U.S. Patents Awarded to Inventors in Oregon (Aug. 20)
August 20, 2014
ALEXANDRIA, Va., Aug. 20 -- The following federal patents were awarded to inventors in Oregon. *** Intel Assigned Patent for Framework for Coordinated Multipoint Transmission Based on Multicell MAC/RRC Design ALEXANDRIA, Va., Aug. 19 -- Intel, Santa Clara, California, has been assigned a patent (8,804,593) developed by five co-inventors for a "framework for coordinated multipoint transmission based on a multicell MAC/RRC design." The co-inventors are Kamran Etemad, Potomac, Maryland, Alexei Davydov, Nizhny Novgorod, Russia, Xiangying Yang, Portland, Oregon, Yuan Zhu, Beijing, and Yujian Zhang, Beijing. The patent application was filed on June 22, 2011 (13/165,946). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,804,593.PN.&OS=PN/8,804,593&RS=PN/8,804,593 Written by Sudarshan Harpal; edited by Jaya Anand.

August 20, 2014
ALEXANDRIA, Va., Aug. 20 -- The trademark LED LIGHTING SOLUTIONS LEDP RELIGHTING AMERICA FOR A BRIGHTER FUTURE (Reg. No. 4584603) was issued on Aug. 12 by the USPTO.

MediaTek Launches R&D Center in Bengaluru
August 20, 2014
- MediaTek to invest over US$200million into India driving robust expansion plans for the Super-mid market  MediaTek today announced the establishment of a new Research & Development (R&D) facility in Bengaluru, India. The new R&D facility will focus on developing innovative and inclusive solutions for wireless communications and establish MediaTek's presence in other core segments such as connectivity and home entertainment devices, further enhancing the company's leadership in the Super-mid market.

ViewSonic Launches 178 Degrees Display Range
August 20, 2014
SuperClear wide-viewing angle technology in ViewSonic's New Vivid Colour Display range of Products ViewSonic introduced its exclusively SuperClear Image Enhancement Technology that delivers the best color performance and extends display viewing angles to 178 degrees both horizontally and vertically. The new VX56 series includes the 24" VX2456Sml and 27" VX2756Sml that brings wide viewing angles enable users to view from any angle with consistent levels of brightness and without any colour distortion or decay. Integrated with Mobile High-Definition Link (MHL), the VX56 series enables digital content from mobile devices to be viewed in stunning Full HD resolution on the larger screen and and enlarge the enjoyment.

LG Electronics launches new 55-inch Curved OLED TV in US
August 20, 2014
HIGHLIGHT: LG Electronics USA, Inc., the North American subsidiary of LG Electronics, Inc., has launched new 55-inch Curved OLED TV in US.

-Mentor Graphics Announces 25th Annual PCB Technology Leadership Awards Program
August 20, 2014
ENP Newswire - 20 August 2014Release date- 19082014 - WILSONVILLE, Ore-Mentor Graphics Corporation (Nasdaq: MENT) today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Infineon nears USD2bn acquisition of US semiconductor firm - report
August 20, 2014
MANAVIGATOR-August 20, 2014-Infineon nears USD2bn acquisition of US semiconductor firm - report 20 August 2014 - German chipmaker Infineon Technologies AG (OTCMKTS:IFNNY) is close to striking a USD2bn (EUR1.5bn) deal for the purchase of an unnamed semiconductor firm based in the US, sources familiar with the matter told Bloomberg today.

Global & China IC Advanced Packaging Equipment Industry Worth USD4.3 Billion By 2015
August 20, 2014
August 20, 2014Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 mainly deals with the followings:Overview of semiconductor industryStatus quo of memory and wafer foundry industryDownstream market of semiconductor industryTrend in emerging advanced packaging technologyPackaging equipment industry analysis and ranking15 major advanced packaging equipment vendorsComplete report is available @ http://www.rnrmarketresearch.com/global-and-china-ic-advanced-packaging-equipment-industry-report-2013-2014-market-report.html .

STATS ChipPAC's fcCuBE Technology Surpasses 100 Million Unit Milestone
August 20, 2014
Singapore, Aug. 20 -- STATS ChipPAC Ltd., a leading provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the Company's fcCuBE(R) technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

US Patent granted to Mentor Graphics Corporation (Oregon) on August 19 titled as "Speeding up defect diagnosis techniques"
August 20, 2014
United States Patent and Trademark Office has granted patent no. 8,812,922, on August 19, 2014, to Mentor Graphics Corporation (Oregon), titled as "Speeding up defect diagnosis techniques"


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