Headlines


FORM 8-K: GIGAMON FILES CURRENT REPORT
July 23, 2014
WASHINGTON, July 23 -- Gigamon Inc., Santa Clara, Calif., files Form 8-K (current report) with Securities and Exchange Commission on July 22. State or other jurisdiction of incorporation: Delaware Item 5.02 Departure of Directors or Certain Officers; Election of Directors; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers (b), (c) and (e)

PERICOM SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY CEO HUI (California)
July 23, 2014
WASHINGTON, July 23 -- Pericom Semiconductor Corp. (PSEM), San Jose, Calif., has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by CEO, President and Director Chi Ming Hui Alex, Milpitas, Calif. On July 17 the action involved acquisition of 33,907 shares of stock. Hui now owns 1.25 million shares of stock directly. Pericom Semiconductor Corp. provides integrated connectivity solutions. For any query with respect to this article or any other content requirement, please contact Editor at htsyndication@hindustantimes.com

MICRON TECHNOLOGY REPORTS MULTIPLE TRANSACTIONS BY VP LEGAL AFFAIRS POPPEN (Idaho)
July 23, 2014
WASHINGTON, July 23 -- Micron Technology Inc. (MU), Boise, Idaho, has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by VP for Legal Affairs, Corporate Secretary and General Counsel Joel L. Poppen, Boise.

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo. While expectations are for smart devices to sustain a compact form factor, consumers also expect powerful performance and low power consumption. The challenge for the semiconductor industry is to meet these needs by addressing system and integration scaling in the electronics market[1]. The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning[2], further development of 3D Integrated Circuits (IC)[3], quality control, and finally, the assembly and high-volume manufacturing of chips. Full details of the labs' capabilities are available in Annex A.

A*STAR and Industry Form S$200M Semiconductor R&D Joint Labs
July 23, 2014
Public-Private Partnership to drive innovative solutions for complex micro chip manufacturing Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. The Advanced Semiconductor Joint Labs will develop and advance semiconductor technologies for future electronics markets. The industry partners involved in this international collaboration are: Applied Materials, Dai Nippon Printing, DISCO, KLA-Tencor, Mentor Graphics, Nikon, Panasonic Factory Solutions Asia Pacific, PINK, Tokyo Electron Ltd. and Tokyo Ohka Kogyo. While expectations are for smart devices to sustain a compact form factor, consumers also expect powerful performance and low power consumption. The challenge for the semiconductor industry is to meet these needs by addressing system and integration scaling in the electronics market[1]. The four joint labs in lithography, wafer level packaging (WLP), metrology and assembly, will provide an integrated platform for semiconductor R&D, starting with patterning[2], further development of 3D Integrated Circuits (IC)[3], quality control, and finally, the assembly and high-volume manufacturing of chips. Full details of the labs' capabilities are available in Annex A.

Intel offer to iPad: Let`s Make Cheap Tablets
July 23, 2014
Mr. Wang runs a small factory in this southern Chinese city, making tablet computers and printed circuit boards for local electronics brands in China and South America. His company, Shenzhen Hampoo Science & Technology Co., isn't well known, but it is exactly the kind of customer that the Silicon Valley giant is seeking.

Celestica Selects ON Semiconductor as an Honouree in 2013 Total Cost of Ownership Supplier Awards Program
July 23, 2014
ON Semiconductor has been recognized as an honouree in the 2013 Total Cost of Ownership Supplier Award program from Celestica.

Augmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast and
July 22, 2014
Reportbuyer.com has added a new market research report: Augmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast and https://www.reportbuyer.com/product/2051926/Augmented-Reality--Virtual-Reality-Market-by-Technology-Types-Sensors-Accelerometer-Gyroscope-Haptics-Components-Camera-Controller-Gloves-HMD-Applications-Automotive-Education-Medical-Gaming-Military--by-Geography---Global-Forecast-and.html Augmented Reality & Virtual Reality Market by Technology Types, Sensors (Accelerometer, Gyroscope, Haptics), Components (Camera, Controller, Gloves, HMD), Applications (Automotive, Education, Medical, Gaming, Military) & by Geography - Global Forecast and Analysis to 2013 - 2018 The Augmented reality and virtual reality (AR&VR) is going through a significant adoption in the training and infotainment sectors. The main motivation behind the significant adoption is the versatile range usage for these technologies (AR&VR).

Electronic Chemicals & Materials Market by Types (Silicon Wafer, PCB Laminate, Photoresist, Specialty Gases, etc.), Application (Semiconductor & IC, PCB), Forms (Solid, Liquid, Gaseous) & Geography - Regional Trends & Forecast to 2019
July 22, 2014
Reportbuyer.com has added a new market research report: Electronic Chemicals & Materials Market by Types (Silicon Wafer, PCB Laminate, Photoresist, Specialty Gases, etc.), Application (Semiconductor & IC, PCB), Forms (Solid, Liquid, Gaseous) & Geography - Regional Trends & Forecast to 2019 https://www.reportbuyer.com/product/2062523/Electronic-Chemicals--Materials-Market-by-Types-Silicon-Wafer-PCB-Laminate-Photoresist-Specialty-Gases-etc-Application-Semiconductor--IC-PCB-Forms-Solid-Liquid-Gaseous--Geography---Regional-Trends--Forecast-to-2019.html The electronic chemicals and materials market had revenue of $41 billion in 2013, with the highest share held by Asia-Pacific and ROW together accounted for 78%. The global market is projected to grow at a CAGR of 6.3% from 2014 to 2019. The highest investment is forecasted to be in Asia-Pacific, due to the growing application markets, low cost of production, and availability of raw materials especially in China. ROW is expected to have the highest growth of 6.5% from 2014 to 2019. The North American and European segments are expected to share together 19% of the revenue by 2019, growing at the rates of 4.1% and 2.8%, respectively between 2014 and 2019.

Nanometrics Announces Upcoming Investor Events
July 22, 2014
MILPITAS, Calif., July 22, 2014 (GLOBE NEWSWIRE) -- Nanometrics Incorporated (Nasdaq:NANO), a leading provider of advanced process control metrology and inspection systems, today announced the company's participation in the following investor events:


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