Headlines


Inside a Chinese 'Taobao village'
October 23, 2014
Xiniujiao village of Baiyun district in Guangzhou is a typical "taobao village" in China. People are busy packaging products in Xiniujiao village of Baiyun district, Guangzhou on Sept 20, 2014. It is a typical "taobao village" in China, as nearly every family has opened stores on Taobao, the Chinese equivalent of eBay. Express delivery firms abound there. [Photo/CFP]

-ARM Extends Scalability of CoreLink for Infrastructure Compute
October 23, 2014
ENP Newswire - 23 October 2014 Release date- 22102014 - Cambridge, UK - ARM today announced new additions to its suite of enterprise-class ARM CoreLink Cache Coherent Network (CCN) SoC interconnects, underscoring its commitment to providing a flexible architecture from sensors to servers. The CoreLink CCN-502 and CoreLink CCN-512 interconnects extend the current family for data center and infrastructure equipment that scales from the edge of the network to the core.

Security on agenda as Apple head visits
October 23, 2014
Apple Inc Chief Executive Tim Cook discussed information security issues with Vice-Premier Ma Kai in Beijing on Wednesday amid security concerns involving the United States-based company's cloud storage service.

Mentor Graphics names A.J. Incorvaia as vice president for PCB Design
October 23, 2014
Electronic hardware and software design solutions company Mentor Graphics Corp (NASDAQ: MENT) announced on Thursday that A.J. Incorvaia has been appointed vice president and general manager of the company's Board Systems Division.

ARM Extends Scalability of CoreLink for Infrastructure Compute
October 22, 2014
ARM today announced new additions to its suite of enterprise-class ARM® CoreLink(TM) Cache Coherent Network (CCN) SoC interconnects, underscoring its commitment to providing a flexible architecture from sensors to servers. The CoreLink CCN-502 and CoreLink CCN-512 interconnects extend the current family for data center and infrastructure equipment that scales from the edge of the network to the core. "Growth in mobile computing and the Internet of Things is connecting more devices and aggregating more data across the network, and that demands an increasingly flexible and efficient computing infrastructure," said James McNiven, general manager, systems and software group, ARM. "Our new CoreLink CCN-502 and CoreLink CCN-512 interconnects build on a common architecture, scaling from high efficiency Power-over-Ethernet wireless access points, to high compute density 48-core solutions."

Intel CEO Brian Krzanich to Keynote at 2015 International CES; Krzanich returns to keynote stage to discuss Intel's vision for how technology will continue to shape our lives
October 22, 2014
The Consumer Electronics Association (CEA)® today announced that Intel Corporation CEO Brian Krzanich will deliver a keynote address at the upcoming 2015 International CES®. Owned and produced by CEA, the 2015 CES, the world's gathering place for all who thrive on the business of consumer technologies, will run January 6-9, 2015, in Las Vegas, Nevada. Intel Corporation CEO Brian Krzanich (Photo: Business Wire)

Si2 to Sponsor "3D Architectures for Semiconductor Integration and Packaging Conference"; Si2 Keynote Address Will Focus on a 3D Design Ecosystem for IoT
October 22, 2014
Silicon Integration Initiative (Si2) announced today its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP). This conference will be held December 10-12, 2014, at the Hyatt Regency San Francisco Airport, Burlingame, California, and is organized by RTI International. Steve Schulz, President and CEO of Si2, will deliver one of the keynote addresses, "A Design Ecosystem for Internet of Things, How 3D IC Standards will Enable a New Growth Paradigm."

BINGHAMTON UNIVERSITY DEDICATES CENTER OF EXCELLENCE BUILDING
October 22, 2014
The following information was released by Binghamton University (SUNY): Binghamton University now has a Center of Excellence building worthy of its title. University President Harvey G. Stenger on Wednesday joined with Sen. Thomas W. Libous, Assemblywoman Donna A. Lupardo, University faculty and staff, industry partners, community leaders and members of the public to celebrate the opening of a $30 million, 114,000-square-foot facility on Murray Hill Road in Vestal. The Small Scale Systems Integration and Packaging center (S3IP) and its interdisciplinary teams of engineers and scientists recently moved into the glass, metal and stone building. The facility joins the Engineering and Science Building and Biotechnology Building at the Innovative Technologies Complex. A fourth building, the Smart Energy Research and Development Facility, is under construction and expected to open in 2017.

US Patent granted to Mentor Graphics Corporation (Oregon) on October 21 titled as "Memory-based trigger generation scheme in an emulation environment"
October 22, 2014
United States Patent and Trademark Office has granted patent no. 8,868,974, on October 21, 2014, to Mentor Graphics Corporation (Oregon), titled as "Memory-based trigger generation scheme in an emulation environment"

Massachusetts: Mentor Graphics PCB Designer Job Number: 4890122
October 22, 2014
The Executive Office of Labor and Workforce, The State of Massachusetts has issued the following job opportunities: Mentor Graphics PCB Designer Job Number: 4890122 Status: Open Post


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