Highly Conformable TIM
July 30, 2014
Carteret, NJ — Fujipoly’s announces the expansion of its Sarcon® XR-Pe product offering with the availability of a 1.0 mm thick sheet. Sarcon® XR-Pe delivers a remarkable thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.

-TriQuint Becomes First Manufacturer to Achieve MRL 9 for GaN
July 30, 2014
ENP Newswire - 30 July 2014 Release date- 29072014 - Hillsboro, Oregon (USA) - TriQuint Semiconductor, Inc., a leading RF solutions supplier and technology innovator, announced that it is the first gallium nitride (GaN) RF chip manufacturer to achieve Manufacturing Readiness Level (MRL) 9.

Intel Vietnam to produce 80% of world's computer chips by 2015: CEO
July 30, 2014
HO CHI MINH CITY, July 30 -- Eighty percent of the semiconductor chips used in computers around the world are expected to be made by the Intel plant in Vietnam, local Tuoi Tre (Youth) newspaper reported Wednesday, quoting Sherry Boger, CEO of Intel Products Vietnam as saying.

Global and China Copper Clad Laminate Industry Report, 2013-2016 / Researchmoz; Report
July 29, 2014
  Albany, NewYork (PRWEB) July 29, 2014       Copper clad laminate (CCL) is the electronic industrial base material, mainly used for the manufacture of printed circuit board (PCB), widely applied in television, radio, computer, mobile communications and other electronic products.       In 2013, the global copper clad laminate output saw a year-on-year increase of 17.9% to 720 million square meters, primarily from Asia (95.6%), especially China, which made 480 million square meters of copper clad laminate that year, up 6.8% from a year earlier, accounting for 67.1% of global production.     Read The Complete Report With TOC @ http://www.researchmoz.us/global-and-china-copper-clad-laminate-industry-report-2013-2016-report.html             Glass-fabric-base copper clad laminate and paper-base copper clad laminate are two biggest niche products by output, respectively making up 61.6% and 17.2% of the total output of China's copper clad laminate in 2013.

New Kind of Photoresist Needed to Extend Moore's Law
July 24, 2014
The Optical Society has issued the following news release: Over the years, computer chips have gotten smaller thanks to advances in materials science and manufacturing technologies. This march of progress, the doubling of transistors on a microprocessor roughly every two years, is called Moore's Law. But there's one component of the chip-making process in need of an overhaul if Moore's law is to continue: the chemical mixture called photoresist. Similar to film used in photography, photoresist, also just called resist, is used to lay down the patterns of ever-shrinking lines and features on a chip. Now, in a bid to continue decreasing transistor size while increasing computation and energy efficiency, chip-maker Intel has partnered with researchers from the U.S. Department of Energy's Lawrence Berkeley National Lab (Berkeley Lab) to design an entirely new kind of resist. And importantly, they have done so by characterizing the chemistry of photoresist, crucial to further improve performance in a systematic way. The researchers believe their results could be easily incorporated by companies that make resist, and find their way into manufacturing lines as early as 2017.

Senior Product Marketing Manager
July 23, 2014
National Defense Industrial Association has issued the following news release: Job Summary Company: ASML Location: Santa Clara, CA 95050 Industries: Electronics, Components, and Semiconductor Mfg Job Type: Full Time Employee Job Category: Marketing/Product Reference Code: US01738 Senior Product Marketing Manager

Global English (Middle East and North Africa Financial Network)
July 18, 2014
http://www.abnnewswire.net/rss2/menafn/abn_menafn_en.aspInvestor and industrial consumption of silver has advanced at a healthy pace in 2014, reflected in the silver price increasing 5 percent as of July 15 from the beginning of the year. Building on an impressive 2013, investors continued to boost silver holdings in the first half of 2014. Silver exchange traded funds (ETF) backed by physical silver added 7.0 million ounces (Moz) of silver bullion through June; in contrast, gold ETF holdings dipped by 1.4 Moz ounces over the same time period. Globally, silver bullion coin sales are up 4.5 percent through the 1st quarter of 2014, according to precious metals consultancy Thomson Reuters GFMS.

Semicon West To Start From Tomorrow
July 07, 2014
India, July 7 -- The semiconductor equipment and materials industry is urgently pursuing a range of alternative microelectronics manufacturing technologies.

Development of phase shift lithography for the production of metal-oxide-metal diodes
July 01, 2014
1Introduction Metal-oxide-metal (MOM) diodes have the potential to rectify terahertz radiation collected by micron-scaled antennas from waste heat sources and convert this into a useful DC current [1–3]. The antennas themselves are comparatively straightforward to make, with micron-scale dimensions. However, the diodes must be much smaller than this, which leads to production and characterisation issues. The MOM diode structure consists of two dissimilar metals separated by a native oxide layer, which is sufficiently thin to allow electron tunnelling to occur, that is, 5 nm or thinner [4]. A functional diode is best achieved by using one metal which will oxidise readily and another which is inert. By choosing two metals with a maximum difference in work function, we can increase the asymmetry of the resulting diode. Many metal combinations have been tried, for example, Ni–Au [5] and Al–Pt [6]; here we have chosen titanium, which oxidises readily, and maximised the work function difference by using inert platinum as the other metal.

Preparation and characterisation of carbon-modified TiO2 composite
July 01, 2014
1Introduction TiO2 is known to be a semiconductor material and can mineralise dyes to water, CO2 and mineral. However, the high electronic–hole recombination rate and the optical absorption only in the ultraviolet region restrict its practical application. In addition, a variety of modified methods have been reported to improve its performance, such as precious metal deposition [1], semiconductor compound [2], metal doping [3] and non-metal doping [4]. In particular, carbon-modified TiO2 particles showed improved performance compared with their unmodified counterparts.


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MEMS wafer inspection system from Sonoscan
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