Headlines


USPTO ISSUES TRADEMARK: FORZA SILICON
March 27, 2015
ALEXANDRIA, Va., March 27 -- The trademark FORZA SILICON (Reg. No. 4707351) was issued on March 24 by the USPTO.

Centre to invest $ 10 bn in chip manufacturing facilities in Guj: UP
March 27, 2015
New Delhi, March 27 -- The Union Government would be investing ten billion dollar in the chip manufacturing facilities coming up in Gujarat and UP, Secretary, Department of Electronics and Information Technology RS Sharma said.

Dialog Semiconductor Bolsters Bluetooth Smart SoC Family with Application-Optimized Versions
March 27, 2015
Dialog Semiconductor reported three additions to its successful SmartBond family of ultra-low power, Bluetooth Smart System-on-Chip (SoC) integrated circuits. According to a release from the company, the devices, aimed at high volume, high growth consumer markets, are the smallest and lowest power wireless connectivity solutions for the Internet-of-Things (IoT). Versions optimized for wireless charging and remote control units (RCUs) address markets that will ship over 1.5 billion units per annum within 4 years. "Our first SmartBond device, the DA14580, propelled Dialog rapidly into market leadership, thanks to its unique combination of exceptionally small size and minimal power consumption. We've been particularly successfully in human interface devices (HID), proximity sensing, medical devices, and smart home applications. The new SoCs will accelerate our market share growth as we help customers in other fast-growing consumer markets achieve their design goals rapidly and reliably," said Sean McGrath, Senior Vice President and General Manager, Connectivity, Automotive & Industrial Business Group at Dialog Semiconductor.

Govt to Invest $10 Billion in Chip-Making Facilities
March 27, 2015
The government will be investing $10 billion (about '. 62,000 crore) in the chip manufacturing facilities to be set up in Gujarat and Uttar Pradesh, where a consortium of manufacturing firms has come up to establish production bases. "In the next few years, India will cover considerable ground in chip manufacturing and designing to cater to the growing

Govt to Invest USD 10 bn in chip manufacturing facilities
March 27, 2015
New Delhi, March 27 -- Infrastructure for chip manufacturing and designing will be considerably strengthened in India to cater to the growing domestic demand and to cut down the imports in the next few years.

MACOM Extends Leading Optical Portfolio with New Dual Channel Linear Transimpedance Amplifier; MACOM's High Gain Linear TIA is Ideal for Metro Applications at 100G and Beyond
March 26, 2015
M/A-COM Technology Solutions Inc. ("MACOM"), a leading supplier of high performance analog RF, microwave and optical semiconductor products, today announced the new MATA-003806, a dual channel linear transimpedance amplifier (TIA) for next generation coherent receiver applications.

Vishay Intertechnology Announces 'Super 12' Featured Products for 2015; Innovative Components Offer Industry-Leading Specifications for a Variety of Applications
March 26, 2015
Vishay Intertechnology, Inc. (NYSE:VSH) today announced its "Super 12" featured products for 2015. Each year, Vishay identifies a dozen key semiconductor and passive components featuring new and improved technologies that can significantly improve the performance of end products and systems. Vishay's Super 12 collection showcases the company's industry-leading capabilities in semiconductor and passive devices and provides a cross-section of Vishay's very broad product portfolio. The Super 12 products for 2015 are:

Minco Partners with Digi-Key to Offer Bare Die Semiconductor Products
March 26, 2015
Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, and Minco Technology Labs, LLC, today announced that they have teamed up to offer semiconductor bare die products to its global customer base. As part of the agreement, Digi-Key customers will be able to purchase off-the-shelf die products in minimum waffle pack quantities of 25 pieces online. "We welcome this opportunity to serve a broader customer base by partnering with a global distributor like Digi-Key who has become known as the 'go to' online resource for semiconductors," says Bill Bradford, Minco CEO. "Their expertise in offering full-range services for the design engineer along with their ability to support prototype and production order quantities is a huge value-add for the die market."

Minco Partners with Digi-Key to Offer Bare Die Semiconductor Products
March 26, 2015
Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, and Minco Technology Labs, LLC, today announced that they have teamed up to offer semiconductor bare die products to its global customer base. As part of the agreement, Digi-Key customers will be able to purchase off-the-shelf die products in minimum waffle pack quantities of 25 pieces online. "We welcome this opportunity to serve a broader customer base by partnering with a global distributor like Digi-Key who has become known as the 'go to' online resource for semiconductors," says Bill Bradford, Minco CEO. "Their expertise in offering full-range services for the design engineer along with their ability to support prototype and production order quantities is a huge value-add for the die market."

eSilicon Webinar Series: From Medical and Wearables to Big Data: Differentiated IP for the IoT Spectrum; Customizing Memory IP for IoT Applications; Presented in Japanese, Korean and Mandarin
March 25, 2015
Creating the right chip for power-sensitive Internet of Things (IoT) applications requires the right memory IP. These webinars will provide memory IP examples and customization techniques across IoT market segments that demonstrate eSilicon's ultra-low-power and ultra-low-voltage memory solutions.


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