Headlines


United Kingdom Intellectual Property Office Publishes Application for Trademark "Quantum Materials" to Auriel for Various Goods and Services
April 17, 2014
South Wales, April 17 -- Auriel Ltd., Grantchester, has filed the trademark "Quantum Materials" on Nov. 21, 2013, for various goods and services. The trademark application (journal number: 2014/015) was published on April 11. The description of the mark registered is: "Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors;Doping compounds for use in the manufacture of semiconductors;Masking compounds for use in the manufacture of semiconductors;Cryogenic preparations;Gases for use in refrigeration systems;Chemical compositions for use in the manufacture of electronic components;Chemicals used in the manufacture of electronic components;Compositions for embedding electronic parts;Freezing agents for use in cooling electronic components;Helium;Battery electrolytes;Oxides;Oxides of metal. Machines for manufacturing semiconductors;Machines for the production of semiconductors;Superconductive magnetic separators;Refrigeration compressors;Refrigeration condensers;Memory chip manufacturing machines. Scientific, optical, measuring, magnetic data carriers, recording discs; other digital recording media; calculating machines, data processing equipment, computers; computer software;Semiconductors;Superconductive magnet apparatus;Sensor switches;Electronic circuit board;Electronic circuit cards;Electronic coding units;Electronic indicator boards;Electronic indicator panels;Electronic integrated circuits;Electronic semi-conductors;Electronic decoders;Electronic encryption units;Electronic global positioning systems;Electronic touch sensitive switches;Electronic transformers;Encoded electronic chip cards;Audio electronic apparatus;Circuits [electric or electronic];Electronic amplifiers;Electronic coding apparatus;Electronic communication installations;Electronic components;Electronic control apparatus;Electronic control circuits;Electronic control systems;Electronic control units;Electronic controllers;Electronic data carriers;Electronic data processing equipment;Electronic digitisers;Electronic display panels;Electronic logic circuits;Electronic magnetic recording media;Electronic measurement sensors;Electronic memory circuits;Electronic memory integrated circuit chips;Electronic memory units;Electronic meters;Electronic metronomes;Electronic miniature relays;Electronic monitoring instruments, other than for medical use;Electronic notebooks;Electronic panels for displaying messages;Electronic photometers;Electronic plotters;Electronic pressure sensors;Electronic process control units;Light diodes;Light switches;Light emitting diode displays;Light meters;Light conductors;Light probes;Light sensors;Cells [electric];Electric cells;Rechargeable cells;Solar cells;Photovoltaic cells;Computer memory hardware;Electronic memory circuits;Electronic memory integrated circuit chips;Electronic memory units;Memory devices;Memory storage devices;Computer memory devices;Transistors.

MICRON TECHNOLOGY REPORTS DISPOSITION BY CEO DURCAN (Idaho)
April 17, 2014
WASHINGTON, April 17 -- Micron Technology Inc. (MU), Boise, Idaho, has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by CEO and Director Dermot Mark Durcan, Boise.

MegaChips and Vidatronic execute Joint Development Agreement; MegaChips Corporation announces the MegaChips new generation LDO, a new line of products jointly developed with Texas-based semiconductor company, Vidatronic, Inc.
April 16, 2014
 MegaChips, one of the world's largest application-specific integrated circuit (ASIC) solution providers, introduces MegaChips' new generation LDO, a new line of low dropout (LDO) linear voltage regulators offering superior performance over traditional LDO products. MegaChips new generation LDO features unparalleled dynamic performance and power supply noise rejection with or without an output capacitor. When used without an output capacitor, this LDO will save approximately 25% of the PCB board area making this an ideal solution for space sensitive applications such as smartphones, tablet PCs and the latest wearable devices. 

Free Keithley Web-Based Seminar Shares Keys to Semiconductor Testing Success; Reveals solutions to the challenges of maximizing throughput and accuracy
April 16, 2014
Keithley Instruments , a world leader in advanced electrical test instruments and systems, is offering a free, web-based seminar titled "Optimizing Semiconductor Measurements and Test Times." This event, which is available for on-demand viewing, discusses how test engineers can meet the challenge of maximizing throughput without sacrificing accuracy in the testing of semiconductor devices. It also provides insight into the high current and high voltage requirements of today's power semiconductor devices. To register for this web-based seminar, visit http://www.keithley.com/promo/ws/1403 .

Lava Selects Broadcom Quad-Core HSPA+ Turnkey Platform to Power New QPAD Tablet; Feature-Rich Tablet Satisfies India's Booming Demand for Advanced Connectivity and Entertainment at an Affordable Price Point
April 16, 2014
 Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that Lava International Limited, one of the region's fastest growing mobile device providers, selected Broadcom's quad-core HSPA+  turnkey platform forLava's newly released QPAD e704 tablet. Powered by Broadcom's 1.2 GHz quad-core processor, RF transceiver, power management IC, connectivity combo chip and multi-constellation GNSS location chip, the proven Broadcom platform enabled Lava to produce an affordable feature-rich tablet with the advanced connectivity and entertainment capabilities demanded by today's consumer. For more news, visit Broadcom'sNewsroom.

REMINDER: MEDIA ALERT: Oski Technology to Host Latest Decoding Formal Club for Formal Verification Enthusiasts; April 21 Agenda Includes Panel on Building Formal Team, Presentation on Formal Test Planning
April 16, 2014
WHO: Oski Technology, Inc., the only dedicated formal verification service provider WHAT: Will host the Decoding Formal Club, the latest in a series of meetings dedicated to fostering formal idea sharing among formal verification enthusiasts. It will include a panel moderated by Harry Foster, chief verification scientist at Mentor Graphics, titled, "Building a Formal Team." Also on the agenda, which includes lunch, is a presentation from Oski on "Formal Test Planning" and a self-guided tour of the Computer History Museum.

Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component; Fully Automated Manufacturing Technology Drives Growth for WLP Startup
April 16, 2014
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) manufactured using Deca's unique, integrated Autoline production platform, which is designed to achieve faster time-to-market at lower cost.

NECA-IBEW Contractor Helps in Ohio Hospital Expansion, a Feature of "Industry Today" on Industrialinfo.com
April 16, 2014
Researched by Industrial Info Resources (Sugar Land, Texas) -- When Mercy Medical Center in Canton, Ohio, needed to be expanded, hospital leaders called on the NECA-IBEW team to perform the electrical construction work. Initially designed for about 44,000 visits per year, the facility's emergency center currently has about 65,000 annual visits, which is anticipated to increase to up to 70,000 to 80,000 visits per year in the future.

US Contract Notice: Department of the Air Force Issues Solicitation for "Semiconductor Research"
April 16, 2014
Department of the Air Force, Air Force Materiel Command Officer has issued requirement for "Semiconductor Research." Solicitation no. FA8601-13-T-0151 Posted on: April 16, 2014

FORM 8-K: TRIQUINT SEMICONDUCTOR INC FILES Current report
April 15, 2014
TRIQUINT SEMICONDUCTOR INC, Delaware, has filed FORM 8-K (Current report) with Securities and Exchange Commission on April 14, 2014 State or other Jurisdiction of Incorporation: Delaware Item 8.01 Other Matters On February 22, 2014, TriQuint Semiconductor, Inc. (“TriQuint”) and RF Micro Devices, Inc. (“RFMD”) entered into an Agreement and Plan of Merger and Reorganization (“Merger Agreement”), pursuant to which RFMD and TriQuint agreed, on the terms and subject to the conditions of the Merger Agreement, to effect a strategic combination of their respective businesses through a “merger of equals” business combination transaction (the “Business Combination”).


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