Altium presents new design solutions at SINDEX in Switzerland
August 29, 2014
August 29, 2014 Protel AG, the Swiss subsidiary of Altium Limited, showcases the latest developments of Altium Designer and TASKING. Sydney, Australia - Altium Limited, a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING), will present the latest technology developments in Hall 1.2, Stand D01 at Switzerland's largest technology trade show SINDEX, which takes place from 2nd to 4th September 2014. This is the second time that Altium is exhibiting at SINDEX in Bern, which was launched in 2012 with great success.

Flextronics To Participate In Upcoming Investor Conferences
August 28, 2014
 Flextronics (NASDAQ: FLEX) announced today that it will participate in the following events during the month of September.  Live webcasts of both conferences will be available on the Investor Relations section of the Flextronics website at:http://www.flextronics.com/investors.

GameStop Announces Special Guests for GameStop EXPO 2014
August 28, 2014
GameStop, a family of specialty retail brands that makes the most popular technologies affordable and simple, is offering the public and PowerUp Rewards(TM) members an unforgettable experience in meeting celebrities and video gaming luminaries, getting autographs and playing games months before release at the ultimate event for gaming fans: GameStop EXPO at the Anaheim Convention Center in Anaheim, CA on Tuesday and Wednesday, Sept. 9-10. GameStop EXPO attendees will have the chance to meet the following special guests during the event on Wednesday, Sept. 10:WWE Superstar Seth Rollins from 1:00 - 3:00 p.m. in the 2K boothUFC fighter and Brazilian mixed martial artist Rafael Souza dos Anjo in the Alienware booth from 11:00 a.m. to 2:00 p.m.McFarlane Toys Founder and Legendary Spawn artist, Todd McFarlane at 9:30 - 11:00 a.m. in the McFarlane Toys booth. See all the newest action figures and statues from McFarlane Toys including those from AMC's The Walking Dead, WWE, Assassin Creed, HALO, Rabbids, NFL, NBA and MLB.One of the industry's brightest stars: Nolan North. Well known for his voice work as Nathan Drake from theUnchartedseries, Desmond Miles fromAssassin's Creed, the Penguin inBatman: Arkham Cityand many more memorable characters, North will be available for autographs at the Turtle Beach booth from1:00 - 4:00 p.m. *times subject to changeAshly Burch, the voice of Tiny Tina from Borderlands 2, will be also be available for autographs at the Turtle Beach booth from 10:00 a.m. to 1:00 p.m. *times subject to changeGreg Horn, illustrator of Death of Wolverine in the Diamond Comics booth 3:00 - 5:00 p.m.Back by popular demand, a selection of Game Informer magazine editors will be in-the-house. Swing by the Game Informer booth, have a chat about their favorite games and grab a free collector's edition poster. For other photo opportunities, fans can:

Mentor Graphics Announces its Membership in the European Centre for Power Electronics Consortium
August 28, 2014
Mentor Graphics Corporation(NASDAQ: MENT) today announced its new membership in the German-based European Centre for Power Electronics (ECPE), a European consortium focused on the research, education, technology transfer, and promotion of power electronics globally.  Mentor Graphics is the only electronic design automation (EDA) company represented in this industry-driven research network, comprised of over 150 organizations (75 companies and 76 institutions).  Mentor Graphics was selected as an ECPE member due to its unique expertise in both thermal simulation and test solutions including electronic components power cycling for reliability prediction, as evidenced by its recently announcedMicReD® Industrial Power Tester 1500A technology.

