Headlines


Nordic Semiconductor Releases Bluetooth Low Energy Protocol Stack for nRF51 Series
April 16, 2014
Ultralow power (ULP) RF specialist Nordic Semiconductor ASA has announced S110 SoftDevice v7.0, the next major release of its Bluetooth low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT and ANT/Bluetooth low energy multiprotocol SoCs.

Studio One Media and ON Semiconductor Set to Jointly Develop Audio Solutions
April 16, 2014
Studio One Media, Inc. has entered into an agreement with ON Semiconductor to develop integrated circuits (ICs) utilizing Studio One's AfterMaster audio technology and ON Semiconductor's DSP product development expertise.

Walt & Company Named U.S. Public Relations Agency of Record for Actions Semiconductor
April 15, 2014
Walt & Company, an award-winning tech PR and social media agency, today announced it has been chosen byActions Semiconductor Co, Ltd.as its U.S. public relations Agency of Record. In addition, Walt & Company's Chinese affiliate agency, ProEXPO, has been named the public relations Agency of Record in China.

Global Silicon Reclaim Wafers Industry
April 15, 2014
Reportlinker.com announces that a new market research report is available in its catalogue: Global Silicon Reclaim Wafers Industry http://www.reportlinker.com/p02070086/Global-Silicon-Reclaim-Wafers-Industry.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor This report analyzes the worldwide markets for Silicon Reclaim Wafers in US$ Million. The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 54 companies including many key and niche players such as - Advantec Co Ltd.

Cadence Digital and Custom/Analog Tools Achieve TSMC V1.0 DRM Certification for 16nm FinFET Process; Full certification enables customers to tape out 16nm FinFET designs using Cadence tools
April 15, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's digital, custom/analog and signoff tools have been co-optimized with TSMC's 16nm FinFET process to enable higher performance, lower power consumption and smaller area for advanced designs.

Cadence Digital and Custom/Analog Tools Achieve TSMC V1.0 DRM Certification for 16nm FinFET Process; Full certification enables customers to tape out 16nm FinFET designs using Cadence tools
April 15, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC's 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools. Cadence's digital, custom/analog and signoff tools have been co-optimized with TSMC's 16nm FinFET process to enable higher performance, lower power consumption and smaller area for advanced designs.

IXYS Introduces the PIM-Mini 5A to 200A Miniature Pulsed Laser Diode Driver
April 15, 2014
IXYS Corporation (NASDAQ:IXYS), a leader in power semiconductors, mixed-signal and digital ICs for power conversion and motion control applications, announced today the introduction of the compact and lightweight PIM-Mini by its IXYS Colorado division. The PIM-Mini is an air-cooled pulsed current source designed to drive laser diodes, bars, arrays, or any low-impedance load. Offered in models from 5amperes to 200amperes of peak current at up to 48volts forward voltage, the PIM-Mini has been optimized for OEM designs including industrial, chemical processing and medical applications. Its size and flexibility makes it ideal for research, laboratory, scientific and other applications requiring a compact and economical high-performance pulsed driver.

IDT Introduces Ultra-Compact Wireless Power Receivers Offering 70% Board Area Savings; IDT Expands Industry-leading Wireless Power Portfolio with Space-optimized Qi- and PMA-compliant Receivers to Address Densely-populated, Cost-sensitive Portable Applications
April 15, 2014
Integrated Device Technology, Inc. ( IDT ®) (NASDAQ: IDTI), the Analog and Digital Company(TM) delivering essential mixed-signal semiconductor solutions, today announced a new family of ultra-compact wireless power receivers offering a board area footprint reduction up to 70% compared to switching regulator-based solutions. The latest Qi- and PMA-compliant devices expand IDT's industry-leading wireless power portfolio to address densely-populated, cost-sensitive portable applications. The IDTP9024 , IDTP9025A , and IDTP9028 are fully-integrated, single-chip wireless power receivers supporting PMA, WPC Qi 1.1, and dual mode (PMA and Qi) standards, respectively. The devices utilize a high-efficiency low-dropout regulator (LDO)-based architecture to minimize component count, resulting in significant savings in board area and bill-of-materials (BOM) cost. In addition, optimized control logic minimizes power losses to ensure highly-efficient power delivery to the load. The space- and cost-optimized wireless power receivers are ideal for wireless handsets, cell phone sleeves, and tablets.

SMIC Appoints Hiroshi Ogawa as General Manager of SMIC Japan
April 15, 2014
Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981), China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation. Mr. Ogawa received his degree in Commerce from Waseda University and has many years of experience in the semiconductor business. He has engaged in a broad spectrum of international sales and marketing based in Japan, USA, Singapore, and Hong Kong. Mr. Ogawa will be responsible for enhancing SMIC's foundry business in Japan where many of the most advanced semiconductor technologies and products are developed as well as having large potential for growth. "We are delighted to appoint Mr. Ogawa as General Manager of SMIC Japan," said Mike Rekuc, Executive Vice President of SMIC Worldwide Sales and Marketing. "His extensive management and business experience in the semiconductor field will further improve SMIC's regional operation, marketing strategies, and customer support in Japan. We can expect SMIC will play a more important role in Japan's semiconductor market."

ProPlus Design Solutions to Exhibit at Upcoming TSMC 2014 Technology Symposia in North America, China and Taiwan; Will Showcase FinFET-Ready DFY Products for Nano-Scale Modeling, Giga-Scale Simulations
April 15, 2014
ProPlus Design Solutions, Inc. will demonstrate its entire line of FinFET-ready Design for Yield (DFY) products for nano-scale modeling and giga-scale simulations at a series of TSMC 2014 Technology Symposium events in April and May. The North America TSMC 2014 Technology Symposium events where ProPlus will exhibit will be held April 22 in San Jose, Calif., April 29 in Boston, and May 1 in Austin, Texas. ProPlus joins TSMC at the China Symposium in Shen Zhen May 8 and the Taiwan Symposium May 29.


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