Headlines


Application of electrical discharge machining for machining of semi-conductor materials
September 22, 2014
FULL TEXT KEYWORDS EDM; Experiment; Boron carbide; MRR; Surface-roughness; DOE. Abstract. In recent years, the research work in material science has encouraged the development of advanced ceramic materials. Boron carbide has many applications in industries for manufacturing of products such as water jet nozzle and abrasive particles. In this paper several experimental tests have been conducted to study the effect of process parameters in machining of boron carbide "B4C" by using the electrical discharge machining process "EDM". The effect of voltage variation, current intensity, on-pulse and off-pulse durations on surface roughness (Ra) and Material Removal Rate (MRR) were studied simultaneously by utilizing the Design Of Experiment (DOE) technique. This research work indicated that the "EDM" process can be used to machine semi-conductor materials such as \B4C" successfully. In addition, it was found that, the quantity of material removal rate and the quality of workpart surface roughness could be affected by the variations of these process parameters. Finally, the experimental results obtained were compared with the published results reported by other scientist, and a good agreement was found between them. © 2014 Sharif University of Technology. All rights reserved.

AT&S, Soundchip, And STMicroelectronics Craft Innovative Bionic Ear
September 22, 2014
Monday, September 22, 2014: AT&S, a leader in advanced packaging solutions, Soundchip SA, a Swiss-based innovator in wearable sound technology, and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced their collaboration in innovating a bionic hearing module that, when installed into a personal audio device, delivers an amazing wearable sound experience controlled at the ear by the wearer and software intelligence. Personal audio devices, like an MP3 player or smartphone, equipped with the bionic hearing module, provide wearers with the ability to electronically "open" and "close" their ears to ambient sound conditions, or even to augment ambient sound with programmed audio from a connected smart device. This capability can fully protect wearers from noise in situations where the ambient sound is too loud, or to open the ear for natural conversation with others, without having to remove the audio device, suffer from the discomfort of occlusion, or worse, the pain of loud noise.

DHL Reaffirms Long-term Commitment to Vietnam with Its Biggest Investment to Date
September 22, 2014
 DHL Express, the world's leading express service provider, has announced the opening of its new DHL Country Office & South Service Center inVietnam at 6 Thang Long Street, Tan Binh District,Ho Chi Minh City. The investment of over USD 10 million makes it the logistics giant's biggest to date inVietnam, and reaffirms the company's long-term commitment to the market. < http://photos.prnasia.com/prnh/20140922/8521405449> DHL's new USD10 million facility is the company's largest investment to date in Vietnam Jerry Hsu, CEO, DHL Express Asia Pacific, said, "Vietnam as a market has done exceedingly well and continues to show great promise. Industry data shows that its exports continued to surge in the first half of this year[1]. With ourUSD10 million investment, we are strengthening DHL Express' infrastructure and capabilities in this market to continue supporting the healthy appetite for trade. We want to help customers here move shipments faster and more efficiently, and we want to ensure we offer second-to-none service quality."

USPTO Published Patent application of MENTOR GRAPHICS CORPORATION titled as "Modeling Content-Addressable Memory For Emulation"
September 22, 2014
United States Patent and Trademark Office has received an application no. 20140278329, published on September 18, 2014, by MENTOR GRAPHICS CORPORATION, titled as "Modeling Content-Addressable Memory For Emulation" for the registration of patent.

Point-And-Shoots Beef Up Sensors At Photokina Show
September 22, 2014
The target audience appears to be professional photographers looking for lighter gear to carry around on personal outings or in rugged terrain, and for advanced amateurs and semi-pros looking for a quick-and-dirty backup to their DSLRs. The year's target was Sony's popular RX100 Mark III, which drew competitive challenges from Fujifilm, Canon and Panasonic to name three.

Cree Receives Lighting for Tomorrow Award
September 22, 2014
Cree reported that it has won the 2014 Lighting for Tomorrow Award for Solid State Lighting design in the directional lighting category with the Mini CXA HD Punch.

Cree Receives Lighting for Tomorrow Award
September 22, 2014
Cree reported that it has won the 2014 Lighting for Tomorrow Award for Solid State Lighting design in the directional lighting category with the Mini CXA HD Punch.

Shanghai Belling Held Hua Hong Semiconductor to List
September 22, 2014
HONG KONG, September 22, SinoCast -- Shanghai Belling Co., Ltd. (SHSE: 600171) revealed that Hua Hong Semiconductor Ltd. held by wholly owned Hylintek Ltd. has submitted listing application to the Hong Kong bourse and gone through listing hearing on September 18. Currently, Hua Hong Semiconductor is 7.95% indirectly held by Shanghai Belling, representing 64.0101 million shares. Changing stock price of Hua Hong Semiconductor after listing will affect fair value of shares held by Shanghai Belling in the company.

WIPO PUBLISHES PATENT OF MENTOR GRAPHICS CORPORATION TITLED AS "HARDWARE SIMULATION CONTROLLER, SYSTEM AND METHOD FOR FUNCTIONAL VERIFICATION"
September 22, 2014
Publication No. WO/2014/146073 was published on September 18 by WIPO. Title of the invention: HARDWARE SIMULATION CONTROLLER, SYSTEM AND METHOD FOR FUNCTIONAL VERIFICATION

STATS ChipPAC Announces Resignation of Chief Operating Officer
September 21, 2014
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that Mr. Wan Choong Hoe has resigned from his position as Executive Vice President and Chief Operating Officer effective 30 September 2014 to pursue personal interests.


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