Headlines


Qorvo Ups Optical Bandwidth With New GaAs Process Technology; TQPHT09 90 nm pHEMT Ideal for Next-Generation High Frequency Amplifiers
March 26, 2015
LOS ANGELES, March 26, 2015 (GLOBE NEWSWIRE) -- Qorvo, Inc. (Nasdaq:QRVO), a leading provider of RF solutions for mobile, infrastructure and aerospace/defense applications, today announced a new gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) process technology that provides higher gain/bandwidth and lower power consumption than competing semiconductor processes. Qorvo's new TQPHT09 is a 90 nm pHEMT process that supports Qorvo's next-generation optical product portfolio. Coupled with Qorvo's industry-leading reliability, this new process is ideal for next-generation high frequency, high performance amplifiers required for 100G+ linear applications.

MACOM Extends Leading Optical Portfolio with New Dual Channel Linear Transimpedance Amplifier; MACOM's High Gain Linear TIA is Ideal for Metro Applications at 100G and Beyond
March 26, 2015
M/A-COM Technology Solutions Inc. ("MACOM"), a leading supplier of high performance analog RF, microwave and optical semiconductor products, today announced the new MATA-003806, a dual channel linear transimpedance amplifier (TIA) for next generation coherent receiver applications.

Vishay Intertechnology Announces 'Super 12' Featured Products for 2015; Innovative Components Offer Industry-Leading Specifications for a Variety of Applications
March 26, 2015
Vishay Intertechnology, Inc. (NYSE:VSH) today announced its "Super 12" featured products for 2015. Each year, Vishay identifies a dozen key semiconductor and passive components featuring new and improved technologies that can significantly improve the performance of end products and systems. Vishay's Super 12 collection showcases the company's industry-leading capabilities in semiconductor and passive devices and provides a cross-section of Vishay's very broad product portfolio. The Super 12 products for 2015 are:

Minco Partners with Digi-Key to Offer Bare Die Semiconductor Products
March 26, 2015
Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, and Minco Technology Labs, LLC, today announced that they have teamed up to offer semiconductor bare die products to its global customer base. As part of the agreement, Digi-Key customers will be able to purchase off-the-shelf die products in minimum waffle pack quantities of 25 pieces online. "We welcome this opportunity to serve a broader customer base by partnering with a global distributor like Digi-Key who has become known as the 'go to' online resource for semiconductors," says Bill Bradford, Minco CEO. "Their expertise in offering full-range services for the design engineer along with their ability to support prototype and production order quantities is a huge value-add for the die market."

Minco Partners with Digi-Key to Offer Bare Die Semiconductor Products
March 26, 2015
Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, and Minco Technology Labs, LLC, today announced that they have teamed up to offer semiconductor bare die products to its global customer base. As part of the agreement, Digi-Key customers will be able to purchase off-the-shelf die products in minimum waffle pack quantities of 25 pieces online. "We welcome this opportunity to serve a broader customer base by partnering with a global distributor like Digi-Key who has become known as the 'go to' online resource for semiconductors," says Bill Bradford, Minco CEO. "Their expertise in offering full-range services for the design engineer along with their ability to support prototype and production order quantities is a huge value-add for the die market."

TowerJazz Announces Successful Completion of its Offer for Accelerated Conversion of its Series F Convertible Bonds, Reducing Debt by $80 Million
March 26, 2015
Oversubscribed Offer Allocated on a Pro-Rata Basis Company's Debt Reduction Results in Stronger Balance Sheet Financial Ratios and Shareholders' Equity and Positively Impacts Future Profitability MIGDAL HAEMEK, Israel, March 26, 2015 (GLOBE NEWSWIRE) -- TowerJazz, the global specialty foundry leader, today announced the successful completion of its previously announced accelerated conversion offer for its outstanding Series F convertible bonds. As of the expiry date of this offering on March 25, 2015, the aggregate subscription demand amounted to approximatelyNIS 327 millionof the Company's Series F convertible debenture, representing 109% as compared to the NIS 300 million offered and accepted (approximately $80 million). As the offering, which was limited to a maximum amount of debt eligible for conversion under of approximately $80 million, was oversubscribed, the offer was allocated to the subscribing holders on a pro rata basis, as set forth in the offering documents. As a result of the accelerated conversion, the Company's debt is reduced by approximately $80 million thereby significantly improving its balance sheet, financial ratios and future profitability, including the saving of approximately $10 million of interest payments during the years 2015 and 2016.

Govt plans $10 billion investment in two semiconductor plants
March 26, 2015
New Delhi, March 26 -- In line with the National Democratic Alliance (NDA) government's flagship 'Make in India' programme, the centre plans to spend billions of dollars to put in place an ecosystem for electronics manufacturing in the country.

INVESTOR ALERT: Levi & Korsinsky, LLP Notifies Shareholders of VITESSE SEMICONDUCTOR of Commencement of CLASS ACTION Concerning the Fairness of the SALE OF THE COMPANY TO MICROSEMI CORPORATION -- VTSS
March 26, 2015
(GlobeNewswire) - The following statement is being issued by Levi & Korsinsky, LLP: TO: ALL PERSONS OR ENTITIES WHO PURCHASED VITESSE SEMICONDUCTOR STOCK PRIOR TO MARCH 18, 2015.

ON Semiconductor and Transphorm introduce GaN cascode transistors
March 23, 2015
HIGHLIGHT: ON Semiconductor Corporation and Transphorm Inc. have announced the introduction of the co-branded NTP8G202N and NTP8G206N 600V GaN cascode transistors and a 240W reference design that utilizes them.

OSAT manufacturer selects Rudolph's lithography system
March 20, 2015
HIGHLIGHT: Rudolph Technologies, Inc., a provider of process characterization equipment and software, has announced that an outsourced assembly and test, or OSAT, manufacturer has selected the JetStep Advanced Packaging Lithography System for evaluation.


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