Headlines


Element Six Introduces New Thermal Grade of CVD Diamond - DIAFILM TM130 for Semiconductor Heat Management
October 21, 2014
Synthetic Diamond Market Leader Expands Portfolio to Offer Customers More Diamond Thermal Management Options SAN DIEGO – INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (BOOTH #530) -- Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130. DIAFILM TM130 has a thermal conductivity in excess of 1300 W/mK and is available in both metallized and un-metallized wafers form. Similar to Element Six's material grades in its DIAFILM TM range, TM130 offers full isotropic heat spreading in both planar and through plane directions. Enhancing its already extensive portfolio to offer customers more options to address unique thermal management needs, Element Six now provides a total of five material grades spanning five levels of performance ranging from 1000 W/mK to 2000 W/mK.

GOV. SHUMLIN ISSUED THE FOLLOWING STATEMENT OCT. 20 ON THE PLANNED SALE OF IBM VERMONT FACILITIES TO GLOBALFOUNDRIES
October 21, 2014
ONTPELIER, Vt., Oct. 20 -- Gov. Peter Shumlin, R-Vt., issued the following press release: "IBM announced this morning that it plans to sell its semiconductor production business, including its facilities in Vermont, to GlobalFoundries, a company with a strong track record of performance in semiconductor manufacturing. GlobalFoundries plans to maintain the workforce and continue operations in Vermont, good news for the talented Vermonters employed by the plant and for our whole state.

GOV. SHUMLIN, STATE AND LOCAL OFFICIALS, AND BUSINESS LEADERS ADDRESS PLANNED SALE OF VERMONT IBM PLANT TO GLOBALFOUNDRIES
October 21, 2014
ESSEX JUNCTION, Vt., Oct. 20 -- Gov. Peter Shumlin, R-Vt., issued the following press release: Gov. Peter Shumlin was joined today by business groups, employers, local officials, lawmakers and others to offer strong state partnership to GlobalFoundries. The Santa Clara-based semiconductor manufacturer today announced its intention to purchase IBM's facilities in Vermont and continue operations and employment at the plant. GlobalFoundries said that manufacturing at the facility will continue, with robust demand supporting plant operations and employment. The announcement ends months of uncertainty about the fate of the plant due to IBM's strategic realignment of its business away from silicon chip manufacturing.

Mubadala chip unit in $1.5bn deal with IBM
October 21, 2014
IBM will pay GlobalFoundries US$1.5 billion over the next three years for the Mubadala-owned company to take on its floundering microelectronics business. IBM is shedding the unit to focus on the development of cloud computing, mobile and big data analytics and semiconductor research in which it has invested $3bn over five years.

Phoenix Semiconductor plans to reduce reliance on Samsung
October 21, 2014
SOUTH Korean firm Phoenix Semiconductor Philippines Inc. said it will significantly reduce the reliance of its business from the global electronics giant Samsung as it will start taking orders from Japanese and American companies.

Semiconductor and Other Electronic Component Manufacturing in Canada Industry Market Research Report Now Available from IBISWorld.
October 16, 2014
  New York, NY (PRWEB) October 17, 2014       The Semiconductor and Other Electronic Component Manufacturing industry produces a range of input devices that are necessary in the production of electronics, including circuits and memory chips. In the past five years, the industry has contracted due to the continued offshoring trend that has pervaded much of Canada's manufacturing sector. In addition, greater competition from US and East Asian manufacturers, which offer lower-priced products due to more competitive labour costs, have contributed to the industry's decline. "As such, although demand for downstream electronics is on the rise, the inputs are being manufactured elsewhere," according to IBISWorld Industry Analyst Darryle Ulama. As a result, in the past five years, industry revenue is expected to decline at an annualized 5.1% to $2.5 billion, including an 8.0% decline in 2014.           The broader electronics value chain is highly globalized, with product design, raw material procurement and manufacturing segmented across facilities in different regions.

