Peregrine Semiconductor Becomes Member of Automotive Electronics Council
November 24, 2014
Peregrine Semiconductor Corp. reported its acceptance as a technical committee member on the Automotive Electronics Council (AEC). The AEC provides common part-qualification and quality-system standards for the automotive electronics industry.

The salesman who became president; With Asia's growth, international companies are looking to the region to establish bases and for talented people to lead them. The Economic Development Board has in place talent-grooming programmes so that Singaporeans can meet the demand for business leaders. In the final of a seven-part series, Arti Mulchand talks to three people involved in such programmes.
November 24, 2014
WHEN Russell Tham's housemate landed a job with Applied Materials in 1993, doing something with "chips", he thought they were of the edible kind. "Chips to me meant food," says the 46-year-old, now president of Applied Materials South-east Asia.

Tech firm eyeing Gurnee strikes deal with Argonne
November 24, 2014
Federal officials have granted an exclusive licensing agreement for diamond semiconductor technology to a company that wants to move to Gurnee. Representatives for AKHAN Semiconductor Inc. announced the deal was reached with the U.S. Department of Energy's Argonne National Laboratory. Under the agreement with Argonne, AKHAN is expected gain a competitive advantage by becoming the first U.S. company to fully develop its cutting-edge diamond semiconductor process.

CM urges PM not to shift big-ticket project out of UP
November 24, 2014
Lucknow, Nov. 24 -- Chief minister Akhilesh Yadav has sought Prime Minister Narendra Modi's intervention to ensure that the Centre's ' 34,399 crore semiconductor wafer fabrication (FAB) manufacturing facility project is not shifted out of Uttar Pradesh. The letter has been written amid indications that the state may be deprived of the major employment generating project.

ON Semiconductor Teams with ICs
November 24, 2014
ON Semiconductor has entered into a licensing/development agreement with ICs in order to bring application specific integrated circuits to market, which are resilient to radiation effects. According to a media release, radiation hardened by design ASICs created through this agreement will be based upon ON Semiconductor's ONC110 110 nanometer process for ASIC designs and production. The introduction of RHBD ASICs extends the company's military and aerospace offering that includes ITAR compliance, DMEA Trusted Supplier accreditation and DO-254 support.

US Contract Notice: Defense Logistics Agency Issues Solicitation for "SEMICONDUCTOR DEVICE"
November 23, 2014
Defense Logistics Agency, DLA Acquisition Locations Officer has issued requirement for "SEMICONDUCTOR DEVICE." Solicitation no. SPM7M113UC550 Posted on: November 22, 2014

TSMC to turn new plant into packaging facility, says analyst
November 22, 2014
Taiwan Semiconductor Manufacturing Co. (TSMC) will turn a plant recently purchased from Qualcomm into a facility devoted to the development of the advanced integrated fanout waferlevel packaging (InFOWLP) technology, said a Hong Kongbased institutional investor.

Amtech announces repeat order from US based Mission Solar Energy for its n-type bifacial solar PV cell production line
November 21, 2014
Amtech Systems Inc. (Tempe, Arizona, US) a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, on November 20th, 2014 announced its subsidiary, Tempress Systems, has received a multi-million dollar order (in the low tens) for its solar equipment, including PECVD.

FTC delays decision on Applied, Electron deal
November 21, 2014
The Fair Trade Commission (FTC) has put off a decision on whether to approve Applied Materials' acquisition of Tokyo Electron (TEL) until next year due to regulatory issues.

SCHOTT announces launch of HermeS wafers
November 20, 2014
HIGHLIGHT: SCHOTT AG, a German developer and manufacturer of industrial specialty glass products, has announced the launch of HermeS wafers with hermetically sealed solid 'Through Glass Vias', or TGV.


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