Headlines


United Kingdom Intellectual Property Office Publishes Application for Trademark "UROR" to Aurora for Various Goods
April 16, 2014
South Wales, April 16 -- Aurora Ltd., St. Albans, has filed the trademark "UROR" on Jan. 3, for various goods. The trademark application (journal number: 2014/015) was published on April 11. The description of the mark registered is: "Thermal management systems for electronic and electrical equipment; components and parts for the cooling of electronic and electrical equipment, especially heat sinks; thermal management systems for lighting equipment namely heat sinks; components and parts for the cooling of lighting equipment, especially heat sinks; far infrared heat dissipation devices namely heat sinks; ceramic-based printed circuit boards; transformers, including electronic transformers and transformers for lighting, including display, cabinet and track lighting; ballasts, including electronic ballasts; LED drivers; dimmers including LED mixing dimmers, dimming control systems, dimming switches; cables, plugs, sockets, leads, flexes, wires and connectors for lighting and lamps; constant current LED drivers; track light end connectors, couplers and live end connectors; self monitoring transformers; premium transformers; toroidal transformers, dimmable transformers; lighting distribution blocks; tracks and track kits for track lighting, including low voltage and mains voltage track lighting; sockets for lighting and lamps; ceramic-based printed circuit boards for use in lighting equipment; parts and fittings for all of the aforesaid goods. Lighting apparatus, lamps and instruments; mains voltage LED lamps; low voltage LED lamps; low voltage T5 and T8 lamps; mains voltage T5 and T8 lamps; mains voltage T5 and T8 LED lamps; mains voltage LED light modules; low voltage LED light modules; low energy electrical lamps; low energy lighting fixtures; energy saving lamps; mains cold cathode fluorescent lamps; low voltage compact fluorescent lamps; mains voltage compact fluorescent lamps; mains voltage insulation covered fire rated downlights; low voltage insulation covered fire rated downlights; downlight covers; fire rated downlight covers; integrated LED downlights; adjustable LED downlights; integrated downlight fittings; integrated downlight fittings including a housing, LED lamp(s) and LED driver(s); adjustable LED spotlights; low voltage dimmable LED lighting pack; fire-rated lighting fixtures, fire-rated light fittings, fire-rated luminaires, fire-rated downlights; mains voltage compact fluorescent lighting pack; mains voltage fluorescent ceiling lights; low voltage fluorescent ceiling lights; mains voltage fluorescent wall light; mains voltage recessed compact fluorescent downlights; mains voltage recessed LED light panels; low voltage recessed LED light panels; mains voltage suspended LED light panels; low voltage suspended LED light panels; LED multiples; display and cabinet lighting apparatus and instruments; track lighting, including low voltage and mains voltage track lighting; track lighting end caps, wall/ceiling mounting kits and ceiling suspension kits; lamps, including dichroic, halogen and dichroic halogen lamps, and lamps for low voltage and mains voltage track lighting; downlights and downlight kits, including low and mains voltage downlights and downlight kits; dichroic lamps, including low and mains voltage dichroic lamps; low voltage and mains voltage dichroic downlights; lamp holders; heat exchangers for the cooling of electronic and electrical lighting equipment; components and parts for the cooling of electronic and electrical lighting equipment, especially heat exchangers; parts and fittings for all of the aforesaid goods; transformers for lighting; transformers for lighting; transformers for lighting apparatus and instruments, dimmable transformers and transformers for low voltage lighting and low voltage track lighting."

Vivado Design Suite 2014.1 Increases Productivity with Automation of UltraFast Design Methodology and OpenCL Hardware Acceleration
April 16, 2014
New release delivers faster runtimes, improved QoR, OpenCL kernel support and automates UltraFast design methodology best practices for 7 series and UltraScale All Programmable devices Xilinx, Inc. (NASDAQ: XLNX) today released the Vivado(R) Design Suite 2014.1, the industry's only SoC-strength development environment. This release extends the automation of the UltraFast(TM) design methodology and delivers an average of 25 percent faster runtimes and 5 percent improvement in performance across all devices. Also new to 2014.1 is hardware acceleration of OpenCL kernels, within Vivado High-Level Synthesis (HLS). With over 2,500 customers trained on the UltraFast design methodology and 30,000 views of the UltraFast design methodology video tutorial, Xilinx continues to raise awareness and adoption of the methodology developed to increase designer productivity. By leveraging the UltraFast design methodology recommendations design teams are achieving design closure in weeks versus months spent on similar projects without this methodology.

