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These acrylic flowmeters have interchangeable scales
August 01, 2014
This company's 6A02 acrylic flowmeters have interchangeable direct-reading scales that are available for any one of the following: water, argon, oxygen, carbon dioxide, nitrogen and helium. Scales are mounted at the front of the flow body and are positioned and secured by a clear front-plate held in place by four screws. A low-hysteresis, multi-turn needle valve is also included. Dual scales display flowrates in both metric and English units. These flowmeters can operate up to a maximum temperature of 150F and a maximum pressure of 6.89 bars, with an accuracy of ±3%. - Dakota Instruments, Inc., Orangeburg, N.Y. www.dakotainstruments.com

PERICOM SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY CEO HUI (California)
July 23, 2014
WASHINGTON, July 23 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by CEO, President and Director Chi Ming Hui Alex, Milpitas, Calif. On July 17 the action involved acquisition of 33,907 shares of stock. Hui now owns 1.25 million shares of stock directly. Pericom Semiconductor Corp. provides integrated connectivity solutions. For any query with respect to this article or any other content requirement, please contact Editor at htsyndication@hindustantimes.com

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo. While expectations are for smart devices to sustain a compact form factor, consumers also expect powerful performance and low power consumption. The challenge for the semiconductor industry is to meet these needs by addressing system and integration scaling in the electronics market[1]. The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning[2], further development of 3D Integrated Circuits (IC)[3], quality control, and finally, the assembly and high-volume manufacturing of chips. Full details of the labs' capabilities are available in Annex A.

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo. While expectations are for smart devices to sustain a compact form factor, consumers also expect powerful performance and low power consumption. The challenge for the semiconductor industry is to meet these needs by addressing system and integration scaling in the electronics market[1]. The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning[2], further development of 3D Integrated Circuits (IC)[3], quality control, and finally, the assembly and high-volume manufacturing of chips. Full details of the labs' capabilities are available in Annex A.

Flextronics Partners with HZO to Launch New Technology Liquid And Corrosion Protection
July 23, 2014
Flextronics has introduced submersible thin film protective technology for electronics assembly, device or component through an expanding partnership with HZO.

Transparency Market Research Posts Physical Vapor Deposition Market Report
July 23, 2014
According to a new market report published by Transparency Market Research "Physical Vapor Deposition (PVD Equipment, PVD Materials and PVD Services) Market for Microelectronics, Storage, Solar Applications, Medical Equipments, Cutting Tools and Other Applications - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019", the global PVD market was valued at USD 10.94 billion in 2012 and is expected to reach USD 20.45 billion by 2019, growing at a CAGR of 9.5 percent over the forecast period from 2013 to 2019. In a release, the Company noted that the global PVD market is expected to witness rapid growth in the next few years due to growth in end-use industries such as microelectronics and medical equipment. Microelectronics is used in different applications such as computers, medical and defense. These applications require high precision and efficiency.

Fitch: Street Light Retrofit Projects - Trends in Mexico's Municipalities
July 23, 2014
The following is from Fitch Ratings on July 11: In a recent report highlighting the financial impact of street light retrofit projects on municipality's finances, Fitch Ratings reveals some trends identified in Mexico.

Transparency Market Research: Global Physical Vapor Deposition Market to be Worth USD 20.45 Billion by 2019
July 23, 2014
Transparency Market Research published a new market report that says the global PVD market was valued at USD 10.94 billion in 2012 and is expected to reach USD 20.45 billion by 2019, growing at a CAGR of 9.5 percent over the forecast period from 2013 to 2019.

Augmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast and
July 22, 2014
Reportbuyer.com has added a new market research report:Augmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast andhttps://www.reportbuyer.com/product/2051926/Augmented-Reality--Virtual-Reality-Market-by-Technology-Types-Sensors-Accelerometer-Gyroscope-Haptics-Components-Camera-Controller-Gloves-HMD-Applications-Automotive-Education-Medical-Gaming-Military--by-Geography---Global-Forecast-and.htmlAugmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast and Analysis to 2013 - 2018The Augmented reality and virtual reality (AR&VR) is going through a significant adoption in the training and infotainment sectors. The main motivation behind the significant adoption is the versatile range usage for these technologies (AR&VR).

Flextronics Receives Prestigious Supplier Of The Year For Logistics Excellence Award From Lenovo
July 22, 2014
 Flextronics (NASDAQ: FLEX) announced today that Lenovo recently honored its Venray, Netherlands location with the prestigious Supplier of the Year for Logistics Excellence Award.    The Logistics Excellence Award from Lenovo was the result of Flextronics' outstanding service and quality for the past year. The Flextronics Venray operation is strategic for Lenovo since the site is the merge and cross-dock operation for PC's and options that are destined for European customers. On top of outstanding logistics results, Flextronics' Venray site continues to demonstrate serviceability, cost and quality management and dedication to Lenovo's continuous improvement initiatives.


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