Government to Invest 10 Billion US $ in the Chip Manufacturing Facilities Coming up in Gujarat and Uttar Pradesh
March 28, 2015
Ministry of Communications & Information Technology, The Government of India has issued following news release: Infrastructure for chip manufacturing and designing will be considerably strengthened in India to cater to the growing domestic demand and to cut down the imports in the next few years. Addressing the first Indian Electronics Expo organized by Electronics and Computer Software Export Promotion Council (ESC) in New Delhi yesterday, Secretary, Department of Electronics and Information Technology, Government of India Shri RS Sharma, revealed that the government would be investing US$ 10 billion in the chip manufacturing facilities coming up in Gujarat and UP, where a consortium of manufacturing firms have come up to set up the production bases. India would also be investing US$ 400 million in developing an Indian version of micro-processor. These are part of the initiatives that are under way to create an eco-system that lays focus on high ended innovation. A dedicated fund, known as Electronics Development Fund had been created to leverage the use of venture capital funds to promote more start-ups in the country, he added.

Activu to Exhibit Intelligent Video Wall Visualization and Collaboration Solutions for Control Rooms and Beyond at the ENTELEC Spring Conference & Exposition
March 28, 2015
(PRWeb) - Activu Corporation will demonstrate its proven approach to control room video wall visualization, event-based visualization and collaboration solutions for mission critical oil & gas and energy operations in Booth 851 at the Annual ENTELEC Spring Conference. The world's leading conference for communications and control technologies in the energy industries, the ENTELEC Spring Conference will take place April 7-9 at the George R. Brown Convention Center in Houston, Texas.

DesignCon 2015 Selects Best Paper Award Winners
March 28, 2015
DesignCon reported the winners of the Best Paper Awards from the blockbuster 2015 program. Recognizing contributions to the educational goals of the DesignCon program, DesignCon noted that the awards serve to acknowledge the authors as leading practitioners in semiconductor and electronic design. DesignCon's 20th anniversary event was held January 27-30 in Santa Clara, CA.

Yota Phone 2 to launch Chinese version in Q2
March 28, 2015
Yota Devices, the developer of YotaPhone, the world's first dual screen smartphone with an always on e-ink display, announced a joint venture with domestic firm JieLan Ltd to promote, sell and provide customer service for YotaPhone in China on Saturday in Hainan province, during the ongoing 2015 Boao Forum for Asia. Photo taken on March 28, 2015 shows a Yota Phone 2 is displayed in a pressmeeting at the Boao Forum for AsiaAnnual Conference held in Hainan province. [Gao Yuan/chinadaily.com.cn]

LG G Flex2 Review: Curved Phone Offers More and Less of a Good Thing
March 27, 2015
NEW YORK ( TheStreet ) -- This is LG's second attempt at a curved-screen smartphone. This new LG G Flex2  keeps all the good things from the original, and has taken the somewhat unusual design to the next level. LG introduced its first G Flex curved phone back in the fall of 2013. Unlike the side-to-side curved  phone rushed to market by rival Samsung (and, thankfully, quickly forgotten), the LG's screen curved from top-to-bottom. We liked that first generation handset and the only complaints we had were that while the LG screen flexed a very small amount, the phone was otherwise very similar to the G2 -- the company's flagship design at that time.

Technical Coverage of Semiconductors Equities -- NVIDIA, Microchip Technology, Trina Solar, Lattice Semiconductor, and Ascent Solar Technologies
March 27, 2015
Editor Note: For more information about this release, please scroll to bottom. Investor-Edge has initiated coverage on the following equities: NVIDIA Corporation (NASDAQ: NVDA), Microchip Technology Inc. (NASDAQ: MCHP), Trina Solar Ltd (NYSE: TSL), Lattice Semiconductor Corporation (NASDAQ: LSCC), and Ascent Solar Technologies Inc. (NASDAQ: ASTI). Free research report on NVIDIA can be accessed athttp://get.Investor-Edge.com/pdf/?c=NVIDIA&d=27-Mar-2015&s=NVDA. The US markets on Thursday, March 26, 2015, ended on a negative note as the Dow Jones Industrial Average finished at 17,678.23, down 0.23% and the NASDAQ Composite closed at 4,863.36, down 0.27%. The S&P 500 finished the session 0.24% lower at 2,056.15. During the trading session, eight out of ten sectors finished on a lower note. The S&P 500 Information Technology Sector Index ended the day at 690.55, up 0.06%, with the index advancing 16.58% in the past one year. Register for your complimentary reports at the links given below.  

LG, Shane Battier Go "Beyond The Arc" To Fund College Scholarship; Social Campaign Engages March Madness® Fans, Raises $20,000 for The Battier Take Charge Foundation
March 27, 2015
 LG Electronics USA, Official Corporate Partner of the NCAA®, is pleased to donate $20,000 to The Battier Take Charge Foundation's scholarship program as a result of the brand's tweet-to-give social campaign and "Beyond the Arc" trivia event in New York City earlier this week.

New Services Cloud AT&T's Bet on Pay TV
March 27, 2015
AT&T Inc. knew it was buying a melting ice cube when it agreed to acquire satellite-TV company DirecTV last year for $49 billion. But recent moves by HBO, Apple Inc. and the National Football League have turned the temperature up a few degrees.

ICE Acquires QFI QuantumScope for Failure Analysis Laboratory.
March 27, 2015
  Vista, CA (PRWEB) March 27, 2015             Innovative Circuits Engineering (ICE), a Silicon Valley IC test services business, has expanded their semiconductor failure analysis (FA) offerings through the acquisition of a QuantumScope FA microscope from Quantum Focus Instruments Corporation (QFI) of Vista, CA. The QuantumScope design includes a unique multi-sensor optical head, which has mid-wavelength infrared (MWIR) hot spot detection, photoemission, and laser signal injection microscopy (LSIM) techniques integrated to the same optical inspection platform. ICE engineers are now able to investigate semiconductor devices with all three primary optical FA techniques without moving between systems or changing set-up conditions. This multi-sensor optical head design greatly enhances device throughput and defect capture rates.

Electronic componen
March 27, 2015
Award: Electronic componen Contract award dollar amount: 52979.64 Contract award date: March 26, 2015 Contractor awarded DUNS: 040901068Contractor name : BAE SYSTEMS LAND & ARMAMENTS L.P. 1801 ELECTRONICS DR ANNISTON 36207 Contractor address : 6844 Us Financier : - Implementing agency : Defense Logistics Agency Dla Land And Maritime Active Devices Division Po Box 3990 Columbus Oh 43218-3990 Usa Point Of Contact(S): Alan Searfoss614-692-2049 Alan.Searfoss@Dla.Mil Country :United States


Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...