Apple's attempt to block Samsung phone sales rejected
August 28, 2014
A federal judge has rejected Apple's attempt to block the sale of several older Samsung smartphones that copied features in the iPhone, The New Zealand Herald reported. Wednesday's rebuff comes nearly four months after a jury awarded Apple Inc. $119 million in damages for Samsung's infringements on technology used in the trend-setting iPhone. The amount was well below the $2.2 billion in damages that Apple had been seeking in the latest round of legal wrangling between the world's two leading smartphone makers since the tussle began four years ago.

Examining Intel's embedded DRAM
August 28, 2014
umbai, Aug. 28 -- Two major players in the industry-Intel and Samsung-voiced out their disappointment with SRAM scaling at the International Solid-State CircuitsConference (ISSCC) last February. In the paper Song et. al. from Samsung [1] argued that SRAM not only occupied too much real estate, but the operating voltage did not scale in the same proportion as the logic devices on the same die. Cache size in megabytes was also increasing on the die; so there were more devices on the die that required higher voltages than the main logic part. Hamzaoglu in a paper from Intel [2], revealed that SRAM scaling was not satisfying their requirements and that the majority of the die area was taken by SRAM cell area. The question arose; was it worth continuing to invest in SRAM, especially in 22nm nodes and below, where manufacturing costs were astronomical and could only continue to increase for future technology nodes?

World Health Organization calls for strong regulation of electronic cigarettes
August 28, 2014
The World Health Organization (WHO) [official website] on Tuesday called for strict regulation [text, PDF] of electronic cigarettes, including a ban on the usage of the devices in public places and advertising targeting minors. The report, which will be debated by member states in October in Moscow, states [NYT report] that a great deal of uncertainty still surrounds e-cigarette use and that indoor use in public spaces should be banned until they are proven harmless to bystanders. The UN health agency also expressed concern about the growing power of the tobacco industry in this fast-developing market. While many health experts celebrated the United Nations health agency's recommendations, saying that they would help guide the world's policy makers, others worried [Reuters report] that overly restrictive regulations could discourage smokers from switching to less dangerous alternatives.

Drumroll: Finalists and Select Winners Announced for The Arizona Technology Council's 2014 Governor's Celebration of Innovation; Tickets on sale now for Arizona's premier technology industry event being held at the Phoenix Convention Center on Thursday, November 13, 2014
August 27, 2014
 Honoring the state's technology industry visionaries whose passion and dedication are propelling Arizona to a position of economic strength, theArizona Technology Councilin conjunction with theArizona Commerce Authority, today announced Student and Teacher Awards as well as Individual Award winners and Company Award finalists for the2014 Governor's Celebration of Innovation (GCOI) awardspresented byAvnet, Inc.

Intel Announces New Packaging and Test Technologies for Foundry Customers; New Technologies to Improve Time to Market and Reduce Costs
August 27, 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

Samsung Starts Mass Producing Industry's First 3D TSV Technology Based DDR4 Modules For Enterprise Servers
August 27, 2014
Wednesday, August 27, 2014: Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

3D Systems and SME Announce Formation of Advisory Board for Its M.Lab21 Education Initiative
August 27, 2014
- Distinguished advisory board includes members from Intel, GE, Deloitte, Johnson Controls, NIST - Supports 3D printing labs and advanced manufacturing curriculum in High Schools - Facilitates continuous interface between prospective employers and technical education providers - Revolutionizes high school industrial arts, career and technical education by delivering 21st Century Manufacturing Lab in schools ROCK HILL, S.C., Aug. 27, 2014 (GLOBE NEWSWIRE) 3D Systems (NYSE:DDD) and SME announced today the formation of an advisory board for its collaborative M.Lab21 Initiative, composed of founding members 3D Systems and SME and key collaborator, America Makes (the National Additive Manufacturing Innovation Institute) as well as representatives and support from Intel, GE, Johnson Controls, Lockheed Martin, Deloitte and National Institute of Standards and Technology (NIST).

MENTOR GRAPHICS CORP [ MENT ] Reports dispositions by the director Trebing Richard (Oregon)
August 27, 2014
MENTOR GRAPHICS CORP [ MENT ], WILSONVILLE, has filed a form 4 with the Securities & Exchange Commission on 08/26/2014 noting the change in the beneficial interest held by Trebing Richard, WILSONVILLE. On August 25,2014 action involved dispositions of 2,750 shares in stock. Trebing Richard, now owns 1,891 shares directly. For more information please visit: http://www.sec.gov

US Contract Notice: National Aeronautics and Space Administration Issues Solicitation for "70--LICENCING AND SUPPORT FOR ELECTRONIC DESIGN AUTOMATION TOOLS"
August 27, 2014
National Aeronautics and Space Administration, Goddard Space Flight Center Officer has issued requirement for "70--LICENCING AND SUPPORT FOR ELECTRONIC DESIGN AUTOMATION TOOLS." Solicitation no. 4200465503 Posted on: August 27, 2014

LDRA India initiates industry-wide safety-critical platform
August 27, 2014
umbai, Aug. 27 -- LDRA Technology, the company in standards compliance, automated software verification, source code analysis and test tools, announced it will drive joint technology and development initiatives towards a safe and secure India. LDRA plans to initiate the LDRA Partner Alliance, a gathering of like-minded partners who will bring their technologies together into an integrated safety-critical platform that fully complies with stringent industrial standards. By establishing coherent best design, development, and verification practices on one platform, the LDRA Partner Alliance will usher in a safer, more secure tomorrow for development of aerospace, rail, medical, industrial, automotive, defence, energy, nuclear, and cyber security within India.


Entegris announces GateKeeper GPS platform
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Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....