Headlines


LG unveils Moto 360-like circular Android Wear smartwatch
August 29, 2014
Srinagar, Aug. 29 -- Following the June release of its Android Wear G Watch, LG has announced a new smartwatch - the LG G Watch R. The LG G Watch R is said to be the world's first watch-style wearable device to feature a circular Plastic OLED (P-OLED) display. It utilises 100 per cent of its watch face, says the company.

Image Sensor Market Worth $15.77 Billion by 2020
August 28, 2014
According to a new market research report "Image Sensor Market by Technology (CMOS, CCD), Spectrum, Array, Scanning Method, Application (Consumer Electronics, Healthcare, Industrial, Security, Automotive, Aerospace, and Defense) and by Geography - Analysis and Forecast (2013 - 2020)", published by MarketsandMarkets, Image Sensor Market is expected to reach $15.77 Billion by 2020 growing at a CAGR of 8.06% from 2014 to 2020. Browse 61 market data Tables with 83 Figures spread through 191 Pages and in-depth TOC on "Image Sensor Market".

SMIC Announces Unaudited 2014 Interim Results
August 28, 2014
 Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) one of the leading semiconductor foundries in the world, announces the unaudited interim results of operations of the Company and its subsidiaries for the six months endedJune 30, 2014.

National Research University of Electronic Technology (MIET) and Synopsys Enable Large-Scale Use of Synopsys' Galaxy Custom Designer Solution in an Educational Environment
August 28, 2014
-- Joint Master's Program Trains Analog/Mixed-Signal Engineers for Russia's Growing High-tech Industry National Research University of Electronic Technology (MIET)and Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the addition of new courses to the Synopsys-MIET two-year master's program that will enable large-scale use of Synopsys' Galaxy Custom Designer® in an educational environment. With these additional courses, Synopsys-MIET master's program students will enhance their knowledge and skills to become highly qualified specialists ready to address the rapidly growing demand for analog/mixed-signal and custom chip design in Russia.

PowerFilm, Inc PowerFilm Announces Military Contracts
August 28, 2014


John Deere updates 5M model of Utility Tractor lineup
August 28, 2014
HIGHLIGHT: Deere & Company, or John Deere, a manufacturer of agricultural, construction and forestry machinery, has updated its 5M model of Utility Tractors.

-Eyelit Releases a New Recipe Management System (RMS) Module to Improve Quality and Lower Manufacturing Costs
August 28, 2014
ENP Newswire - 28 August 2014Release date- 27082014 - TORONTO - Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, life sciences, medical device, semiconductor, and photovoltaic (solar) industries, announced today the general availability of the new Eyelit Manufacturing RMS module.

US Contract Notice: Department of the Army Issues Solicitation for "70--INTENT TO SOLE SOURCE APPLE EQUIPMENT AND SOFTWARE APPLICATIONS. APPLE DOES NOT SELL SOFTWARE THROUGH DISTRIBUTORS"
August 28, 2014
Department of the Army, National Guard Bureau Officer has issued requirement for "70--INTENT TO SOLE SOURCE APPLE EQUIPMENT AND SOFTWARE APPLICATIONS. APPLE DOES NOT SELL SOFTWARE THROUGH DISTRIBUTORS."

Intel Announces New Packaging and Test Technologies for Foundry Customers
August 28, 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

US judge rejects Apple bid to block sales of Samsung phones
August 28, 2014
India, Aug. 28 -- A US federal judge has rejected Apple Inc's attempts for a permanent injunction against smartphones manufactured by Samsung Electronics Co Ltd that copied features of the iPhone.


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