American Tower (AMT) Earnings Report: Q4 2014 Conference Call Transcript
February 24, 2015
The following American Tower conference call took place on February 24, 2015, 08:30 AM ET. This is a transcript of that earnings call: Company Participants Leah Stearns; American Tower; SVP, Treasurer, IR Jim Taiclet; American Tower; Chairman, President, CEO Tom Bartlett; American Tower; EVP, CFO Other Participants Amir Rozwadowski; Barclays; Analyst Ric Prentiss; Raymond James; Analyst Jonathan Schildkraut; Evercore; Analyst MANAGEMENT DISCUSSION SECTION Operator:

Advanced Materials Pioneer, Inkron, Emerges from Stealth with Two Next Generation LED Product Lines; -- Inkron debuts at Strategies in Light 2015 targeting device manufacturers, LED packaging houses and lighting system integrators
February 24, 2015
Strategies in Light -- Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries, emerged from stealth today to introduce two flagship product series for next generation LED applications in solid state lighting, display and mobile devices: the Inkron Die Attach (IDA) and Inkron LED Encapsulation (ILE) product series. Based on novel nanomaterials and siloxane polymer chemistries, Inkron's core technology platform enables new categories of LEDs with increased efficiency and reliability at lower cost. Inkron is currently in product qualification with development partners and customers in Asia, Europe and U.S. Please visit us in Las Vegas at Strategies in Light 2015 conference at booth #436. As the trend in LED applications continues to focus on improving device efficiency and lifetime while lowering cost, key challenges facing next generation LEDs include the utilization of novel phosphors (e.g. environmentally sensitive narrow bandwidth phosphors like quantum dots), optimization of LED packaging to increase reliability and enablement of advanced packaging concepts such as wafer level and chip-scale packaging. Inkrons' novel LED encapsulants (ILE) and die attach pastes (IDA) address all these areas and provide new opportunities and options to device manufacturers, LED packaging houses and lighting system integrators.

Washington: APPLE IPAD 64 GB WITH KEYBOARD Sale-Lot Number: 41QSCI15243001
February 24, 2015
U.S. General Services Administration has issued the following auction details: APPLE IPAD 64 GB WITH KEYBOARD Sale-Lot Number: 41QSCI15243001 City, State: Indianapolis, IN Current Bid: 175 USD Bidders: 4 Close Time: 03/02 12:00 NOON CT * Time Remaining: 6 Days, 1 Hours, 10 Minutes United States Marshals Service

Management Alum and Entrepreneur Dustin Smith
February 24, 2015
Azusa Pacific University has issued the following news release: Makers Scramble to Create Cases for Intel Arduino Board Engrained developed two laser-cut cases for new Arduino-compatible Galileo board in two weeks. Nineteen days before a major international product launch, a two-person startup working out of a garage in Tacoma, Wash. was asked to create a case for a product they’d never seen. The founders of Engrained Products burned the midnight oil and delivered not one, but two cases for the new Intel Galileo board. Intel CEO Brian Krzanich announced the new Arduino-compatible microcontroller board based on the company’s new Quark SoC at the Maker Faire in Rome, Italy. The Galileo board is the first in a family of development boards designed to be affordable and accessible to makers and DIY computer enthusiasts. The launch of the Galileo board kicks off a collaboration agreement between Intel and Arduino, the leading open-source hardware platform.

Apple and IBM Deliver First Wave of IBM MobileFirst for iOS Apps
February 24, 2015
India, Feb. 24 -- CUPERTINO, California and ARMONK, New YorkDecember 10, 2014Apple and IBM today deliver the first wave of IBM MobileFirst for iOS solutions in a new class of made-for-business apps and supporting cloud services that bring IBMs big data and analytics capabilities to iPhone and iPad users in the enterprise. IBM MobileFirst for iOS solutions are now available to enterprise customers in banking, retail, insurance, financial services, telecommunications and for governments and airlines, thanks to an unprecedented collaboration between Apple and IBM. IBM clients today announcing support for IBM MobileFirst for iOS solutions include: Citi, Air Canada, Sprint and Banorte. What were delivering aims directly at the new quest of businesssmart technologies that unlock new value at the intersection of big data and individual engagement, said Bridget van Kralingen, senior vice president, IBM Global Business Services. Our collaboration combines IBMs industry expertise and unmatched position in enterprise computing, with Apples legendary user experience and excellence in product design to lift the performance of a new generation of business professionals.

Packaging Engineer
February 23, 2015
Altera has issued the following Job vacancy: Packaging Engineer Location: US-CA-San Jose Requisition ID: 4724 # of openings: 1 Description As a Packaging Engineer, you must have thermal, mechanical and physical package design skills. You will work in a team atmosphere which is also required to achieve the highest possible performance while maintaining the product requirements (cost). The position will aid in the design of power products at Altera's Headquarters in San Jose, CA. You specific responsibilities will include but are not limited to the following:

EARTH TALK; Recycling can mitigate problem of e-waste
February 23, 2015
Dear EarthTalk: The collective impact of all the iPhones and other devices we buy, use and then discard must be mind-boggling at this point. Has anyone quantified this and what can we do to start reducing waste from such items? - Jacques Chevalier, Boston, Mass. With a record four million pre-orders for Apple's best-selling iPhone 6 and iPhone 6 Plus, it's more evident than ever that consumers want the latest in smartphone technology at their fingertips. A new report by analysts at German market research firm GfK determined that global smartphone sales exceeded 1.2 billion units in 2014 - a 23 percent increase over 2013.

Samsung to supply chips for new LG, Apple smartphones
February 23, 2015
Samsung Electronics has agreed with LG Electronics and Apple to supply advanced DRAM chips for their new range of smartphones, two people familiar with the deal said Monday. Estimated to be worth billions of dollars, the deal may signal the start of a thaw in the recent icy relationship between Samsung Electronics and Apple, as well as LG Electronics and Samsung Electronics.

Mentor Graphics signs distribution agreement with CADD Edge
February 18, 2015
HIGHLIGHT: Mentor Graphics Corporation, a supplier of electronic design automation tools, has signed an agreement with CADD Edge, Inc., a provider of 3D CAD design software, to provide Mentor Graphics electronic systems design products to customers in the eastern US.

Mycronic receives order for two FPS mask writers for electronic packaging
February 18, 2015
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