FPDs and TFTs

FPDS AND TFTS ARTICLES



Increasing demand for larger TVs leads to growing large-area TFT LCD shipment revenue

03/06/2015  Large-area TFT LCD display panel suppliers enjoyed moderate growth in shipments, revenue and display area in 2014 as the market demand for key applications grew.

Stronger competition forecast for mobile phone display manufacturers this year

03/06/2015  Global mobile phone display module shipments in 2015 are expected to rise just 4 percent year-over-year to reach two billion units, leading to even stronger competition among mobile phone display manufacturers.

Samsung, LGE and Sony to account for nearly half of all TV display panels shipping in 2015

03/06/2015  Leading global TV brands, Samsung Electronics, LG Electronics and Sony, gained market share and increased their year-over-year shares of LCD TV shipments by an average of 11 percent in 2014, which is higher than the market average.

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

SPIE Advanced Lithography conference concludes

02/27/2015  Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

02/27/2015  In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.

SmartKem collaborates with Centre for Process Innovation to support customer pre-production

02/24/2015  SmartKem has announced an extensive collaboration programme with the Centre for Process Innovation (CPI) for the development of pre-production prototypes featuring the SmartKem unique range of semiconductor inks for the manufacture of ultra flexible thin-film transistors (TFT).

SPIE plenary takes in photonics, 3DICs, connected devices

02/23/2015  Speakers at the plenary session of the SPIE Advanced Lithography conference covered a wide variety of topics, from photonics to 3D chips to the Internet of Things, on Monday morning, February 23, in San Jose, Calif.

Complexity is the Theme at Lithography Conference

02/23/2015  Nikon and KLA-Tencor put on separate conferences in San Jose, Calif., on Sunday, February 22, tackling issues in advanced optical lithography. The overarching theme in both sessions was the increased complexity of lithography as it approaches the 10-nanometer and 7nm process nodes.

Smartphone display manufacturers facing pressure to further reduce prices in 2015

02/20/2015  Even as smartphone panel resolution continues to rise, and as display sizes continue to grow, panel manufacturers are facing pressure to reduce prices.

Applied's merger with TEL: Still a work in progress

02/11/2015  Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Quantum Materials begins shipping cadmium-free red and green quantum dots

02/05/2015  Rapidly growing North American quantum dot manufacturer Quantum Materials Corp today announced it has begun shipping Cadmium-free red and green quantum dots in evaluation and production quantities to select consumer electronics manufacturers.

Sapphire industry: What we could expect after Apple’s withdrawal last September

02/05/2015  The announcement by GTAT and Apple in late 2013 of a more than $1 billion combined investment to set up the largest sapphire crystal growth facility in the world had raised hopes that adoption of sapphire in smartphones would rapidly reach a massive scale, with Apple setting up the pace and forcing its competitor to follow suit.

SEMICON Show Highlights Chip Manufacturing in South Korea

02/04/2015  The SEMICON Korea conference and exhibition opens Wednesday in Seoul for a three-day run. The show highlights the importance of semiconductor manufacturing in South Korea, home to two of the biggest memory chip makers in the world, Samsung Electronics and SK Hynix.

Flat panel display area demand growing rapidly

01/29/2015  Increasing sizes of display panels for TVs, smartphones, mobile PCs and automotive displays are driving increases in total flat-panel-display area demand growth.

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

01/28/2015  Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the issue of improving communications between the Old World and the New World.

Quantum Materials increasing quantum dot production capacity to meet 4K LCD TV and display demand

01/08/2015  North American quantum dot manufacturer Quantum Materials Corp today announced it is increasing production capacity to 2000 kilograms (2 metric tons) of quantum dots and nanoparticles per annum in Q2 2015.




TWITTER


WEBCASTS



Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
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TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS