Inside a Chinese 'Taobao village'
October 23, 2014
Xiniujiao village of Baiyun district in Guangzhou is a typical "taobao village" in China. People are busy packaging products in Xiniujiao village of Baiyun district, Guangzhou on Sept 20, 2014. It is a typical "taobao village" in China, as nearly every family has opened stores on Taobao, the Chinese equivalent of eBay. Express delivery firms abound there. [Photo/CFP]

Security on agenda as Apple head visits
October 23, 2014
Apple Inc Chief Executive Tim Cook discussed information security issues with Vice-Premier Ma Kai in Beijing on Wednesday amid security concerns involving the United States-based company's cloud storage service.

Gift Smart This Holiday Season with RadioShack; Gift Smart and Pay Smart this Holiday Season With Interactive Toys, Exclusive Gifts, Price Matching and New Payment Options
October 22, 2014
 RadioShack is stocking its shelves with innovative products and debuting exceptional services to enable customers to gift smarter than ever this holiday season. "Our exclusive lineup of Christmas gifts, expanded assortment of private-label products and new industry-leading payment options make RadioShack the smart place to shop this season," said Joe Magnacca, chief executive officer at RadioShack. "RadioShack's knowledgeable associates are ready to serve customers to ensure they find the perfect gift at the right price with our expanded price-match guarantee." Outsmart Holiday Gifting Smart shopping starts with finding the right gift the first time. RadioShack's curated selection of interactive toys and innovative products are topping must-have lists this season.

ARM Extends Scalability of CoreLink for Infrastructure Compute
October 22, 2014
ARM today announced new additions to its suite of enterprise-class ARM® CoreLink(TM) Cache Coherent Network (CCN) SoC interconnects, underscoring its commitment to providing a flexible architecture from sensors to servers. The CoreLink CCN-502 and CoreLink CCN-512 interconnects extend the current family for data center and infrastructure equipment that scales from the edge of the network to the core. "Growth in mobile computing and the Internet of Things is connecting more devices and aggregating more data across the network, and that demands an increasingly flexible and efficient computing infrastructure," said James McNiven, general manager, systems and software group, ARM. "Our new CoreLink CCN-502 and CoreLink CCN-512 interconnects build on a common architecture, scaling from high efficiency Power-over-Ethernet wireless access points, to high compute density 48-core solutions."

Intel CEO Brian Krzanich to Keynote at 2015 International CES; Krzanich returns to keynote stage to discuss Intel's vision for how technology will continue to shape our lives
October 22, 2014
The Consumer Electronics Association (CEA)® today announced that Intel Corporation CEO Brian Krzanich will deliver a keynote address at the upcoming 2015 International CES®. Owned and produced by CEA, the 2015 CES, the world's gathering place for all who thrive on the business of consumer technologies, will run January 6-9, 2015, in Las Vegas, Nevada. Intel Corporation CEO Brian Krzanich (Photo: Business Wire)

Penton's Aviation Week Announces Finalists of 58th Annual Laureate Awards, Honoring Outstanding Achievements in Aviation, Aerospace & Defense
October 22, 2014
Finalists of the58th Annual Laureate Awards, honoring extraordinary achievements in the global aerospace arena, were announced yesterday.  The awards will be presented on Thursday, March 5, 2015 at the National Building Museum in Washington, DC, byPenton'sAviation Week, the largest multimedia information and services provider to the global aviation, aerospace and defense industries. "Since their debut in the 1950s, Aviation Week's Laureate Awards have shined a spotlight on the industry's greatest innovators and achievers," said Aviation Week & Space Technology Editor-in-Chief Joseph C. Anselmo. "We recognize both the finalists and the winners for their vision and for inspiring others to strive for progress."

Si2 to Sponsor "3D Architectures for Semiconductor Integration and Packaging Conference"; Si2 Keynote Address Will Focus on a 3D Design Ecosystem for IoT
October 22, 2014
Silicon Integration Initiative (Si2) announced today its sponsorship of the 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP). This conference will be held December 10-12, 2014, at the Hyatt Regency San Francisco Airport, Burlingame, California, and is organized by RTI International. Steve Schulz, President and CEO of Si2, will deliver one of the keynote addresses, "A Design Ecosystem for Internet of Things, How 3D IC Standards will Enable a New Growth Paradigm."

U.S. Army Chemical Materials Activity: Electronics Mechanic SWAU142447891240567
October 22, 2014
Office of Personnel Management has issued the following job announcement: Job Title:Electronics Mechanic Department:Department of the Army Agency:U.S. Army Chemical Materials Activity Job Announcement Number:SWAU142447891240567 SALARY RANGE: $22.85 to $26.72 / Per Hour OPEN PERIOD: Wednesday, October 22, 2014 to Wednesday, November 5, 2014 SERIES & GRADE: WG-2604-11 POSITION INFORMATION: Full Time - Permanent DUTY LOCATIONS: 1 vacancy in the following location: Richmond, KY View Map WHO MAY APPLY: Status Candidates (Merit Promotion and VEOA Eligibles) SECURITY CLEARANCE: Not Applicable SUPERVISORY STATUS: No JOB SUMMARY: Civilian employees serve a vital role in supporting the Army mission. They provide the skills that are not readily available in the military, but crucial to support military operations. The Army integrates the talents and skills of its military and civilian members to form a Total Army. About the Position:

October 22, 2014
The following information was released by Binghamton University (SUNY): Binghamton University now has a Center of Excellence building worthy of its title. University President Harvey G. Stenger on Wednesday joined with Sen. Thomas W. Libous, Assemblywoman Donna A. Lupardo, University faculty and staff, industry partners, community leaders and members of the public to celebrate the opening of a $30 million, 114,000-square-foot facility on Murray Hill Road in Vestal. The Small Scale Systems Integration and Packaging center (S3IP) and its interdisciplinary teams of engineers and scientists recently moved into the glass, metal and stone building. The facility joins the Engineering and Science Building and Biotechnology Building at the Innovative Technologies Complex. A fourth building, the Smart Energy Research and Development Facility, is under construction and expected to open in 2017.

Notice Pursuant to the National Cooperative Research and Production Act of 1993; Telemanagement Forum
October 22, 2014
Office of the Federal Register has issued the following notice: Notice is hereby given that, on September 16, 2014, pursuant to Section 6(a) of the National Cooperative Research and Production Act of 1993, 15 U.S.C. 4301 et seq. (“the Act”), Telemanagement Forum (“The Forum”) has filed written notifications simultaneously with the Attorney General and the Federal Trade Commission disclosing changes in its membership. The notifications were filed for the purpose of extending the Act's provisions limiting the recovery of antitrust plaintiffs to actual damages under specified circumstances. Specifically, the following parties have been added as members to this venture: NetYCE, Amsterdam, THE NETHERLANDS; Intense Technologies Limited, Secunderabad, INDIA; Enhancesys Innovations LLC, Cupertino, CA; Limtel Sp.


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