Headlines


Pure Wafer PLC Trading Update & Proposed Maiden Dividend
July 31, 2014
RNS Number : 8074N Pure Wafer PLC 31 July 2014 PURE WAFER PLC (AIM: PUR) Trading Update 31 July 2014 Pure Wafer plc ("Pure Wafer" or "the Company"), one of the leading global providers of high quality silicon wafer reclaim services to many of the world's largest semiconductor manufacturers and foundries as an integral part of their cost control programmes, is pleased to provide the following update on current trading in advance of the announcement of the Company's preliminary results for the year ended 30 June 2014, which are expected to be released during the week commencing 6 October 2014.

Sony DADC BioSciences and TSMC Garner AACC Industry Division Award
July 31, 2014
The 2014 American Association for Clinical Chemistry (AACC) awarded Sony DADC BioSciences and Taiwan Semiconductor Manufacturing Co. (TSMC) with its Best Abstract of Interest to the Industry Division Award.

Cavium Joins Red Hat Partner Early Access Program; Collaboration to accelerate ARMv8 Server Software Ecosystem for ThunderX(TM) Workload Optimized Processor Family
July 30, 2014
 Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking announced today that it has joined the Red Hat ARM Partner Early Access Program (PEAP). This collaboration will directly benefit Cavium partners and customers by enabling access to Red Hat software, documentation and tools for ThunderXTM.

Cavium to Acquire Switching and SDN Specialist Xpliant to Accelerate Deployment of Software Defined Networks; Developer of Intelligent, High Performance, High Density Switch Silicon
July 30, 2014
 Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, service provider wired and wireless networking, today announced a definitive agreement to acquire Xpliant, Inc., a privately held company headquartered in San Jose, California. Xpliant is a provider of high performance, high density switch silicon targeting a broad range of switching applications for the data center, cloud, service provider and enterprise markets. The total acquisition cost is projected to be approximately $90 million, which includes payments to stockholders, note holders and other liabilities and costs. Cavium was an investor in Xpliant having provided $15 million of funding to Xpliant through June 2014, which is included in that total cost estimate.  The remaining $75 million will be comprised of approximately $40 million in cash and $35 million in stock.

Leading Chinese LED Manufacturer Chooses Veeco MOCVD Systems for Expansion into GaN LED Market
July 30, 2014
Veeco Instruments Inc. (Nasdaq:VECO) announced today that Xiamen Changelight Co., Ltd. (Changelight) has selected the Company as its primary equipment provider as it enters the market to produce gallium nitride (GaN) based blue/green high brightness light emitting diodes (LEDs) for display and general lighting applications. During the second quarter of 2014, Changelight ordered multiple TurboDisc® MaxBright® M(TM) GaN Metal Organic Chemical Vapor Deposition (MOCVD) Systems. In addition, Changelight purchased a TurboDisc K475(TM) MOCVD system to expand its production of red, orange and yellow (ROY) LEDs.

Samsung Semiconductor to Keynote on Vertical NAND and Other Flash Advances, Plus Present in Eight Sessions at 2014 Flash Memory Summit
July 30, 2014
Two top vice presidents at Samsung Semiconductor Inc. will discuss the continued evolution of Vertical NAND and its impact on the new data center, as well as other NAND memory advancements, in a keynote to be delivered at the Flash Memory Summit at noon on Tuesday, August 5th in the Mission City Ballroom at the Santa Clara Convention Center.

Airoha Technology Adopts Cadence RTL Synthesis and Test Solution, Reducing Power Consumption by 15 Percent; Encounter RTL Compiler and Encounter Test also reduced test pattern count by 10 percent on Bluetooth wireless radio chip
July 30, 2014
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Airoha Technology Corp. adopted the Cadence® Encounter® RTL Compiler and Cadence Encounter Test solutions after a rigorous competitive evaluation, and achieved a 15 percent reduction in power consumption and 10 percent reduction in test pattern count on a Bluetooth wireless radio chip. Encounter RTL Compiler employs unique global mapping technology and advanced clock gating to reduce power consumption without compromising design performance goals.

Vishay Intertechnology Provides Direct Link to Featured Products with new iPad® App
July 30, 2014
Vishay Intertechnology, Inc. (NYSE:VSH) today announced the availability of a Vishay app for the Apple iPad® that makes it easy for users to access the company's Super 12 and Engineer's Toolbox collections of industry-leading semiconductor and passive devices.

Freescale Announces New Industrial Accelerometer as Company Ships Its Two-Billionth Sensor; New, high-bandwidth accelerometer engineered to meet stringent requirements of the industrial market
July 30, 2014
Freescale Semiconductor (NYSE: FSL) today celebrated the recent shipment of its two-billionth sensor by launching a new, high-bandwidth 3-axis analog accelerometer engineered to detect ultra-high frequency motion and vibration in industrial motors and equipment. Building on its longtime strength in automotive sensors, Freescale has experienced strong market acceptance across the breadth of its sensors portfolio, including its increasingly popular devices for the growing industrial and medical markets. Customers have incorporated Freescale sensors in more than 150 unique sensing applications each year for the last five years. Freescale's new FXLN83xxQ accelerometer underscores the company's industrial sensing momentum. Designed to capture acceleration information often missed by less accurate sensors commonly deployed in consumer products such as smartphones and exercise activity monitors, the new device enables intelligent algorithms to better perform fault prognostication for predictive maintenance and condition monitoring applications.

Texas Instruments surpasses shipment of 15 million SoCs enabling the automotive industry to redefine advanced driver assistance systems; Awarded 2014 Frost & Sullivan Product Leadership for Semiconductor Solutions
July 30, 2014
 Confirming a leadership position in the automotive market, today Texas Instruments (TI) (NASDAQ: TXN) announces that more than 15 million of TI'sadvanced driver assistance systems (ADAS)System-on-Chip (SoC) devices are on the road. TI's open and flexible solutions are in series production in over 25 OEMs and over 100 car models, and are designed to help reduce the number of road collisions and enable more autonomous driving experiences.  With common hardware and software architecture across camera based front (mono and stereo), rear, surround view and night vision applications, as well as mid- and long-range radar and sensor fusion systems, TI's scalable solutions allow for reuse and reduced time and cost to market. Leveraging more than 30 years in signal processing, safety and automotive experience, TI developed the TDAx family of SoC processors to enable customers to further drive innovation and differentiation in ADAS applications.   


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