EZ-BoardWare PCB Contact from Harwin is Secure and Cost-effective
September 16, 2014
New SMT socket accommodates wider range of pins Salem, NH - Harwin, the leading SMT board hardware and hi-rel connector manufacturer has expanded its popular EZ-BoardWare PCB socket portfolio with a new contact which can accommodate mating pins ranging from 0.8mm to 1.5mm in diameter. These new products complement an existing range, enabling Harwin to offers parts with pin diameters from 0.8mm to 1.8mm. A cost-effective alternative to turned PCB sockets, EZ-Board sockets are designed for SMT assembly and are ideally-suited for high volume applications. The components come in industry-standard tape & reel packaging, allowing them to be automatically placed which minimises installed cost.

eASIC Joins Open NAND Flash Interface (ONFI) Working Group
September 16, 2014
Calif., Sept. 16 -- eASIC(R) Corporation, the leading provider of Single Mask Adaptable ASIC(TM) devices has announced that it has joined the Open NAND Flash Interface (ONFi) Working Group, an organization of industry-leading companies dedicated to simplifying the integration of NAND flash memory into consumer electronics devices, computing platforms and industrial systems.

-Lockheed Martin and Advanced Electronics Company to Establish Sniper Pod Support Facility in Saudi Arabia
September 16, 2014
ENP Newswire - 16 September 2014 Release date- 15092014 - Orlando, Fla.,- Lockheed Martin [NYSE: LMT] and Advanced Electronics Company (AEC) will establish a Sniper Advanced Targeting Pod (ATP) Expanded Repair Capability facility in the Kingdom of Saudi Arabia - the first Sniper support facility established outside the United States.

SUNY CNSE selects Rudolph's Discover Enterprise YMS for G450C program
September 10, 2014
HIGHLIGHT: Rudolph Technologies, Inc. has announced that the SUNY College of Nanoscale Science and Engineering, or CNSE, Albany, New York, has selected its Discover Enterprise Yield Management Software, or YMS, to provide an integrated data warehouse and analytics system for the Global 450 Consortium, or G450C, equipment development program.

Intel announces two new packaging and test technologies for foundry customers
September 10, 2014
HIGHLIGHT: Intel Corporation, which designs and manufactures integrated digital technology platforms, has announced two new packaging and test technologies for foundry customers.

Polyvinyl Chloride (PVC) Industry Expected to Reach USD 79.11 Billion by 2020 - By Grand View Research Inc
August 25, 2014
The global market for polyvinyl chloride (PVC) is expected to reach USD 79.11 billion by 2020 according to a new study by Grand View Research Inc. Increasing construction and infrastructure spending in emerging markets of Asia Pacific and Latin America is expected to remain a key driving factor for global PVC demand. In addition growth of global automotive industry is also expected to have a positive influence on the market. Volatile raw material prices coupled with the stringent regulatory scenario particularly in North America and Europe to limit or minimize PVC use for medical applications are expected to remain key challenges for market participants.

Green America Apple (AAPL) Takes First Steps To Protect Workers From Toxins
August 21, 2014
class="blk00-16b">Green America: Apple (AAPL) Takes First Steps To Protect Workers From ToxinsApple responds to over 23000 comments from concerned consumers. More needs to be done to protect workers. class="c15">Ideas get bigger when you share them...WASHINGTON D.C. - August 14 2014 (Investorideas.com renewable energy stocks newswire) Green America announced today that it is pleased with Apple's August 13 announcement that it is taking first steps to protect the workers who make their products from dangerous chemical exposures. Apple announced that it is banning the use of benzene and n-hexane in the final assembly of its products.Green America continues to urge Apple to go further to ensure the safety of all workers in its supply chain.

Global and China IC Advanced Packaging Industry Report 2013-2014brbr
August 16, 2014
During 2011-2013 the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized thus leading to a dramatic decline in unit prices these packaging technologies including FC-BGA WLCSP QFN SiP and PoP etc.

JSB Market Research Polyurethane (PU) Foams Market by Types (RigidFlexible), End-User Industries
August 06, 2014
Polyurethane foam is one of the most widely used polymeric foam in the world, finding applications in almost all the modern industries. Polyurethane foams are made primarily by reacting diisocyanates (MDI or TDI) with polyols and other chemicals. Polyurethane occurs in mainly two forms; Polyurethane foams and Polyurethane non foams. Polyurethane foams are classified on the basis of their commercially available forms as Flexible polyurethane foams and Rigid polyurethane foams. Flexible foams are used mainly as a cushioning material in transportation, bedding & furniture, packaging, etc.; whereas, rigid foams are used primarily as an insulation material in construction and refrigeration applications.

Microsoft sues Samsung in US for contract breach
August 03, 2014
W YORK Aug 2 (Agencies): Microsoft on Friday fired a legal salvo at longtime partner Samsung accusing the South Korean giant of breaching a contract over licensing of technology used in the competitive smartphone market. 'After becoming the leading player in the worldwide smartphone market Samsung decided late last year to stop complying with its agreement with Microsoft' the US technology firm's deputy counsel said in an online post. The complaint filed in federal court in New York alleges Samsung is balking at making payments for patented Microsoft technology used in smartphones and tablets. Complaint 'We will review the complaint in detail and determine appropriate measures in response' Samsung told AFP. Microsoft contends the South Korean consumer electronics colossus is not adhering to a contract from 2011 and said it filed the court action after months of 'painstaking negotiation.' The legal pact involved Samsung paying to use Microsoft intellectual property according to the post by deputy counsel David Howard. Samsung's smartphone sales have quadrupled since the contract was signed as the company grew from shipping 82 million Android-powered handsets in 2011 to shipping 314 million three years later Microsoft maintained. Samsung has become a smartphone Goliath and the biggest maker of handsets powered by Google's free Android software.   'Samsung predicted it would be successful but no one imagined their Android smartphone sales would increase this much' Howard said. After Microsoft made a deal last year to buy Nokia's smartphone business Samsung stopped abiding by the cross-licensing contract the US company says.


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