DesignCon 2015 Announces Winners of Best in Design & Test Awards and Names the Engineer of the Year; Awards Program Recognizes the Best of Engineering & Product Advancements in Nine Categories
January 29, 2015
 From its 20th anniversary event, DesignCon today announced the winners of the Best in Design & Test Awards, recognizing the best product advancements in electronic engineering. The premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, DesignCon is being held this week, January 27-30, at the Santa Clara Convention Center. For additional information please visit:designcon.com.

Benzinga's Top Upgrades
January 28, 2015
Analysts at Longbow Research upgraded Western Digital Corporation (NASDAQ: WDC) from Neutral to Buy. The price target for Western Digital is set to $125. Western Digital's shares closed at $97.63 yesterday.

Orbitz Partner Network to Power Dynamic Travel Packages for Hyatt Hotels & Resorts; Orbitz to Provide Private Label Packaging Service for Hotelier's Global Portfolio of Properties
January 28, 2015
CHICAGO, Jan. 28, 2015 (GLOBE NEWSWIRE) -- Orbitz Partner Network, the private label division of Orbitz Worldwide (NYSE:OWW), announced today that it has launched a multi-year partnership with Hyatt Hotels & Resorts to power dynamic travel package bookings on the company's vacation travel website, HyattTravel.com. Orbitz Partner Network has created a custom-built site hosted on its dynamic packaging technology platform, which provides Hyatt customers with convenient search and book capabilities. The site gives travelers the ability to create cost-saving travel packages by attaching a flight or car rental to a booking to one of Hyatt's more than 500 hotels and resorts worldwide that span nine unique brands.

-SAP- 2015 Will Be the Year of the Smartwatch
January 28, 2015
With demand for tablets and smartphones stabilizing, manufacturers are hoping to see the market for smartwatches take off in 2015. And they have every reason to be optimistic: A predicted 10.8 million smartwatches will ship this year in the U.S. alone.

BAE SYSTEMS INFORMATION SOLUTIONS secures contract for Electrical and Electronic Equipment Components
January 28, 2015
United States, Jan. 28 -- Contract Id: 112069 Description: United States based BAE SYSTEMS INFORMATION SOLUTIONS has secured contract from Department of the Air Force for Electrical and Electronic Equipment Components.

Tessera enters into settlement agreement with Amkor
January 27, 2015
HIGHLIGHT: Tessera Technologies, Inc., a manufacturer of semiconductors, has announced that its subsidiary, Tessera, Inc., has entered into an agreement with Amkor Technology, Inc. to settle all pending litigation the companies.

Washington: The NASA Electronic Parts and Packaging (NEPP) Program - Field Programmable Gate Array (FPGA) Tasks - Considerations
January 27, 2015
National Aeronautics and Space Administration, The Government of USA has issued the following news release: This presentation includes NASA Electronic Parts and Packaging (NEPP) Program Field Programmable Gate Array (FPGA) considerations and FPGA radiation tasks overview. In case of any query regarding this article or other content needs please contact: editorial@plusmediasolutions.com

January 27, 2015
PROOF INTEL NEEDS TO SIGN HOLY LAND PRINCIPLES Walk the walk not just talk the talk Mr. Krzanich CAPITOL HILL. JANUARY 27 2015 mdash;mdash; The CEO of Intel Corporation Mr. Brian Krzanich has been challenged to ldquo; walk the walk not just talk the talkrdquo; by a Capitol Hill-based group dedicated to getting the 546 American companies doing business in Palestine -Israel to sign the Holy Land Principlesmdash; an 8-point set of fair employment principles. The challenge comes on the heels of Mr. Krzanichrsquo;s speech on January 6 to the International Consumer Electronics Show (International CES) in Las Vegas where he declared: ldquo;Irsquo;m here to say tonight itrsquo;s time to step up and do more.

SPTS Technologies announces collaboration with Fraunhofer IZM
January 26, 2015
HIGHLIGHT: ORBOTECH LTD. has announced that SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, is collaborating with Fraunhofer IZM on next generation wafer level packaging of microelectronic devices.

Lockheed Martin delivers first eCASS to US Navy
January 22, 2015
HIGHLIGHT: Lockheed Martin Corporation, an aerospace, defense, security and technology company, has delivered the first electronic Consolidated Automated Support System, or eCASS, to the US Navy for maximizing aircraft readiness.


Ultratech Cambridge NanoTech introduces the Savannah G2 ALD system
01/08/2015Ultratech, Inc., a supplier of ALD systems, as well as lithography, laser-processing and inspection systems used to manufacture semico...
Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...