Semiconductor Manufacturing: Present at ASMC 2015 -- 'Call for Papers' Deadline Extended to November 10
October 31, 2014
The Semiconductor Equipment and Materials International issued the following news release: SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10. ASMC, which takes place May 3-6, 2015 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year's event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, and tutorials.

Scientists worked for over 18 hours to keep MOM costs low
October 31, 2014
Indore: On board software repairing of a spacecraft is really a big task for a space scientist and engineers. But the beauty of the success of the Mars Orbiter Mission ( MOM) is that that all the software and hardware is has been integrated in such a manner that India would achieve success in its first attempt.

Mouser Team Wins Top Marketing Honors from ECIA
October 30, 2014
Mouser Electronics , Inc., the global authorized distributor with the newest semiconductors and electronic components, congratulates its Marketing Team for winning several top Electronics Choice Industry Awards from the Electronic Components Industry Association (ECIA) at the ECIA's annual executive conference on October 27 in Chicago. Mouser's Marketing Team was recognized for marketing excellence with six top awards from the Electronic Components Industry Association (ECIA). Pictured are two of the six awards. (Photo: Business Wire)

1366 Technologies Direct Wafer(TM) Achieves New Technical Milestones; Company Attains 18% Cell Efficiency and Accomplishes Solar Industry First: Eliminates the "Low Efficiency Tail" for Cell Manufacturers
October 30, 2014
1366 Technologies today announced competitive cell efficiencies of 18% for its industry-standard, 156mm multi-crystalline wafers, as well as a solar industry first: the elimination of the "low efficiency tail" for cell manufacturers. The new technical results allow for a sharp reduction in the variance of wafer quality, a 50% tighter efficiency distribution compared to that of conventional multi-crystalline wafers, and efficiency ratings consistently above 17% - all without requiring cell customers to invest in new processing or handling equipment. Customers using 1366's proprietary Direct Wafer(TM) technology and passivated emitter rear contact cells (PERC) achieved 18% cell efficiencies. Trials conducted without PERC resulted in 17.5% competitive cell efficiencies. "We're especially proud of these efficiency milestones because they're not just about a single champion cell achieved in the lab. Our highest cells were above 18% with PERC and our efficiencies were consistently above 17% in conventional production runs. Direct Wafer(TM) delivers the best economic value at scale," said Frank van Mierlo, CEO, 1366 Technologies.

STMicroelectronics Introduces World's Smallest Integrated 6-Axis Inertial Measurement Unit; Automotive-telematics and navigation-sensor leader keeps motor vehicles on track
October 30, 2014
GENEVA, Oct. 30, 2014 (GLOBE NEWSWIRE) -- STMicroelectronics(NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world's top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile[1] as well as automotive applications[2], today announced the industry's smallest 6-axis Inertial Measurement Unit (IMU) qualified for Automotive applications with low-noise and improved output resolution. The tiny ASM330LXH IMU is ideal for in-dash car-navigation solutions that require accurate and reliable inertial sensors to optimize positioning and direction, even in the absence of a strong GNSS (Global Navigation Satellite System) signal. Weak or intermittent satellite signals are common in urban areas, tunnels, and parking garages, where direct visibility of the satellites may be blocked. Multi-axis gyroscopes and accelerometers, like the 6-axis ASM330LXH, empower sophisticated Dead Reckoning software algorithms that calculate current position from a previously determined location updated by time, acceleration, and change of direction. The new device also targets on-board units for electronic road tolling and other vehicle telematics systems.

Lattice Semiconductor, Fairchild Imaging and Helion Vision to Demonstrate New FPGA-Based Image Sensor Solution at VISION 2014; Reference Design Enables Manufacturers to Develop HD Camera Systems Ideal for High-End Security Systems and Intelligent Transportation Applications; Click to Tweet
October 30, 2014
Lattice Semiconductor Corporation (NASDAQ:LSCC), the leader in ultra-low power, small form factor, customizable solutions, Fairchild Imaging and Helion Vision will demonstrate a new image sensor solution based on Fairchild Imaging's HWK1910A image sensor and Helion Vision's IONOS IP cores at VISION 2014 in Stuttgart, Germany, November 4-6. Demonstrations will be in the booths of both Helion Vision (1E-82 in Hall 1) and BAE Systems (1-C74 in Hall 1), the parent company of Fairchild Imaging. Technical experts from each company will be available to discuss the solution. At the core of the demonstration is the Lattice HDR-60 Video Camera Development Kit which utilizes the Fairchild HWK1910A image sensor, a LatticeECP3TM FPGA and Helion Vision's IONOS Imaging pipeline. The solution delivers leading-edge low light performance as well as up to 120dB dynamic range in a single frame at 30fps. Other security camera systems typically stack frames to achieve wide dynamic range (WDR), causing negative side effects such as image blur, reduced frame rate and decreased integration times. Those issues are solved by the capabilities of this trailblazing solution.

REMINDER - MEDIA ALERT: ProPlus Design Solutions to Participate in ICCAD Workshop Titled, "TCAD to EDA"; Lianfeng Yang to Present "SPICE Modeling Challenges, Solutions and Its Impact to Advanced IC Designs"
October 30, 2014
WHO: Dr. Lianfeng Yang, vice president of marketing at ProPlus Design Solutions, Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions

Allied Minds Announces the Formation of Seamless Devices, Inc.
October 30, 2014
Allied Minds (LSE: ALM), an innovative U.S. science and technology development and commercialization company, today announced that it's entering into an exclusive, worldwide licensing agreement with Columbia University that has led to the formation of a new subsidiary, Seamless Devices, Inc. Seamless Devices is developing applications for a novel technique in analog signal processing that will make it possible to produce high-performance signals even as transistors are scaled down in size deep into the nanoscale.

Over 300 Engineers in 43 Countries Discovered How to Generate an Executable Quote Online in Just Minutes; Join eSilicon's Webinar to Explore the Impact of Online Quoting for Custom Chips
October 30, 2014
What: Webinar: Semiconductors Go Online and Worldwide: Real-world benefits of automated, online multi-project wafer and GDSII quotes When: November 12, 2014, 9:00am - 10:00am

Electronics industry gets 2 ways to snoop on self-organizing molecules
October 29, 2014
A few short years ago, the idea of a practical manufacturing process based on getting molecules to organize themselves in useful nanoscale shapes seemed ... well, cool, sure, but also a little fantastic. Now the day isn't far off when your cell phone may depend on it. Two recent papers emphasize the point by demonstrating complementary approaches to fine-tuning the key step: depositing thin films of a uniquely designed polymer on a template so that it self-assembles into neat, precise, even rows of alternating composition just 10 or so nanometers wide.


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