A cool idea; Electricity-free air conditioning
November 29, 2014
New materials may change the way temperatures are regulated AIR conditioning is a transformative technology. It has made the world's torrid climes pleasanter to live in, and enabled the siesta-free working habits of the temperate regions to move closer to the equator. But cooling buildings takes a lot of energy. Heat must be pumped actively from their interiors to their exteriors. Fully 15% of the electricity used by buildings in the United States is devoted to this task. If an idea dreamed up by Aaswath Raman of Stanford University and his colleagues comes to fruition, that may change. Dr Raman has invented a way to encourage buildings to dump their heat without the need for pumps and compressors. Instead, they simply radiate it into outer space. The idea, described in this week's Nature, is both cunning and simple. Outer space is very cold (about 3°C above absolute zero) and very big, so it is the perfect heat sink. Earth radiates heat into it all the time. But this is compensated for by the heat the planet receives from the sun. To encourage one part of Earth's surface (such as an individual building) to cool down, all you need do in principle is reflect the sunlight which falls on it back into space, while also encouraging as much radiative cooling from it as possible.

MILITARY Semiconductor Devices Sought by Defense Logistics Agency
November 28, 2014
WASHINGTON, Nov. 27 -- The Defense Logistics Agency's Defense Supply Center, Richmond, Virginia, has issued a combined synopsis/solicitation notice (SPE4A515T8468) for semiconductor devices to be delivered to Defense Distribution Depot, Hill, Utah. It was posted on Nov. 24 with a response date of Dec. 5. For more information about Targeted News Service contract awards please contact: Myron Struck, Editor, Direct: 703/866-4708, Cell: 703/304-1897, Myron@targetednews.com 30BautistaJude 141126-mv-790667 30VitinMar

Altera CEO John Daane Receives 2014 Robert N. Noyce Award From Semiconductor Industry Association
November 27, 2014
Thursday, November 27, 2014: Altera Corporation (Nasdaq: ALTR) today announced that President, CEO and Chairman of the Board John P. Daane is this year's recipient of the prestigious Semiconductor Industry Association (SIA) Robert N. Noyce Award. Daane was presented the award by John Kelly, senior vice president and director of IBM research and 2014 SIA chairman, before the semiconductor industry's top leaders and more than 400 SIA members at the annual SIA dinner held at the Fairmont Hotel in San Jose on November 13, 2014. Selected by the SIA Board of Directors and members, the award recognizes Daane's sustained contributions to advancing the semiconductor industry both in the United States and throughout the world. "John represents the heart and soul of our industry, and we are pleased to recognize his efforts with this well-deserved award," said Brian Toohey, president and CEO of the SIA. "During his tenure on the SIA Board and throughout his career, John has brought leaders together to tackle issues facing our industry and advance critical semiconductor priorities."

Chip and pin payment facility now available for licence applications
November 27, 2014
Aberdeenshire Council, UK Government has issued the following news release: Aberdeenshire Council is making it easier for people to pay for licences by accepting chip and pin payments within licensing offices across the area.

Market Chatter: Taiwan Semiconductor Hits New 14-Yr High on Expectations to Grab 40-50% of Apple A9 Chip Orders
November 26, 2014
Taiwan Semiconductor Manufacturing (TSM) American depository receipts rose to a new 14-year high of $23.18 Wednesday after industry sources noted the company will likely secure 40% to 50% of Apple's (AAPL) A9 processor orders, DigiTimes reported.

Toshiba Introduces New Low-Height Transistor Output Photocoupler; Offers Wider Creepage Distance; Suited to Applications with Strict Height Requirements
November 26, 2014
 Toshiba America Electronic Components, Inc.(TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a new transistor output photocoupler in a low-height SO6L 4 pin package - the TLP385. With its low-height of 2.3mm (max), 45 percent lower than DIP4 packages, the TLP385 can be used in situations with strict height requirements. Applications including motherboards, programmable logic controllers, AC adapters, I/O interface boards, inverter interfaces and general purpose power supplies are suited to the new photocouplers.

CyberOptics Features Advanced Airborne Particle Sensor Technology at SEMICON Japan; Company shows 60% increased sensitivity in industry-leading airborne particle sensor technology and continues to enable improvement in fab yields and equipment uptime
November 26, 2014
CyberOptics® Corporation (NASDAQ: CYBE), a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate its wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON Japan in Booth #4013 at Tokyo Big Sight, Tokyo, Japan Dec., 3-5, 2014. To address the market demand for airborne particle measurement in 150mm semiconductor, gallium arsenide (GaAs), LED and flat panel display fabs, CyberOptics will also highlight the new WaferSense® Airborne Particle Sensor APS2 150C, its most recent extension of its APS line in a 150mm wafer form factor. The new APS2 150C incorporates advanced technology with a 60% increase in particle sensitivity at <10 false counts per hour.

Microsemi to Present at Nasdaq OMX 31st Investor Program in London
November 26, 2014
 Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will present at the Nasdaq OMX 31st Investor Program in London on Dec. 3 at 10:45 a.m. Greenwich Mean Time (5:45 a.m. EST).

PRWeb Newswire
November 26, 2014
  Nov. 24, 2014 - SAN FRANCISCO, CALIFORNIA (PRWEB) November 26, 2014           The new iPhone 6 incorporates a Qualcomm LTE modem that has been very well received by the IT\&C industry. According to "Forbes" magazine, Qualcomm's LTE chipsets registered over 40% of the total baseband shipments in 2013 and their cellular basebands are the top choice of large industry device manufacturers like Samsung, LG, Sony or Google.*             As the recent interoperability test proved, SS7Ware's Unified Core Network is a core solution for LTE and 2/2.5G networks, adapted to the present and future needs of the telecom market as it is compatible with one of the most utilized VoLTE basebands on the market. The SS7 product simplifies the network design without impacting the scaling of the system, resulting in lower deployment and management costs, implementing all functions of a MSC/VLR, GGSN, SAE and IMS in a single unit.         Supporting Quotes     "It is a great accomplishment for us to see what we have envisaged in theory getting into shape so fast.

US Contract Notice: Defense Logistics Agency Issues Solicitation for "SEMICONDUCTOR DEVICE"
November 24, 2014
Defense Logistics Agency, DLA Acquisition Locations Officer has issued requirement for "SEMICONDUCTOR DEVICE." Solicitation no. SPM7M113UC550 Posted on: November 24, 2014


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