Yahoo reports anaemic growth
April 16, 2014
Yahoo again posted anaemic quarterly revenue growth as the Internet company's advertising business continues to lag its rivals, nearly two years into CEO Marissa Mayer's comeback effort. Mayer told analysts yesterday that new mobile and advertising initiatives were gaining momentum, positioning the company for a period of stable but modest growth. Revenue from its core display advertising business inched 2% higher in the first quarter, reversing several consecutive quarters of declines. But the company forecast second-quarter revenue, excluding fees paid to partner Web sites, of $1.06 billion to $1.1 billion.

Mentor Graphics Assigned Patent
April 16, 2014
ALEXANDRIA, Va., April 16 -- Mentor Graphics, Wilsonville, Ore., has been assigned a patent (8,700,377) developed by Pascal Bolcato, Echirolles, France, and Gerard Eichenmueller, Eybens, France, for an "accelerated analog and/or RF simulation."

(MOCVD) Metal Organic Chemical Vapor Deposition Equipment Market 2014-2018
April 16, 2014
April 16, 2014ReportsnReports.com offers "Global Metal Organic Chemical Vapor Deposition (MOCVD) Equipment Market 2014-2018" research report in its store. MOCVD equipment is a tool used by semiconductor manufacturers for depositing a very thin layer of compound semiconductor material onto a semiconductor wafer. It is predominantly used in the manufacturing process of III-V compound semiconductors, especially for those that use GaN. These semiconductors are the most important base material for manufacturing LEDs, lasers, power transistors, and photovoltaic cells. Thus, MOCVD equipment is used for manufacturing complex semiconductor multilayer structures that are used in electronic and optoelectronic components. This not only increases the performance of the semiconductor device, but also delivers higher efficiency and switching speed.

Studio One Media and ON Semiconductor Set to Jointly Develop Audio Solutions
April 16, 2014
Studio One Media, Inc. has entered into an agreement with ON Semiconductor to develop integrated circuits (ICs) utilizing Studio One's AfterMaster audio technology and ON Semiconductor's DSP product development expertise.

Nordic Semiconductor Releases Bluetooth Low Energy Protocol Stack for nRF51 Series
April 16, 2014
Ultralow power (ULP) RF specialist Nordic Semiconductor ASA has announced S110 SoftDevice v7.0, the next major release of its Bluetooth low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT and ANT/Bluetooth low energy multiprotocol SoCs.

Formax Unveils 2 New Cut-True Cutters
April 16, 2014
Formax announced the addition of two new Cut-True guillotine cutters to its line of Digital Print & Finishing Solutions. The Company said standard features include a hardened steel blade, LED Cutting Line for accuracy, user-friendly controls, an all-metal stand with storage shelf, blade changing safety tool, and a variety of safety features.

Design Automation Conference: Atrenta, Cadence and Jasper Sponsoring Exhibit Floor Passes along with the I Love DAC Campaign
April 16, 2014
Offering free exhibit floor entry to Design Automation Conference (DAC), a conference devoted to the design and automation of electronic systems, Atrenta, Cadence and Jasper Design Automation are sponsoring three-day passes through the sixth annual "I love DAC" campaign. According to a release, the offers outstanding training, education, exhibits and networking opportunities for designers, researchers, tool developers and vendors. The 51st DAC will be held at Moscone Center in San Francisco, Calif. from June 1- 5.

-Fujitsu Develops Platform Technology that Speeds Development of On-Site Information Exchange Services
April 16, 2014
ENP Newswire - 16 April 2014Release date- 15042014 - Kawasaki, Japan - Fujitsu Laboratories Ltd. today announced that it has developed platform technology that speeds delivery of information exchange services, such as for work collaboration or screen sharing, using devices or equipment at a given location.Recently there has been growing interest in services that provide necessary information or applications to people who have gathered for activities at a particular place. Up until now, it was necessary to conduct various prior set-up processes or complicated programming in order to provide services that link people to people via their devices or people's devices to equipment at a given location. Now Fujitsu Laboratories has developed technology whereby services can be provided quickly to link people or equipment, without the need to register members in advance or install any drivers.


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