

12/12/2014  Global desktop monitor sell-in revenue rose 7 percent in the third quarter (Q3) of 2014, as average selling prices (ASPs) rose just over 10 percent.

Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor

12/11/2014  Holst Centre, imec and their partner Evonik have realized a general-purpose 8-bit microprocessor, manufactured using complementary thin-film transistors (TFTs) processed at temperatures compatible with plastic foil substrates (250°C).

Mentor Graphics Announces New Verification IP for PCIe 4.0

12/08/2014  Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification by a factor of up to 10X.

Global TV shipments rebound, LCD growth significantly improves

12/02/2014  Third quarter (Q3) TV shipments improved 4 percent, compared to a year ago, and LCD TV shipments alone rose nearly 9 percent.

Applied Materials Introduces New Hardmask Process, Saphira

11/24/2014  A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

Large-area TFT LCD panel shipments and revenues return to growth in 2014

11/20/2014  TFT LCD panel suppliers are rejuvenating their large-area panel business plans this year as the market demand for key applications grows.

A path to brighter images and more efficient LCD displays

11/20/2014  University of Utah engineers have developed a polarizing filter that allows in more light, leading the way for mobile device displays that last much longer on a single battery charge and cameras that can shoot in dim light.

SmartKem announces new TFT fabrication facility to meet market demand for flexible semiconductors

11/20/2014  SmartKem, a supplier of high performance semiconductor materials for the manufacture of truly flexible displays and electronics, has announced the opening of a new thin-film-transistor (TFT) fabrication and testing facility at the company’s Manchester site – doubling the size of the company.

NFC IGZO TFT for Game Cards

11/20/2014  Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

11/19/2014  Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

ORNL thermomagnetic processing method provides path to new materials

11/06/2014  For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

Experts at the Table: Focus on Semiconductor Materials

11/03/2014  The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde Electronics; Kate Wilson of Edwards Vacuum; David Thompson of Applied Materials; and Ed Shober of Air Products and Chemicals.

Air-gaps in Copper Interconnects for Logic

10/31/2014  Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
Interconnects

July 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 2015 (Date and time TBD)

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015