Headlines


Altera CEO John Daane Receives 2014 Robert N. Noyce Award From Semiconductor Industry Association
November 27, 2014
Thursday, November 27, 2014: Altera Corporation (Nasdaq: ALTR) today announced that President, CEO and Chairman of the Board John P. Daane is this year's recipient of the prestigious Semiconductor Industry Association (SIA) Robert N. Noyce Award. Daane was presented the award by John Kelly, senior vice president and director of IBM research and 2014 SIA chairman, before the semiconductor industry's top leaders and more than 400 SIA members at the annual SIA dinner held at the Fairmont Hotel in San Jose on November 13, 2014. Selected by the SIA Board of Directors and members, the award recognizes Daane's sustained contributions to advancing the semiconductor industry both in the United States and throughout the world. "John represents the heart and soul of our industry, and we are pleased to recognize his efforts with this well-deserved award," said Brian Toohey, president and CEO of the SIA. "During his tenure on the SIA Board and throughout his career, John has brought leaders together to tackle issues facing our industry and advance critical semiconductor priorities."

ADI introduced single chip wideband IF receiver subsystem
November 27, 2014
umbai, Nov. 27 -- Analog Devices, Inc. (ADI) introduced the AD6676 single chip wideband IF receiver subsystem, which allows designers of high-performance communications and instrumentation equipment to reduce the complexity of their receiver designs while simultaneously achieving frequency planning flexibility and industry leading instantaneous dynamic range.

Toshiba Introduces New Low-Height Transistor Output Photocoupler; Offers Wider Creepage Distance; Suited to Applications with Strict Height Requirements
November 26, 2014
 Toshiba America Electronic Components, Inc.(TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a new transistor output photocoupler in a low-height SO6L 4 pin package - the TLP385. With its low-height of 2.3mm (max), 45 percent lower than DIP4 packages, the TLP385 can be used in situations with strict height requirements. Applications including motherboards, programmable logic controllers, AC adapters, I/O interface boards, inverter interfaces and general purpose power supplies are suited to the new photocouplers.

CyberOptics Features Advanced Airborne Particle Sensor Technology at SEMICON Japan; Company shows 60% increased sensitivity in industry-leading airborne particle sensor technology and continues to enable improvement in fab yields and equipment uptime
November 26, 2014
CyberOptics® Corporation (NASDAQ: CYBE), a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate its wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON Japan in Booth #4013 at Tokyo Big Sight, Tokyo, Japan Dec., 3-5, 2014. To address the market demand for airborne particle measurement in 150mm semiconductor, gallium arsenide (GaAs), LED and flat panel display fabs, CyberOptics will also highlight the new WaferSense® Airborne Particle Sensor APS2 150C, its most recent extension of its APS line in a 150mm wafer form factor. The new APS2 150C incorporates advanced technology with a 60% increase in particle sensitivity at <10 false counts per hour.

Microsemi to Present at Nasdaq OMX 31st Investor Program in London
November 26, 2014
 Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will present at the Nasdaq OMX 31st Investor Program in London on Dec. 3 at 10:45 a.m. Greenwich Mean Time (5:45 a.m. EST).

Tiny DNA reader could herald personalised medicine
November 26, 2014
A semiconductor DNA reader just nanometres across could make whole genome profiling for personalised medicine an everyday practice. Using advanced semiconductor technology known as atomic layer deposition scientists have built a tiny device sensitive enough to distinguish the individual chemical bases of DNA – known by their abbreviated letters of A, C, T or G – when they are pumped past the reading head.

Lake Shore to Feature New Hall Measurement Solutions at MRS Fall.
November 24, 2014
  Columbus, Ohio (PRWEB) November 24, 2014     Lake Shore Cryotronics, a leading innovator in solutions for measurement over a wide range of temperature and magnetic field conditions, announced today that it will be discussing its new, flexible Model 8425 Hall measurement system plus its range of industry-leading cryogenic probing and characterization solutions at the 2014 MRS Fall Meeting & Exhibit, Dec. 2-4 in Boston.

UNDERGRADS USE TOP-LEVEL NANOTECHNOLOGY IN NEW LABORATORY
November 21, 2014
The following information was released by Pennsylvania State University - University Park: Engineering educators have long believed that the laboratory is an important component of instruction. The hands-on learning can improve students' critical thinking skills and their understanding of course material. Students in this semester's Electrical Engineering 441 course are getting the best of both worlds; for the first time, their classroom instruction is held in the newly constructed Nanofabrication Laboratory located in the Millennium Science Complex.

SCHOTT announces launch of HermeS wafers
November 20, 2014
HIGHLIGHT: SCHOTT AG, a German developer and manufacturer of industrial specialty glass products, has announced the launch of HermeS wafers with hermetically sealed solid 'Through Glass Vias', or TGV.

Pulsed RF Power Semiconductor Device Markets to Exceed $300M by 2019
November 01, 2014
FULL TEXT Iarkets for pulsed RF power devices up to 18 GHz are expected to show continued growth over the next five years despite the current economic turmoil and cuts in defense spending. While association with consumer spending fuels the volatility of many global electronics markets, pulsed RF power devices are supported by quite different priorities.


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