FPDs and TFTs

FPDS AND TFTS ARTICLES



ORNL thermomagnetic processing method provides path to new materials

11/06/2014  For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

New 3D display technology promises greater energy efficiency

10/23/2014  LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

In rapidly changing display industry, metal oxide TFT backplanes are promising

08/26/2014  MarketResearchReports.Biz released a new market research report this week entitled "Metal Oxide TFT Backplanes For Displays 2014-2024: Technologies, Forecasts, Players."

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

06/23/2014  Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Dow Corning releases new terminal sealant for manufacturing TFT LCD displays

02/25/2014  Dow Corning today introduced new Dow Corning EA-2000 Silicone Adhesive, a high-performance terminal sealant for faster, more cost-effective manufacturing of thin-film transistor (TFT) LCD displays.

CPI presents ultra-flexible OTFT device array suitable for foldable AMOLED displays of the future

01/23/2014  The work undertaken demonstrates progress towards optimum Organic Semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.

Applied Materials launches new metal oxide display tech

10/16/2013  Applied Materials, Inc. today announced new technology systems for manufacturing large size and ultra-high definition (UHD) LCD and OLED displays that meet the demand for greater screen performance, clarity, color and brightness.

AMOLED compensation circuit patent analysis

09/10/2013  OLED, a self-light-emitting diode, has been touted as the next big thing in display technology for its exceptional properties including no need for a backlight, wide viewing angle, quick responding speed and low current consumption.

Price erosion accelerates for LCD TV open call panels in Q3

08/13/2013 

Weak demand and rising production in China, combined with efforts by South Korean suppliers to cut manufacturing charges in order to stimulate demand, is resulting in pronounced price reductions in the third quarter for popular sizes of liquid-crystal display television (LCD TV) panels.

Weak increase in TV demand spurs larger-than-expected glut of LCD panels in Q3

07/26/2013 

In a season when their sales should be rising sharply, suppliers of large-sized liquid-crystal (LCD) panels instead are encountering weak demand growth in the third quarter, exacerbating the glut already plaguing the market.

High-resolution tablet panels debut with strong shipments in 2013

07/19/2013 

Making a stellar debut, high-resolution liquid-crystal display (LCD) panels featuring resolutions of 300 pixels per inch (ppi) or more are appearing in media tablets for the first time this year, with shipments set to approach 13 million units.

LCD TV panel inventory rises to excess level, spurring price drops

07/19/2013 

Global inventory of liquid-crystal display television (LCD TV) panels is set to rise to its highest level in 19 months in August, with the elevated stockpiles expected to contribute to a decline in prices in the second half of the year.

BOE Technology Group and Applied Materials to deliver leading-edge display technologies

07/03/2013 

BOE Technology Group announced that it has placed significant orders for advanced Gen 8.5 and Gen 5.5 display production equipment from Applied Materials for use in multiple facilities.

Displaybank releases new industry analysis of glass slimming market

06/18/2013 

The glass slimming market topped $600 million in value in 2012 and is forecast to continuously grow to surpass $1 billion in 2014, according to a new report released by Displaybank.

ISORG and Plastic Logic co-develop the world’s first image sensor on plastic

06/11/2013 

ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element.

Shipments of large-sized LCD display panels outpace production in March

05/29/2013 

Shipments in March of large-sized liquid crystal displays (LCD) exceeded total production when measured in terms of area, the result of a deliberate move by panel manufacturers to digest accumulated inventory.

Patent analysis: Flexible OLED structures

05/28/2013 

A new report from IHS Displaybank analyzes the scope of the flexible OLED patents issued.

AMOLED displays to have major influence on innovation in the cloud computer era

05/22/2013 

During the keynote speech, Kim said that the future of displays will change considerably, with special attention to be given for the virtually infinite number of imaging possibilities in AMOLED (Active Matrix Organic Light Emitting Diode) display technology.

TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market

05/13/2013 

TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



System Scaling and Integration Platforms for Mobile Devices and IoT

September 9, 2015 at 8:00 p.m. ET

In this presentation, recent developments in interconnects and packaging technologies that will enable mobile devices, and IoT will be discussed. Some of these packaging technologies include high density fan-out wafer level packaging, passive and active interposers, high throughput chip-on-wafer bonding, as well as wafer level chip scale packaging for MEMS and sensors.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015