April 23, 2014
ALEXANDRIA, Va., April 23 -- The trademark UNISANTIS (Reg. No. 4513037; International Reg. No 1138955) was issued on April 15 by the USPTO. Owner: Unisantis Electronics Singapore Pte. Ltd. Private Limited Company SINGAPORE 111 North Bridge Road #16-04 Peninsula Plaza Singapore 179098 SINGAPORE. The trademark application serial number 79121628 was filed on March 21, 2012 and was registered on April 15. The description of the mark registered is "Color is not claimed as a feature of the mark."

April 23, 2014
ALEXANDRIA, Va., April 23 -- The trademark CFAST (Reg. No. 4514857; International Reg. No 1055074) was issued on April 15 by the USPTO.

GCT Semiconductor LTE Single-Chip Powers NETGEAR 4G LTE Gateway
April 23, 2014
Calif., April 23 -- GCT® Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, has announced that its 4G LTE single-chip enables fast and reliable LTE connectivity in the new NETGEAR® LTE Data Gateway 2200D (LG2200D), currently available for U.S. Cellular customers. This new LTE gateway offers multi-band connection capabilities supporting LTE bands 4, 5, and 12.

Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market by Technology, Application, Product, Device & by Geography - Forecast & Analysis to 2013 - 2022
April 22, 2014
Reportbuyer.com has added a new market research report: Gallium Nitride (GaN) Semiconductor Devices (Discrete & IC) and Substrate Wafer Market by Technology, Application, Product, Device & by Geography - Forecast & Analysis to 2013 - 2022 http://www.reportbuyer.com/computing_electronics/manufacturing/gallium_nitride_gan_semiconductor_devices_discrete_ic_substrate_wafer_market_technology_application_product_device_geography_forecast_analysis_2013_2022.html The report of GaN device and wafer market identifies the entire market and all its sub-segments through extensively detailed classifications, in terms of revenue, shipments and ASPs. This market report has detailed research study on GaN market with respect to devices and substrate wafers. The report holds a detailed market segmentations combined with qualitative analysis at each and every aspect of the classifications The qualitative analysis is done for form factor, design architecture, substrate technology, products, devices, manufacturing process, thickness parameters, design configurations and others. . The qualitative analysis of GaN device and wafers include the discussion on market dynamics such as market drivers, restraints, opportunities. Other qualitative analysis about the GaN market are burning issues, winning imperatives, porter's five forces, and other market trends. The quantitative analysis is done for major segments like applications, geography and others.

SunEdison Names Jose Perez President Of Europe, Africa And Latin America
April 22, 2014
 SunEdison, Inc. (NYSE: SUNE), a leading provider of solar energy services, today appointed Jose Perez as President of SunEdison Europe, Africa and Latin America; replacing Pancho Perez who moves into a new role with SunEdison Capital.

Xilinx Recognizes TSMC with Best Supplier Award; Award acknowledges TSMC for outstanding performance as a strategic partner and supplier in 2013
April 22, 2014
Xilinx, Inc. (NASDAQ: XLNX) today announced that its "Best Supplier Award" was given to TSMC, the world's leading semiconductor foundry, in recognition of TSMC's outstanding performance as a strategic partner and supplier in 2013. Xilinx presents this award annually to recognize a key supplier for its efforts and contributions to the company's success. This is the second consecutive year that TSMC has been presented with this honor.

New Technology Symposium at SEMICON West 2014 to Spotlight Critical Issues in Semiconductor Manufacturing
April 22, 2014
The Semiconductor Equipment and Materials International issued the following news release: SEMI has announced the new Semiconductor Technology Symposium (STS), to be held July 8-10 as part of the SEMICON West 2014 (www.semiconwest.org) technical and business program agenda. The new program addresses the most important and critical issues facing the future of semiconductor manufacturing in a new more technical conference format. The three-day STS conference is a comprehensive technology and business conference addressing the key issues driving the future of semiconductor manufacturing and markets. Aligned with the latest inputs from technology roadmaps, sessions at the STS will focus on the significant trends shaping near-term semiconductor technology and market developments in areas including advanced processes and materials, lithography, metrology, yield, design, packaging, test, and 450mm.

2014 Rank Prize for Envisioning Strained-layer Superlattices Awarded to Sandia Fellow
April 22, 2014
The U.S. Department of Energy's Sandia National Laboratories issued the following news release: In 1982, then-Sandia National Laboratories researcher Gordon Osbourn published a theoretical paper that asserted the previously unthinkable: that ultra-thin layers of mismatched atomic lattices could overcome the strain of their union and successfully form a defect-free bond. Going against the grain of the times, Osbourn's calculations stimulated creation of the new field of strained-layer superlattices. Just one of the myriad results of that insight -- strained-layer lasers -- today dominate the entire semiconductor laser market. Approximately one billion are produced each year for a market valued at approximately $5 billion.

InVisage Tops $100 Million in Funding With New $18 Million Round, Expands Exec Team
April 22, 2014
As it readies its QuantumFilm(TM) Camera Sensor for launch, InVisage Technologies, Inc. today announced a new round of funding, two new leadership appointments and a first product sampling to select customers. InVisage's $18 million round of funding brings the total amount that it has raised since its creation to more than $100 million. Investors include GGV Capital, Nokia Growth Partners, RockPort Capital, InterWest Partners, Intel Capital and OnPoint Technologies. The additional funding enables InVisage to scale manufacturing capacity from its initial pilot production line to support high volume customers and further its mission to mass produce fast, thin, high performance cameras in ultra-small form-factors.

Nidec Enters into Share Exchange Agreement to Acquire Full Ownership of Its Two Remaining Listed Subsidiaries
April 22, 2014
KYOTO, Japan, April 22, 2014 (GLOBE NEWSWIRE) -- Nidec Corporation ("Nidec") (NYSE:NJ) announced today that Nidec and its two listed subsidiaries, Nidec-Read Corporation ("Nidec-Read") (Tokyo:6833) and Nidec Copal Electronics Corporation ("Nidec Copal Electronics") (Tokyo:6883), have resolved at their respective board meetings held on April 22, 2014 to enter into share exchange transactions (the "Share Exchange") under which Nidec will make Nidec-Read and Nidec Copal Electronics its wholly owned subsidiaries.


Spectral reflectometer for film thickness measurement
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New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...