Headlines


Mentor Graphics Reports Quarterly Results
August 27, 2014
Mentor Graphics reported financial results for the company's fiscal second quarter ended July 31. In a release on August 21, the Company reported revenues of $260.2 million, non-GAAP earnings per share of $0.23, and GAAP earnings per share of $0.13.

Eyelit Inc. Releases a New Recipe Management System (RMS) Module to Improve Quality and Lower Manufacturing Costs; Eyelit Manufacturing RMS(TM) coordinates dynamic equipment recipes for automation and advanced process control (APC)
August 26, 2014
Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, life sciences, medical device, semiconductor, and photovoltaic (solar) industries, announced today the general availability of the new Eyelit Manufacturing RMS(TM) module. Automation has become critical for high-tech manufacturers due to the complexity of tight specifications, a high mix of products, fast cycle times, and a need to maximize overall equipment effectiveness (OEE). Eyelit's RMS helps enforce precision automation that prevents mistakes, increases throughput and yield, and adjusts processing to prolong the time between required maintenance activities.

ASE Collaborates on Leading MEMS Device With Bosch Sensortec GmbH; Deep technology integration using ASE's advanced wafer level packaging delivers an industry first in the MEMS accelerometer arena
August 26, 2014
Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (NYSE:ASX), the world's largest semiconductor assembly and test service provider, today announced that it has been selected by Bosch Sensortec GmbH as a key manufacturing and technology partner for production of a leading edge sensor device. Through utilizing advanced wafer level packaging technologies developed at ASE, Bosch Sensortec has successfully brought to market the industry's smallest 3-axis MEMS accelerometer available today. Geared towards highly integrated low-power consumer electronics applications, this leading edge sensor device features digital interfaces in an advanced wafer level chip scale package. With sensor technologies playing an integral role in emerging applications within the Internet of Things and the smart world evolving around us, there is high demand for innovative IC packaging solutions to meet stringent performance, efficiency, and footprint requirements. As an industry leader, ASE was one of the world's first providers of wafer level packaging, which enables the smallest package size possible, that being the same size as the die itself. ASE's proven WLCSP portfolio includes an expanding scope of highly customizable options, encompassing technologies such as high density routing, very thin WLCSPs, low temperature processing, enhanced WLCSP Structures and materials, Wafer Level integrated passives, 3D WLPs, WL MEMS, and embedded die packaging.

Samsung Starts Mass Producing Industry's First 3D TSV Technology Based DDR4 Modules for Enterprise Servers
August 26, 2014
Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memorymodules(RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions. Samsung Electronics 64GB 'through silicon via' DDR4 (Photo: Business Wire)

US Contract Notice: Department of the Navy Issues Solicitation for "Advanced Precision Kill Weapon System II (APKWS) OV-10 Aircraft Integration Support"
August 26, 2014
Department of the Navy, Naval Air Systems Command Officer has issued requirement for "Advanced Precision Kill Weapon System II (APKWS) OV-10 Aircraft Integration Support."

United States : Nordson MARCH introduces the FlexTRAK-S Plasma System with large capacity plasma chamber for advanced semiconductor and electronics packaging
August 26, 2014
Nordson MARCH, a Nordson company and global leader in plasma processing technology, extends its line of TRAK technology products with the FlexTRAK-S large-capacity plasma system for advanced semiconductor and electronic packaging. The 5.5-liter plasma chamber has a high-power RF generator and better vacuum conductance so the FlexTRAK-S performs with the same consistent plasma treatment uniformity, efficiency, and short cycle times as the smaller version. Using plasma prior to bonding, molding or marking delivers cleaner surfaces for these electronics production processes.

SemiLEDs releases 80x80mil metal LED chips
August 25, 2014
HIGHLIGHT: SemiLEDs Corporation, a provider of vertical LED technology solutions, has released 80x80mil metal LED chips, including white, blue and UV variations.

ISIS Social Media Strategy Dissected; Russian Aid Convoy Enters Ukraine; U.S. Defense Commanders Issue Stark Warning On ISIS; Malaysian
August 22, 2014
KRISTIE LU STOUT, HOST: I'm Kristie Lu Stout in Hong Kong. And this is News Stream where news and technology meet. Now the U.S. says ISIS poses an imminent threat, calling the group more sophisticated than anything they've seen. A Russian aid convoy enters Ukraine. One Ukrainian official calls it a direct invasion of the country. And we'll show you the next game from the creator of Flappy Bird. We'll tell you why you might have trouble finding it.

Battle for the $18 Billion US Smart Home Heats Up as Apple and Google Posture for Position says Strategy Analytics
August 12, 2014
Spending on smart home systems and services in the US will hit$18 billion in 2014 and more than double to $39 billion by 2019 according to Strategy Analytics' Smart Home Strategies < http://www.strategyanalytics.com/default.aspx?mod=saservice&a0=311&m=5#0> latest forecast. Apple, Google and Samsung are among the big consumer brands posturing for position in the market as ADT, Vivint, Comcast and AT&T drive growth in the interactive security market. The competitive dynamics shaping the market are described in "Handicapping the US Smart Home Horserace."

Defense Acquisition, Meet Moores Law
August 01, 2014
FULL TEXT Defense Acquisition, Meet Moore's Law The department must accommodate the logistical changes brought about by rapid technology innovation. The United States had a pressing need for a new defense capability. That was what many thought, but as is often the case in a democracy, not all agreed. The debate went on for some time, but it finally was settled, and Congress approved a large sum of money to design and field the new system. Then, there followed additional debates: How many systems are needed? What are the key performance characteristics? Who should build it? After considerable, often contentious discussion, a request for proposals was published, responses came in and there was a selection. The selection, however, was not without controversy, and a protest was lodged. Once the protest was resolved, a contract was awarded that required production be spread to six different localities in six different states. The first efforts to gather the needed construction material were unsuccessful, leading to cost overruns, schedule delays and ultimately congressional hearings. Fortunately, at the end of this long and laborious effort, the system was delivered and proved to be world-class when tested in combat against a fully capable enemy.


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