Headlines


Infineon introduces OptiMOS 5 25V and 30V product family
March 26, 2015
HIGHLIGHT: Infineon Technologies AG, a semiconductor manufacturing company, has introduced the OptiMOS 5 25V and 30V product family.

Local bourse hit by Wall Street fall, but losses limited
March 26, 2015
Local bourse hit by Wall Street fall, but losses limited Central News Agency2015-03-26 03:51 PM Taipei, March 26 (CNA) Shares in Taiwan closed down Thursday as investors took hints from a plunge on Wall Street overnight caused by the latest disappointing economic data from Washington, dealers said. The bellwether electronics sector followed the tech-heavy NASDAQ index to suffer relatively heavier downward pressure, led by blue chips such as Taiwan Semiconductor Manufacturing Co. (TSMC, ???), while old economy and financial stocks bucked the downturn to help the broader market recoup part of its earlier losses, the dealers said.

Packing automat for apparels
March 26, 2015
Automated Packaging Systems, a US-based bag packaging systems recently launched its most advanced bag packaging system - the Autobag 850S Mail Order Fulfillment Bagger. Developed with a focus on ergonomic design, the machine is 22 inches wide. Bag opening technology grabs and securely grips the bag in load-ready position, creating a pass-through up to 11 in. x 11 in., making it ideal for bulky or multi-item orders. This arrangement also enables the use of a smaller, more completely filled bag to reduce material costs. A wide open loading area with pressure sensors instantly pause the closing and sealing process if anything touches the bag loading mechanism. An AutoTouch control screen provides quick access to job setup parameters, on-board diagnostics, data retrieval, performance monitoring, and a help system with operator tutorials. Bag size changeovers are easily accomplished in less than five minutes with simplified threading and a new tension control system that automatically centers and monitors the film throughout the bagging process. A modular bag storage shelf built into the bagger conveniently supports genuine Autobag pre-opened bag-in-box materials. The company vouches that apparel factories are also one of the beneficiaries of this bag packaging technology.

Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33% over the period 2014-2019, Finds New Report
March 26, 2015
March 26, 2015 Market Research Reports, Inc. has announced the addition of "Global Semiconductor Packaging Materials Market 2015-2019" research report to their website http://www.MarketResearchReports.com Report forecast the Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33 percent over the period 2014-2019.

-RIO 2016 Hockey Tournament to Be Played on World-Class Artificial Turf Made with Dow Technologies
March 26, 2015
ORLANDO, Fla. & MIDLAND, Mich. - Building on the success of the London 2012 Olympic Games experience, the innovative artificial turf solution based on The Dow Chemical Company's (NYSE: DOW) polyethylene and polyurethane technologies will be the official playing surface for hockey competitions during the Rio 2016 Olympic Games, at the Deodoro Olympic Park.

Global Electronic Packaging market to grow at a CAGR of 47.02% over the period 2014-2019, Finds New Report
March 26, 2015
March 26, 2015 Market Research Reports, Inc. has announced the addition of "Global Electronic Packaging Market 2015-2019" research report to their website http://www.MarketResearchReports.com Report forecast the revenue and volume of the Global Electronic Packaging market to grow at a CAGR of 47.02 percent and 46.26 percent, respectively, over the period 2014-2019.

N.M. Delegation Encourages Department of Defense to Support UNM's Proposal to Create National Institute of Photonics; Initiative will create jobs, build on N.M.'s unique expertise in optics and photonics, delegation says in letter to Defense Secretary; Sen. Tom Udall (D-NM) News Release
March 25, 2015
WASHINGTON - Today, U.S. Sens. Tom Udall and Martin Heinrich and U.S. Reps. Steve Pearce, Ben Ray Lujan and Michelle Lujan Grisham announced that they are urging the Department of Defense to select a proposal led by a team that includes the University of New Mexico in a competition to create a national photonics hub. The team, a collaboration of academic institutions from New Mexico and three other states, was named a finalist earlier this year. If selected, it will receive federal funding and support and become part of a network of regional manufacturing institutes or "hubs" across the country that help bridge the gap between applied research and product development. The hub would spur the development of cutting-edge technology and create high-tech jobs in the Albuquerque area.

Marktech Optoelectronics Announces High Reliability Photo Reflectors.
March 25, 2015
  Latham, NY (PRWEB) March 25, 2015           Marktech Optoelectronics is releasing a new line of High Reliability Photo Reflectors. These Photo Reflectors are sensors that contain both the emitter and photo detector functions within a single package. Emitted light from the Marktech sensor is reflected back to the detector side as an object enters the sensing area. This series of Marktech sensors is ideally suited for applications including edge sensing, line sensing, coin bill validation and bar code reading.           Standard product is offered in a compact high reliability 4mm plastic package with a wavelength range from 468nm to 950nm and optimal operational distance is 0.5mm-1.5mm. According to Marktech's CTO, Vince Forte, "Marktech's standard reflective switches offer superior alignment and sensitivity making them ideal for position sensing applications. In addition emitter/detector combinations are available from UV to SWIR".     These products are available for sale on Digikey for immediate purchase.         In addition to standard products, custom packaging configurations including COB (Chip on Board), arrays, modules or multichip packages are available. Marktech offers LED emitter and detector products ranging from Deep UV 360nm to Mid IR 2.6?m. Marktech in house processes include LED chip growth, dicing and packaging.

Senate Armed Services Subcommittee on Strategic Forces Hearing; Ballistic Missile Defense Programs in Review of the Defense Authorization Request for FY2016 and the Future Years Defense Program.; Testimony by David Mann, Commanding General U.S. Army Space And Missile Defense Command/ Army Forces Strategic Command And Joint Functional Component Command For Integrated Missile Defense
March 25, 2015
Chairman Sessions, Ranking Member Donnelly, and distinguished Members of the Subcommittee, thank you for your continued support of our Service Members, Civilians, and Families. In the same capacity as my previous appearances before this subcommittee, I appear before you today bringing both a Joint and Army perspective on effective missile defense capabilities. Let me again express my appreciation to this Subcommittee for its continued support of the Army, the U.S. Strategic Command, the Department of Defense, and the missile defense community. I am honored to testify before this Subcommittee along with these distinguished witnesses who provide missile defense capabilities to our Nation, forward deployed forces, partners, and allies.

OSAT manufacturer selects Rudolph's lithography system
March 20, 2015
HIGHLIGHT: Rudolph Technologies, Inc., a provider of process characterization equipment and software, has announced that an outsourced assembly and test, or OSAT, manufacturer has selected the JetStep Advanced Packaging Lithography System for evaluation.


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