Headlines


Application of electrical discharge machining for machining of semi-conductor materials
September 23, 2014
FULL TEXT KEYWORDS EDM; Experiment; Boron carbide; MRR; Surface-roughness; DOE. Abstract. In recent years, the research work in material science has encouraged the development of advanced ceramic materials. Boron carbide has many applications in industries for manufacturing of products such as water jet nozzle and abrasive particles. In this paper several experimental tests have been conducted to study the effect of process parameters in machining of boron carbide "B4C" by using the electrical discharge machining process "EDM". The effect of voltage variation, current intensity, on-pulse and off-pulse durations on surface roughness (Ra) and Material Removal Rate (MRR) were studied simultaneously by utilizing the Design Of Experiment (DOE) technique. This research work indicated that the "EDM" process can be used to machine semi-conductor materials such as \B4C" successfully. In addition, it was found that, the quantity of material removal rate and the quality of workpart surface roughness could be affected by the variations of these process parameters. Finally, the experimental results obtained were compared with the published results reported by other scientist, and a good agreement was found between them. © 2014 Sharif University of Technology. All rights reserved.

Shanghai Belling Held Hua Hong Semiconductor to List
September 22, 2014
HONG KONG, September 22, SinoCast -- Shanghai Belling Co., Ltd. (SHSE: 600171) revealed that Hua Hong Semiconductor Ltd. held by wholly owned Hylintek Ltd. has submitted listing application to the Hong Kong bourse and gone through listing hearing on September 18. Currently, Hua Hong Semiconductor is 7.95% indirectly held by Shanghai Belling, representing 64.0101 million shares. Changing stock price of Hua Hong Semiconductor after listing will affect fair value of shares held by Shanghai Belling in the company.

Senior Analog Design Engineer
September 22, 2014
National Defense Industrial Association has issued the following Job Vacancy: Senior Analog Design Engineer Location: Chandler, AZ 85224 ::Microchip Technology Inc. is a leading provider of micro-controller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.

STATS ChipPAC Announces Resignation of Chief Operating Officer
September 21, 2014
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that Mr. Wan Choong Hoe has resigned from his position as Executive Vice President and Chief Operating Officer effective 30 September 2014 to pursue personal interests.

GERMANIUM TIN COULD MEAN BETTER AND CHEAPER INFRARED CAMERAS IN SMARTPHONES
September 18, 2014
The following information was released by the University of Arkansas: Engineering researchers at the University of Arkansas have fabricated a new semiconductor material -- germanium tin deposited in layers on a substrate of silicon -- that could be used to build better and less expensive infrared cameras for smartphones and vehicles.

GERMANIUM TIN COULD MEAN BETTER AND CHEAPER INFRARED CAMERAS IN SMARTPHONES
September 18, 2014
The following information was released by the University of Arkansas: Engineering researchers at the University of Arkansas have fabricated a new semiconductor material -- germanium tin deposited in layers on a substrate of silicon -- that could be used to build better and less expensive infrared cameras for smartphones and vehicles.

ON Semiconductor introduces Struix SiP solution
September 17, 2014
HIGHLIGHT: ON Semiconductor has introduced Struix, a semi-customizable System-in-Package, or SiP, solution for precision sensing and monitoring in mobile medical electronics including glucose monitors, heart rate monitors and electrocardiogram analyzers.

Lattice Semiconductor unveils USB 3.1 Type-C power delivery solution
September 16, 2014
HIGHLIGHT: Lattice Semiconductor Corporation has unveiled a USB 3.1 Type-C power delivery solution that enables manufacturers to develop USB 3.1 Type-C connectors.

ON Semiconductor launches new KAI-08670 Image Sensor
September 16, 2014
HIGHLIGHT: ON Semiconductor has announced the launch of new KAI-08670 Image Sensor, an 8.6-megapixel CCD in an APS-H optical format.

K2 Energy Limited: MEARS signs Memorandum of Understanding
January 01, 1970
Sydney - Monday - September 22 (RWE) - K2 Energy Limited (ASX: KTE) provide the following update on MEARS Technologies Inc ("MEARS").


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