Headlines


U.S. Patents Awarded to Inventors in California (July 23)
July 23, 2014
ALEXANDRIA, Va., July 23 -- The following federal patents were awarded to inventors in California. *** Micron Technology Assigned Patent for Etch Bias Homogenization ALEXANDRIA, Va., July 23 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,785,314) developed by Fabio Pellizzer, Cornate d' Adda, Italy, Hernan A. Castro, Shingle Springs, California, and Eddie T. Flores, Folsom, California, for etch bias homogenization. The patent application was filed on May 3, 2012 (13/463,245). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,785,314.PN.&OS=PN/8,785,314&RS=PN/8,785,314 Written by Deviprasad Jena; edited by Jaya Anand.

Mentor Graphics Assigned Patent
July 23, 2014
ALEXANDRIA, Va., July 23 -- Mentor Graphics, Wilsonville, Oregon, has been assigned a patent (8,788,982) developed by George Lippincott, Lake Oswego, Oregon, Yuri Granik, Palo Alto, California, and Sergey Kobelkov, Moscow, for a "layout design defect repair using inverse lithography."

A*STAR IME launches four joint labs to help semiconductor industry
July 23, 2014
SINGAPORE: A Singapore research institution on Wednesday (July 23) launched four laboratories as the Government takes further steps to position the city-state as a world-class innovation hub for the semiconductor industry. The four Agency for Science, Technology & Research (A*STAR) Institute of Microelectronics' (IME) Advanced Semiconductor Joint Labs will leverage IME's research capabilities in advanced lithography, metrology, assembly, and wafer level packaging, which are key semiconductor technology processes. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron and Tokyo Ohka Kogyo.

Intel offer to iPad: Let`s Make Cheap Tablets
July 23, 2014
Mr. Wang runs a small factory in this southern Chinese city, making tablet computers and printed circuit boards for local electronics brands in China and South America. His company, Shenzhen Hampoo Science & Technology Co., isn't well known, but it is exactly the kind of customer that the Silicon Valley giant is seeking.

Flextronics Partners with HZO to Launch New Technology Liquid And Corrosion Protection
July 23, 2014
Flextronics has introduced submersible thin film protective technology for electronics assembly, device or component through an expanding partnership with HZO.

Flextronics Receives Prestigious Supplier Of The Year For Logistics Excellence Award From Lenovo
July 22, 2014
 Flextronics (NASDAQ: FLEX) announced today that Lenovo recently honored its Venray, Netherlands location with the prestigious Supplier of the Year for Logistics Excellence Award.    The Logistics Excellence Award from Lenovo was the result of Flextronics' outstanding service and quality for the past year. The Flextronics Venray operation is strategic for Lenovo since the site is the merge and cross-dock operation for PC's and options that are destined for European customers. On top of outstanding logistics results, Flextronics' Venray site continues to demonstrate serviceability, cost and quality management and dedication to Lenovo's continuous improvement initiatives.

Panasonic Updates Toughbook 53 Semi-rugged Laptop; Windows 8.1 Pro Update, battery life of up to 15 hours enhances productivity of mobile professionals
July 22, 2014
Panasonic, an industry leader in reliable and innovative mobile computers since 1996, today announced upgrades to the Toughbook® 53 semi-rugged laptop. With a 4th generation Intel® Core(TM) i5 vPro(TM) processor, up to 15 hours of battery life, Windows 8.1 Pro Update or Windows 7 Professional (available through downgrade rights from Windows 8.1 Pro), and enhanced wireless connectivity, the Toughbook 53 now more than ever serves as a reliable and versatile tool for mobile workers in demanding markets such as insurance, construction and the military.

Solid State Equipment LLC Wins 2014 3D InCites Award for WaferEtch(TM) TSV Revealer; TSV Revealer Achieves Highest Uniformity and Fast Etch Rates; Provides Lowest CoO, Making 3D TSVs More Economically Feasible
July 22, 2014
Solid State Equipment LLC (SSEC), a leading provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment. The 3D InCites Awards recognize achievements to further the commercialization of 2.5D and 3D IC technologies. SSEC received the award for the WaferEtch TSV Revealer tool, which is a single wafer wet processing platform for 3D IC and interposer wet etching applications designed to reduce process and capital equipment costs. The WaferEtch features superior uniformity of silicon thickness (as low as -/+ 0.7%) and high throughput.

Mentor Graphics launches integrated solution for heterogeneous SoC development
July 21, 2014
HIGHLIGHT: Mentor Graphics Corporation, a provider of electronic design automation software, has launched an integrated solution for heterogeneous system-on-chip, or SoC, development.

Huawei's first-half revenue jumps 19% thanks to LTE, smartphones
July 21, 2014
Huawei reported that its first half-revenue jumped 19 percent thanks to growth in its LTE network infrastructure and smartphone businesses outside China. The vendor said that first-half revenue came in at $21.88 billion. The company reported that its operating margin for the first half of the year rose to 18.3 percent, up from 12.2 percent last year.


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