IEEE Standards Association (IEEE-SA) Steers the Future of the Internet of Things (IoT); IEEE-SA to host IoT workshop in Silicon Valley in September to explore opportunities, impacts and challenges of IoT; IEEE IoT expert Oleg Logvinov to speak at Cisco's IoT World Forum
August 28, 2014
IEEE , the world's largest professional organization advancing technology for humanity, announced today that the IEEE Standards Association (IEEE-SA) will host an Internet of Things Workshop , 18-19 September 2014 at the Computer History Museum in Mountain View, Calif. This two-day event will provide an open, engaging platform to discuss opportunities, impacts and challenges around the convergence of technologies known as Internet of Things (IoT) , with a special focus on the need for more interdisciplinary approaches to the design of products and services for IoT markets. "From smart cities to smart homes to eHealth to cleaner transportation, standardization in IoT will provide economic opportunity to these areas and many more by increasing interoperability and fueling the economy of scale. IEEE-SA is one of the driving forces behind IoT standardization and will continue to contribute to the advancing of IoT by participating and hosting of IoT workshops, events and projects," said Oleg Logvinov, chair of the workshop planning committee and director, special assignments, Industrial and Power Conversion Division, STMicroelectronics. "The IEEE-SA IoT Workshop is a great venue for this collaboration. Here experts will gather to discuss technical and business challenges and opportunities, and how standards development will help shaping the future of IoT."

Needle Adds New Leaders with Experience from AtTask, Electronic Arts, Microsoft and Amazon; Needle Also Expands Its Customer Base to Europe and Asia
August 28, 2014
Needle, the pioneer in advocate-assisted commerce, today announced the expansion of its leadership team: Christian Matsumori joins as Vice President, Product; and Adam Davis joins as Director, Customer Success. Together, Matsumori and Davis know what it takes to accelerate growth and deliver the authentic, real-time experiences that today's companies need to compete and win. The additions come as Needle recently closed deals in the UK, Germany and Australia-and welcomed brands like Dick's Sporting Goods, hhgregg and Nikon, Inc. to its customer roster in the U.S.

MEMS Industry Group Hosts 10th Annual MEMS Executive Congress US; Tech Business Leaders Explore MEMS and Sensors in Consumer, Environmental, Healthcare/Medical, Industrial Apps
August 28, 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress(R) US 2014, the annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ. Spanning environmental sensors for safe drinking water to personalized healthcare, cybersecurity for connected systems, and spectral imaging in wearable devices, micro-electromechanical systems (MEMS) and sensors enable human-machine interactions in unprecedented ways. "This year's MEMS Executive Congress US speakers reflect some of the most fascinating uses of MEMS and sensors in commercial applications," said Karen Lightman, executive director, MEMS Industry Group. "Ayasdi is tracking disease via smartphone. MoboSens uses a smartphone sensor to monitor nitrate in drinking water. VTT's microspectromers are likely to be used for skin cancer analysis, among many other uses. GE is advancing MRI. Wurldtech's technology protects critical infrastructure for oil and gas, smart grid and medical devices. And those are just a few of our speakers who will enlighten the C-level audience about maximizing the potential of MEMS and sensors -- the theme of this year's MEMS Executive Congress. Equally exciting, Congress attendees will also hear from entrepreneurs, academic innovators and one of the world's largest foundries, TSMC."

Intel Announces New Packaging and Test Technologies for Foundry Customers
August 28, 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

Washington: Apple to unveil next products at Sept. 9 event
August 28, 2014
Association of Western Pulp & Paper Workers has issued the following news release: Apple's latest product launch will be in a setting that holds a special place in its history, signaling how big this event is for the company. The Sept. 9 launch, which is expected to feature a larger iPhone and possibly a computerized watch, will be in the same Silicon Valley venue where Apple's late co-founder, Steve Jobs, took the wraps off the original Mac computer 30 years ago. That machine was hailed as a major breakthrough that helped bring personal computing to the masses.

Procure 543 AN/ALE-55 Fiber Optic Towed Decoys (FOTDs) and 117 Electronic Frequency Converters (EFC)
August 28, 2014
Contract Awarded to Procure 543 AN/ALE-55 Fiber Optic Towed Decoys (FOTDs) and 117 Electronic Frequency Converters (EFC)


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