Gardaí say Intel bomb hoax issued by 'disgruntled' ex-work contractor
January 31, 2015
GARDAÍ say they have established that a hoax bomb threat made to the Intel plant earlier this month was made by a disgruntled former contractor. The Irish Daily Mail can reveal that the rogue alert, which caused the plant in Leixlip, Co. Kildare, to close for two hours on January 13, was made by an individual with 'insider knowledge' of the factory's layout.

Quality Engineer semiconductor exp not required but would be nice
January 31, 2015
National Defense Industrial Association has issued the following Job Vacancy: Job Summary Company A New Beginning-Genes​is 2 Location Multiple locations Industries All Automotive and Parts Mfg Electronics, Components, and Semiconductor Mfg Job Type Full Time Employee Years of Experience 2+​ to 5 Years Education Level Bachelor's Degree Career Level Manager (Manager/​Supervisor of Staff) Salary 0.​00 - 85,000.​00 $ /​year stable company, bennies, bonuses, relocation money, etc Quality Engineer semiconductor exp not required but would be nice About the Job

TSMC's 12-inch wafer capacity ranks 5th in world
January 31, 2015
Taipei, Jan. 31 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC, ???) is now ranked fifth worldwide for 12-inch wafer production capacity, according market information advisory firm IC Insights.

Applications Engineer, Senior
January 30, 2015
Altera has issued the following Job vacancy: Applications Engineer, Senior Location: Japan-Tokyo Requisition ID: 4343 # of openings: 1 Description At Altera, we take pride in creating an energetic and dynamic work environment that is driven by ingenuity and innovation. We believe the growth and success of our company is directly linked to the growth and satisfaction of our employees. That is why Altera is committed to a work environment that is flexible and collaborative, and allows our employees to reach their full potential.

NXP Semiconductors awarded D-PAS Certification
January 30, 2015
NXP Semiconductors has issued the following news release: NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that its Integrated Circuit (IC) for secure card payments has been granted D-PAS certification by Discover Financial Services. The certification applies to implementation of EMV across Discover Network.

Increase in Semiconductor Device Fabrication Activity Drives Demand for Semiconductor Fabrication Material, According to a New Report by Global Industry Analysts, Inc.
January 30, 2015
  San Jose, California (PRWEB) January 30, 2015           Follow us on LinkedIn – Semiconductors are an indispensable part of modern electronics. The growing ubiquity of semiconductors that drive high-tech electronics is mirrored in their extensive use in applications ranging from traditional computers, televisions to advanced smartphones and video game consoles. Growth in the semiconductor fabrication material market is reliant on the health of the semiconductor industry. Demand for semiconductors is dictated by consumer and industrial demand for electronics. Demand patterns in major downstream markets such as computers, communications equipment, digital home appliances, automotive and industrial electronics tend to influence wafer fabrication activity. Future growth will be dictated by emerging new opportunities in automotive electronics, medical device electronics, defense & aerospace electronics, including state-of-the-art weaponry.           The continually rising performance standards for electronic devices require smaller and more robust semiconductor devices.

The Asia-Pacific Electronic Packaging Material Market is estimated to grow to $4562.7 million by 2019 - New Report by MicroMarket Monitor
January 30, 2015
The Asia-Pacific Electronic Packaging Material Market report defines and segments the concerned market in Asia-Pacific with analysis and forecast of revenue. This market is estimated to grow to $4562.7 million by 2019 at a CAGR of 7.4% from 2014 to 2019. Browse through the TOC of the Asia-Pacific Electronic Packaging Material Market report to get an idea of the in-depth analysis provided. This also provides a glimpse of the segmentation in the market and is supported by various tables and figures. Key Players in the Asia-Pacific Electronic Packaging Material Market are BASF Hitachi Chemical Co. Ltd. and Alent plcnbsp;

EJL Wireless Research Releases 802.11ac Wi-Fi Chipset Supplier BullsEye Analysis™.
January 30, 2015
  Salem, NH (PRWEB) January 30, 2015           EJL Wireless Research has released its Supplier BullsEye Analysis™ report on 802.11ac Wi-Fi chipsets. We rank Qualcomm as the top supplier within the Winning sector while Realtek is ranked at the bottom of our analysis in the losing sector. The analysis is based upon a quantitative scoring of the commercial and technical merits of eight 802.11ac chipset semiconductor suppliers. The numerical scores are then placed within three sectors: Winning, Losing, and Ones to Watch. The suppliers within the Ones to Watch sector are those whose solutions are ranked as either improving in both technical and commercial merits and moving towards the Winning sector or declining in both technical and commercial merits and moving towards the Losing sector.

IQE renews wafer products supply contract
January 28, 2015
HIGHLIGHT: IQE plc, a manufacturer of semiconductor wafer products, has concluded the renegotiation of a long-term supply contract with an existing tier-1 customer for the supply of wafer products used in wireless applications.

Dow Corning to abandon Tennessee polysilicon assets
January 01, 1970
Dow Corning is shuttering its never-operated Hemlock Semiconductor polysilicon facility in Clarksville, TN, saying the plant would not be economically viable. The $1-billion- plus project was completed last year but has never produced product because of oversupply in polysilicon markets and the impact of tariffs on polysilicon imported into China. "As difficult as this is, the continued market adversity and complex political conditions have left no economically viable options for Hemlock Semiconductor to operate the site," says Denise Beachy, president of Hemlock Semiconductor. "It is unfortunate for both the company and the community that these conditions have forced us to take this action." Hemlock Semiconductor is comprised of several joint venture companies majority owned by Dow Corning.


Ultratech Cambridge NanoTech introduces the Savannah G2 ALD system
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Dynaloy unveils safer cleaners
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Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...