Headlines


Fairchild Semiconductor to Close Some Manufacturing Facilities
August 28, 2014
Fairchild Semiconductor reported that it will eliminate its internal five-inch and significantly reduce six-inch wafer fabrication lines, resulting in the closure of its manufacturing and assembly facilities in West Jordan, Utah, and Penang, Malaysia, as well as the remaining five-inch wafer fabrication lines in Bucheon, South Korea.

Au Optronics to Participate at International Touch Panel and Optical Film Exhibition
August 28, 2014
Au Optronics Corp. is presenting at International Touch Panel and Optical Film Exhibition 2014, held in Taipei Nangang Exhibition Hall, through August 29 .

RnR Market Research Updates on Smart Glass and Flexible Display Industry
August 28, 2014
RnRMarketResearch.com now offers 2020 forecast reports for smart glass market and flexible display industry in its store. According to a company release, the analysis shows that the total flexible display market is projected to reach the market revenue worth $3.89 billion by 2020. The value of Smart glass market was worth $1581.4 Million in 2013, and is expected to reach $5814 Million by 2020, at an estimated CAGR of 20 percent from 2014 to 2020. Smart Glass Market by Technology (Electrochromics, SPD, Liquid Crystal, Microblinds, Thermographic and Photochromics), Application (Architectural, Transportation, Solar power generation, Electronics and others), and by Geography - Global Forecast to 2014 - 2020 research report expects that in coming years, healthcare sector will adopt smart glass products in order to achieve healthy and natural ambience in cost efficient manner.

Ultratech Announces Participation in September Conferences
August 27, 2014
Ultratech, Inc. (Nasdaq: UTEK) a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that it will present at the following conferences:

Intel Announces New Packaging and Test Technologies for Foundry Customers; New Technologies to Improve Time to Market and Reduce Costs
August 27, 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

Jupiter Systems Introduces the Fusion Catalyst(TM) 4500 Display Wall Processor, Newest Member of Jupiter's Award-Winning Family of Display Wall Processors; Combines the latest graphics processing technology, the ideal solution for small- and mid-size walls; Come Visit Us at Image Design technology (IDT) Stand #D46
August 27, 2014
Jupiter Systems, the leading worldwide supplier of collaborative visualization solutions for video walls, PCs, and mobile devices, today announced the introduction of Fusion Catalyst(TM) 4500, the newest member of Jupiter's award-winning family of best-in-class display wall processors. "Fusion Catalyst 4500 ushers in a new era of performance and flexibility for small- to mid-sized display wall projects," said Brady O. Bruce, Vice President, Marketing and Strategic Alliances at Jupiter Systems. "Fusion Catalyst 4500 defines flexibility, supporting almost any design specification, whether for a standalone control room or an enterprise-wide collaborative visualization deployment across multiple hardware platforms."

Renesas Electronics Announces New 40 nm RH850/C1x Series of Microcontrollers for HEV/EV Motor Control Applications; Integrated R/D Converter(s) and Enhanced Motor Control Peripherals Enable Higher Efficiency in Single or Dual Motor Control Systems;
August 27, 2014
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the new RH850/C1x Series of 32-bit microcontrollers (MCUs), designed for motor control in hybrid electric vehicles (HEVs) and electric vehicles (EVs). Based on Renesas Electronics' 40-nanometer (nm) process, the RH850/C1x Series features the RH850/C1H and RH850/C1M MCUs, which enable embedded designers to enhance efficiency, reduce system costs, and achieve higher safety levels for HEV/EV motor control systems. "Awareness of the vehicle's environmental footprint is increasing, and HEV/EV designers are seeking ways to deliver even better performance, which requires new and more precise motor control systems," said Amrit Vivekanand, vice president of automotive, Renesas Electronics America Inc. "The Renesas RH850/C1x MCU series integrates large flash memory capacity, robust motor control peripherals, and single/dual motor control options needed to support the required fine-grained motor control and functional safety for next-generation HEVs and EVs."

Freescale Cuts the Cords with Introduction of Programmable Wireless Charging Solutions; Highly flexible offerings enable exceptional design freedom and differentiation for automotive and consumer deployments
August 27, 2014
Freescale Semiconductor today introduced a range of fully programmable wireless charging ICs and reference designs targeting automotive and consumer applications. The new Wireless Power Consortium (WPC) Qi-certified transmit controller ICs and reference designs are fully qualified and available now. As feature-rich, power-hungry mobile devices rapidly proliferate, the need to charge anywhere grows imperative. The U.S. Census Bureau estimates the average American's daily work commute time to be about 50 minutes, and more consumers are bringing their mobile lives into the car expecting the same options as the home for charging and connectivity - thereby fueling demand for in-vehicle wireless charging. Meanwhile, new wireless charging system deployments in offices, hotels, airports and other public spaces are driving demand for highly flexible solutions that allow for innovative, highly customizable implementations. Freescale is addressing these needs by providing differentiated wireless charging solutions to meet the needs of both automotive and consumer applications.

MACOM to Showcase Industry Leading 12G-SDI Portfolio for 4K Video at Booth 8.C01 (Hall 8) at IBC 2014 in Amsterdam, Netherlands; 12G-SDI Chipset allows for 4K Video at 60 Frames-Per-Second on a single link
August 27, 2014
M/A-COM Technology Solutions Inc. (MACOM), a leading supplier of semiconductor solutions for broadcast video infrastructure, today announced that it will host a series of live demonstrations highlighting its newest 12G-SDI chipset in booth 8.C01 (Hall 8) during IBC 2014 from September 12-16, 2014 at the RAI Amsterdam in The Netherlands. With the proliferation of 4K capable displays, content providers are looking to maximize consumer's visual experience by providing higher resolution 4K content. This increase in resolution means that more data needs to be transmitted. MACOM has dramatically improved the communication of 4K content with its introduction of 12G-SDI. This innovation is a material improvement over multiple 3G SDI streams, enabling a user friendly; lower cost, lower power, and higher density solution that will allow stunning content in 4K resolution and 60 frames per second. 12G-SDI is the latest data rate in the evolution of the SDI standard and is required in order to support 4K video resolutions at 60 frames per second over a single coaxial cable, or optical fiber.

Videocon unveils 4K ultra high definition smart TV
August 27, 2014
Mumbai, Aug 27 (IBNS) Consumer electronics brand Videocon unveiled India's most featured-packed 4K UHD LED TV on Wednesday. With the new range of 4K UHD LED Smart TVs, Videocon aims to increase its market share in the Flat Panel Display (FPD) segment to 20 percent from the current 16 percent. The innovative features like 3D Gaming and Face Recognition, Videocon 4K UHD LED is here to define the TV viewing experience. With 8.3 Megapixels, the LED displays four times more pixels than a conventional Full HD, and 8 times more than any HD LED. Its ability to connect with the Smart phones N Screen interface allows one to run the devices content on the LED and vice-versa.


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