Peregrine Semiconductor debuts UltraCMOS Global 1 RFFE system in China
April 16, 2014
HIGHLIGHT: Peregrine Semiconductor Corp., a developer of radio frequency, or RF, solutions, has announced the Greater China debut of UltraCMOS Global 1, a reconfigurable RF front-end, or RFFE, system.

KYOCERA America, Inc. Introduces Line Of Epoxy Encapsulation Materials For Semiconductor Industry
April 16, 2014
Wednesday, April 16, 2014: Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was transferred from Kyocera Industrial Ceramics Corporation to Kyocera America, Inc., based in San Diego, California, effective April 1, 2014.

(MOCVD) Metal Organic Chemical Vapor Deposition Equipment Market 2014-2018
April 16, 2014
April 16, 2014 ReportsnReports.com offers "Global Metal Organic Chemical Vapor Deposition (MOCVD) Equipment Market 2014-2018" research report in its store. MOCVD equipment is a tool used by semiconductor manufacturers for depositing a very thin layer of compound semiconductor material onto a semiconductor wafer. It is predominantly used in the manufacturing process of III-V compound semiconductors, especially for those that use GaN. These semiconductors are the most important base material for manufacturing LEDs, lasers, power transistors, and photovoltaic cells. Thus, MOCVD equipment is used for manufacturing complex semiconductor multilayer structures that are used in electronic and optoelectronic components. This not only increases the performance of the semiconductor device, but also delivers higher efficiency and switching speed.

United States: U.S. v. Yeh Illustrates The Challenges In International Trade Secrets Cases
April 16, 2014
On March 14, 2014, a Texas jury acquitted former Texas Instruments ("TI") employee Ellen Chen Yeh on all counts brought against her arising from her admitted downloading of Texas Instruments proprietary information before leaving the company for a China-based semiconductor manufacturer. The Yeh trial illustrates a number of important issues related to government trade secrets enforcement in the increasingly global knowledge economy. Defendant Ellen Chen Yeh worked as a design engineer at TI's Dallas headquarters from September 20, 1993 to March 11, 2005. In her role at TI, Ms. Yeh had access to a significant amount of confidential manufacturing process information concerning certain TI semiconductor chip products. Several weeks after her employment ended, Yeh and her husband planned to move to Shanghai, China, where both Yeh and her husband had obtained employment with a Taiwan-based semiconductor design company. In the weeks leading up to her departure from TI, Ms. Yeh admittedly downloaded proprietary information from TI and burned some of it onto CDs.

Lattice Semiconductor introduces ECP5 family for microserver applications
April 15, 2014
HIGHLIGHT: Lattice Semiconductor Corp. has announced its ECP5 family for small-cell, microserver, broadband access, industrial video and other applications.

Samsung discovers method to commercialize new material for electronics
April 15, 2014
India, April 15 -- Samsung Electronics claims to announce a breakthrough synthesis method to speed the commercialization of graphene, a unique material ideally suited for electronic devices. Samsung Advanced Institute of Technology (SAIT), in partnership with Sungkyunkwan University, became the first in the world to develop this new method.

GainSpan and GEO Semiconductor unveil Full HD resolution video ADK
April 14, 2014
HIGHLIGHT: GainSpan Corporation, a semiconductor solutions company, and GEO Semiconductor, Inc. have announced the GS2000 Full HD Video Application Development Kit, or ADK.

Research and Markets: Diamond Materials for Semiconductor Applications Report
April 10, 2014
April 10 -- Research and Markets has announced the addition of the "Diamond Materials for Semiconductor Applications Report" report to their offering. $43M diamond material market in 2020 will be driven mainly by passive devices. Diamond materials have been in development for more than 50 years. Besides the traditional tooling applications (drilling, cutting), the interest in diamond continues to grow for optical and thermal applications, and for new applications in semiconductor devices such as high-power devices and high-frequency devices able to work at elevated temperatures.

April 04, 2014
WASHINGTON, April 4 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by Senior VP for Finance and Chief Financial Officer Kevin S. Bauer, Fremont, Calif.

April 03, 2014
WASHINGTON, April 3 -- ON Semiconductor Corp., Phoenix, files Form 8-K (current report) with Securities and Exchange Commission on April 2. State or other jurisdiction of incorporation: Delaware


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