Modular systems automate IC test; SEMICONDUCTOR TEST; integrated circuits; Editorial
October 01, 2014
  Modular instruments provide a flexible, scalable way to test semiconductors--some of these individual instruments are described in a recent EE special report. (1) However, some modular-instrument vendors will put together subsystems or complete turnkey systems, along with software and DUT interfaces, that you can easily deploy. For example, Marvin Test Solutions builds systems based on its PXI instruments and ICEasy semiconductor-test software toolset. And Aeroflex offers a variety of systems and subsystems based on its own and--as required--third-party PXI and AXIe instruments.           [FIGURE 1 OMITTED]     And at NIWeek 2014, National Instruments adopted a turnkey approach with the introduction of the NI Semiconductor Test System (STS) series (Figure 1), which supports automated test of RF and mixed-signal devices. But despite the turnkey flavor of the new system, which integrates with handlers, for example, Luke Schreier, senior group manager of test systems, emphasized that the systems are based on the open-architecture PXI platform and are fully accessible to the customer. The approach, he said, is particularly beneficial for customers with RF and mixed-signal test needs.       Speaking at NlWeek, Rebeca Jimenez, vice president for worldwide test operations at Integrated Device Technology, and Glen Peer, director of test at IDT, described their early use of the NI STS.

Enabling researchers to chase electrons and measure P[OMEGA]; MATERIALS SCIENCE; Editorial
October 01, 2014
  The materials science field is poised for significant advancement as researchers investigate graphene, polymers, nanomaterials such as carbon nanotubes, and exotic dielectrics, according to Alan Wadsworth, market development manager for the Hachioji Semiconductor Test Division of Keysight Technologies. He cited Yole Developpement predictions that the market value for graphene materials for opto and electronic applications will increase at an 18.5% CAGR through 2018 and then at a 35.7% CAGR through 2024.         [ILLUSTRATION OMITTED]           "New materials science applications are growing, and investment is ramping up quickly," he said. Researchers involved in such applications, he said, typically need to measure extremely small currents and extremely large resistances.         A DMM can make current measurements down to 10 nA or so, but you need a picoammeter to go lower. Similarly, you'll need an electrometer, which Wadsworth defines as a high-performance DMM, to make resistance measurements beyond a gigaohm and up into the petaohm range--as well as low-current measurements. An electrometer, he said, can serve as an ohmmeter, voltmeter, and charge meter as well as an ammeter. He added that most picoammeters do not include voltage sources; most electrometers do.           Wadsworth cited several test challenges in making low-level measurements.

Machine Vision based Micro-crack Inspection in Thin-film Solar Cell Panel
September 01, 2014
FULL TEXT Abstract: Thin film solar cell consists of various layers so the surface of solar cell shows heterogeneous textures. Because of this property the visual inspection of micro-crack is very difficult. In this paper, we propose the machine vision-based micro-crack detection scheme for thin film solar cell panel. In the proposed method, the crack edge detection is based on the application of diagonal-kernel and cross-kernel in parallel. Experimental results show that the proposed method has better performance of micro-crack detection than conventional anisotropic model based methods on a cross-kernel. Copyright © 2014 IFSA Publishing, S. L. Keywords: Edge detection, Diagonal-kernel, Cross-kernel, Heterogeneously textured, Solar cell, Micro-crack inspection.

Indium Doping Effect on Structural, Optical and Electrical Properties of Sprayed ZnO Thin Films
September 01, 2014
FULL TEXT Abstract: In the current work, indium doped zinc oxide thin films were deposited by spray pyrolysis technique on glass substrate at 350 °C. The effect of the preparation conditions on the structural, morphological, optical and electrical properties of the films has been studied. The molar ratio of indium in the spray solution was varied from 0 to 5 at %. All the deposited films are polycrystalline with a (002) preferential orientation at low indium concentration. X-ray diffraction technique shows that the quality of the films was deteriorated when increasing indium concentration. Scanning Electron Microscopy and Atomic Force microscopy were performed to examine the surface morphology of the films. The deposited films showed an average optical transmittance around 85 % in the visible region; meanwhile the band gap value was varied between 3.13 and 3.25 eV. Hall Effect measurements revealed that the indium doping induces an increase in the electron concentrations, making the films heavily n type. A lowest resistivity (0.3 ohmcm), compared to that of the undoped ZnO (66 ohmcm), is obtained for the film doped with 3 % of indium. Copyright © 2014 IFSA Publishing, S.L. Keywords: ZnO, TCO, Spray Pyrolysis, Thin films, Characterization.


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