Headlines


A cool idea; Electricity-free air conditioning
November 29, 2014
New materials may change the way temperatures are regulated AIR conditioning is a transformative technology. It has made the world's torrid climes pleasanter to live in, and enabled the siesta-free working habits of the temperate regions to move closer to the equator. But cooling buildings takes a lot of energy. Heat must be pumped actively from their interiors to their exteriors. Fully 15% of the electricity used by buildings in the United States is devoted to this task. If an idea dreamed up by Aaswath Raman of Stanford University and his colleagues comes to fruition, that may change. Dr Raman has invented a way to encourage buildings to dump their heat without the need for pumps and compressors. Instead, they simply radiate it into outer space. The idea, described in this week's Nature, is both cunning and simple. Outer space is very cold (about 3°C above absolute zero) and very big, so it is the perfect heat sink. Earth radiates heat into it all the time. But this is compensated for by the heat the planet receives from the sun. To encourage one part of Earth's surface (such as an individual building) to cool down, all you need do in principle is reflect the sunlight which falls on it back into space, while also encouraging as much radiative cooling from it as possible.

Research And Markets: Silicon On Insulator Market By Technology, Product, Application And Geography - Global Forecast To 2020
November 28, 2014
Friday, November 28, 2014: Research and Markets has announced the addition of the "Silicon on Insulator Market by Technology, Product, Application and Geography - Global Forecast to 2020" report to their offering.

Keysight Technologies Begins Shipment of Impedance Analyzer
November 28, 2014
Measurement Accuracy, Flexible Frequency and Measurement Options Ideal for Characterizing and Evaluating Passive and Semiconductor Component and Materials SANTA ROSA, Calif. – Keysight Technologies, Inc. (NYSE: KEYS) today announced shipment of its E4991B impedance analyzer, specifically designed for R&D, quality assurance and inspection engineers characterizing and evaluating passive electronic components, semiconductor devices, dielectric materials and magnetic materials. Keysight's E4991B offers unparalleled measurement accuracy (0.65 percent basic accuracy) for evaluating components over a wide impedance range, from 1 MHz to 3 GHz. The analyzer features accurate material measurement options that include temperature characteristics analysis from -55°C to 150°C (Option 007) and direct read function of permittivity and permeability up to 1 GHz (Option 002).

MILITARY Semiconductor Devices Sought by Defense Logistics Agency
November 28, 2014
WASHINGTON, Nov. 27 -- The Defense Logistics Agency's Defense Supply Center, Richmond, Virginia, has issued a combined synopsis/solicitation notice (SPE4A515T8468) for semiconductor devices to be delivered to Defense Distribution Depot, Hill, Utah. It was posted on Nov. 24 with a response date of Dec. 5. For more information about Targeted News Service contract awards please contact: Myron Struck, Editor, Direct: 703/866-4708, Cell: 703/304-1897, Myron@targetednews.com 30BautistaJude 141126-mv-790667 30VitinMar

Altera CEO John Daane Receives 2014 Robert N. Noyce Award From Semiconductor Industry Association
November 27, 2014
Thursday, November 27, 2014: Altera Corporation (Nasdaq: ALTR) today announced that President, CEO and Chairman of the Board John P. Daane is this year's recipient of the prestigious Semiconductor Industry Association (SIA) Robert N. Noyce Award. Daane was presented the award by John Kelly, senior vice president and director of IBM research and 2014 SIA chairman, before the semiconductor industry's top leaders and more than 400 SIA members at the annual SIA dinner held at the Fairmont Hotel in San Jose on November 13, 2014. Selected by the SIA Board of Directors and members, the award recognizes Daane's sustained contributions to advancing the semiconductor industry both in the United States and throughout the world. "John represents the heart and soul of our industry, and we are pleased to recognize his efforts with this well-deserved award," said Brian Toohey, president and CEO of the SIA. "During his tenure on the SIA Board and throughout his career, John has brought leaders together to tackle issues facing our industry and advance critical semiconductor priorities."

Chip and pin payment facility now available for licence applications
November 27, 2014
Aberdeenshire Council, UK Government has issued the following news release: Aberdeenshire Council is making it easier for people to pay for licences by accepting chip and pin payments within licensing offices across the area.

New market study "Global Gallium arsenide (GaAs) Devices Market 2014-2018" has been published
November 26, 2014
GaAs is a crystalline compound composed of two elements gallium and arsenic. It is generally referred to as an III-V semiconductor and is used in devices such as microwave frequency integrated circuits monolithic microwave integrated circuits infrared light-emitting diodes laser diodes solar cells and optical windows. GaAs is increasingly being used as a replacement for silicon because of its enhanced electronic properties. For instance GaAs has high saturated electron velocity and electron mobility which allows the device in which it is used to function efficiently at frequencies above 250 GHz. Moreover as a result of the wider band gap GaAs devices are less sensitive to heat compared to silicon-based devices. In addition GaAs devices emit less noise than silicon devices especially at higher frequencies. As a result of these properties GaAs devices are used in cellphones satellite communication equipment microwave point-to-point links and high-frequency radar systems. Full Report Details at nbsp;-http://www.fastmr.com/prod/903217_global_gallium_arsenide_gaas_devices_market.aspx?afid=101TechNavio#39;s analysts forecast the Global GaAs Devices market to grow at a CAGR of 3.32 percent over the period 2013-2018. Covered in this Report This report covers the present scenario and the growth prospects of the Global GaAs Devices market for the period 2014-2018. To calculate the market size the report considers the revenue generated from the sales of GaAs devices worldwide.

PRWeb Newswire
November 26, 2014
  Nov. 24, 2014 - SAN FRANCISCO, CALIFORNIA (PRWEB) November 26, 2014           The new iPhone 6 incorporates a Qualcomm LTE modem that has been very well received by the IT\&C industry. According to "Forbes" magazine, Qualcomm's LTE chipsets registered over 40% of the total baseband shipments in 2013 and their cellular basebands are the top choice of large industry device manufacturers like Samsung, LG, Sony or Google.*             As the recent interoperability test proved, SS7Ware's Unified Core Network is a core solution for LTE and 2/2.5G networks, adapted to the present and future needs of the telecom market as it is compatible with one of the most utilized VoLTE basebands on the market. The SS7 product simplifies the network design without impacting the scaling of the system, resulting in lower deployment and management costs, implementing all functions of a MSC/VLR, GGSN, SAE and IMS in a single unit.         Supporting Quotes     "It is a great accomplishment for us to see what we have envisaged in theory getting into shape so fast.

US Contract Notice: Defense Logistics Agency Issues Solicitation for "SEMICONDUCTOR DEVICE"
November 24, 2014
Defense Logistics Agency, DLA Acquisition Locations Officer has issued requirement for "SEMICONDUCTOR DEVICE." Solicitation no. SPM7M113UC550 Posted on: November 24, 2014

FORM 8-K: TRIQUINT SEMICONDUCTOR INC FILES Current report
November 24, 2014
TRIQUINT SEMICONDUCTOR INC, Delaware, has filed FORM 8-K (Current report) with Securities and Exchange Commission on November 24, 2014 State or other Jurisdiction of Incorporation: Delaware Item 8.01 Other Events. On November 24, 2014, TriQuint Semiconductor, Inc. issued a press release, a copy of which is attached as Exhibit 99.1 and incorporated herein by reference.


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