Headlines


KYOCERA America, Inc. Introduces Line Of Epoxy Encapsulation Materials For Semiconductor Industry
April 16, 2014
Wednesday, April 16, 2014: Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was transferred from Kyocera Industrial Ceramics Corporation to Kyocera America, Inc., based in San Diego, California, effective April 1, 2014.

Nordic Semiconductor Releases Bluetooth Low Energy Protocol Stack for nRF51 Series
April 16, 2014
Ultralow power (ULP) RF specialist Nordic Semiconductor ASA has announced S110 SoftDevice v7.0, the next major release of its Bluetooth low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT and ANT/Bluetooth low energy multiprotocol SoCs.

Studio One Media and ON Semiconductor Set to Jointly Develop Audio Solutions
April 16, 2014
Studio One Media, Inc. has entered into an agreement with ON Semiconductor to develop integrated circuits (ICs) utilizing Studio One's AfterMaster audio technology and ON Semiconductor's DSP product development expertise.

United States: U.S. v. Yeh Illustrates The Challenges In International Trade Secrets Cases
April 16, 2014
On March 14, 2014, a Texas jury acquitted former Texas Instruments ("TI") employee Ellen Chen Yeh on all counts brought against her arising from her admitted downloading of Texas Instruments proprietary information before leaving the company for a China-based semiconductor manufacturer. The Yeh trial illustrates a number of important issues related to government trade secrets enforcement in the increasingly global knowledge economy. Defendant Ellen Chen Yeh worked as a design engineer at TI's Dallas headquarters from September 20, 1993 to March 11, 2005. In her role at TI, Ms. Yeh had access to a significant amount of confidential manufacturing process information concerning certain TI semiconductor chip products. Several weeks after her employment ended, Yeh and her husband planned to move to Shanghai, China, where both Yeh and her husband had obtained employment with a Taiwan-based semiconductor design company. In the weeks leading up to her departure from TI, Ms. Yeh admittedly downloaded proprietary information from TI and burned some of it onto CDs.

(MOCVD) Metal Organic Chemical Vapor Deposition Equipment Market 2014-2018
April 16, 2014
April 16, 2014 ReportsnReports.com offers "Global Metal Organic Chemical Vapor Deposition (MOCVD) Equipment Market 2014-2018" research report in its store. MOCVD equipment is a tool used by semiconductor manufacturers for depositing a very thin layer of compound semiconductor material onto a semiconductor wafer. It is predominantly used in the manufacturing process of III-V compound semiconductors, especially for those that use GaN. These semiconductors are the most important base material for manufacturing LEDs, lasers, power transistors, and photovoltaic cells. Thus, MOCVD equipment is used for manufacturing complex semiconductor multilayer structures that are used in electronic and optoelectronic components. This not only increases the performance of the semiconductor device, but also delivers higher efficiency and switching speed.

Global Silicon Reclaim Wafers Industry
April 15, 2014
Reportlinker.com announces that a new market research report is available in its catalogue: Global Silicon Reclaim Wafers Industry http://www.reportlinker.com/p02070086/Global-Silicon-Reclaim-Wafers-Industry.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor This report analyzes the worldwide markets for Silicon Reclaim Wafers in US$ Million. The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 54 companies including many key and niche players such as - Advantec Co Ltd.

Cadence Digital and Custom/Analog Tools Achieve TSMC V1.0 DRM Certification for 16nm FinFET Process; Full certification enables customers to tape out 16nm FinFET designs using Cadence tools
April 15, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's digital, custom/analog and signoff tools have been co-optimized with TSMC's 16nm FinFET process to enable higher performance, lower power consumption and smaller area for advanced designs.

Cadence Digital and Custom/Analog Tools Achieve TSMC V1.0 DRM Certification for 16nm FinFET Process; Full certification enables customers to tape out 16nm FinFET designs using Cadence tools
April 15, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's digital, custom/analog and signoff tools have been co-optimized with TSMC's 16nm FinFET process to enable higher performance, lower power consumption and smaller area for advanced designs.

Samsung discovers method to commercialize new material for electronics
April 15, 2014
India, April 15 -- Samsung Electronics claims to announce a breakthrough synthesis method to speed the commercialization of graphene, a unique material ideally suited for electronic devices. Samsung Advanced Institute of Technology (SAIT), in partnership with Sungkyunkwan University, became the first in the world to develop this new method.

Research and Markets: Diamond Materials for Semiconductor Applications Report
April 10, 2014
April 10 -- Research and Markets has announced the addition of the "Diamond Materials for Semiconductor Applications Report" report to their offering. $43M diamond material market in 2020 will be driven mainly by passive devices. Diamond materials have been in development for more than 50 years. Besides the traditional tooling applications (drilling, cutting), the interest in diamond continues to grow for optical and thermal applications, and for new applications in semiconductor devices such as high-power devices and high-frequency devices able to work at elevated temperatures.


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