Headlines


Court to decide value of Apple smartphone features; Results of iPhone maker's four-year fight with Samsung will have broad implications
March 04, 2015
Samsung Electronics Co. is about to find out just how costly its four-year patent fight with Apple Inc. has been. Each side spent hundreds of millions of dollars in legal bills to answer this fundamental issue: What's the value of a feature in a smartphone or tablet, and is it greater if the inventor has a reputation for being cool? That's the crux of arguments to be made Wednesday when the top U.S. patent court in Washington hears an appeal in one of the two remaining cases in the "smartphone war" between the companies.

Typesafe Names Keynotes for Scala Days 2015
March 04, 2015
Typesafe confirmed the keynote speakers for Scala Days 2015 to be held March 16-18 at Fort Mason in San Francisco: -March 16: Martin Odersky, chief architect and co-founder of Typesafe, and author of Scala;

Mentor Graphics Acquires Tanner EDA
March 03, 2015
March 3 -- Mentor Graphics Corp. (NASDAQ: MENT) today announced it has acquired the business assets of Tanner EDA, a leading tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits. With this acquisition, more designers will now have access to Tanner's AMS products based on the strength and reach of the Mentor Graphics global sales organization. All Tanner EDA products as well as existing AMS products from Mentor will continue to be available and supported.

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO
March 03, 2015
Tuesday, March 03, 2015: IPC - Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service. For his leadership of the D-33AT Task Group that developed the IPC-6012C Certification and Training course, Don Dupriest, Lockheed Martin Missiles & Fire Control, received a Committee Leadership Award. For their contributions to the IPC-6012C Certification and Training course, Elizabeth Allison, NTS - Baltimore; Gary Ferrari, FTG Circuits; Renee Michalkiewicz, NTS - Baltimore; Debora Obitz, Microtek - East; and Jose Rios, i3 Electronics, earned a Distinguished Committee Service Award.

United States : Fairchild's High-Current, High Efficiency MOSFETs Now Available in TO-Leadless Packaging for Automotive
March 03, 2015
Fairchild, a leading global supplier of high-performance power semiconductor solutions, announced today the availability of its next generation PowerTrench MOSFETs for automotive applications in the high-power TO-Leadless (TO-LL) package (JEDEC MO-299). The innovative TO-LL technology offers an extremely low package resistance, a very small footprint, and allows for exceptionally good EMI behavior.

Germany : New autoclavable TO LED with customizable caps and glass lenses
March 03, 2015
The international technology group SCHOTT is introducing a third LED product design to complement its series of autoclavable light sources for use in medical instruments. The new TO LED is a High Brightness LED based on SCHOTT s hermetic TO housing footprint, making it fully autoclavable. It is ideally suited for use in medical instruments that need a sterilizable and reliable light source at the point of action as well as for UV curing devices. SCHOTT will be unveiling its innovations from March 10 to 14, 2015 at IDS trade show in Cologne (booth 11.3 B 081).

National Center for Advanced Packaging Files Chinese Patent Application for Three-Dimensional Multi-Chip Storage System Packaging Structure Based on Flexible Base Board and Manufacturing Method Thereof
March 03, 2015
Publication Name: Semiconductor Patent News Patent Application Number: CN20131721105 20131224 Patent Publication Number: CN103715184 (A) International Patent Classification Codes: H01L21/98, H01L23/13, H01L23/31, H01L25/065 Cooperative Patent Classification Codes: H01L2224/32145, H01L2224/32225, H01L2224/48091, H01L2224/48145, H01L2224/48227, H01L2224/4824, H01L2224/73215, H01L2224/73265, H01L2224/92147, H01L2924/15311, H01L2924/19105 Patent Status: Application

Design Methodology Engineer (NCG)
March 03, 2015
Altera has issued the following Job vacancy: Design Methodology Engineer (NCG) Location: US-CA-San Jose Requisition ID: 4765 # of openings: 1 Description

Packaging Engineer
March 03, 2015
Altera has issued the following Job vacancy: Packaging Engineer Location: US-CA-San Jose Requisition ID: 4724 # of openings: 1 Description As a Packaging Engineer, you must have thermal, mechanical and physical package design skills. You will work in a team atmosphere which is also required to achieve the highest possible performance while maintaining the product requirements (cost). The position will aid in the design of power products at Altera's Headquarters in San Jose, CA. You specific responsibilities will include but are not limited to the following:

New flight-test success for LRASM missile
March 01, 2015
FULL TEXT Key Points LRASM goes 'three-for-three' in air-launched flight testing Latest test demonstrates low altitude performance, obstacle avoidance Lockheed Martin's Long-Range Anti-Ship Missile (LRASM) has successfully completed its latest air-launched flight test on the Point Mugu sea test range off California.


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