Headlines


MStar to Include Cryptography Research's CryptoFirewall(TM) Security Core in Connected TV Chips; Enables first IP core-based, advanced security for smart TV market; fully compatible with existing CAS and DRM, providing most stringent security for premium content
August 28, 2014
Cryptography Research , the security division of Rambus (NASDAQ:RMBS), today announced that MStar Semiconductor, Inc., a leading semiconductor company for display and digital home solutions, has licensed the Cryptography Research CryptoFirewall(TM) security core for integration into its connected TV solution chips. The CryptoFirewall core will provide operators and over-the-top (OTT) distributors utilizing MStar-based connected TVs with strong hardware security to protect content and services against piracy. The proliferation of OTT content, along with the market opportunity for "smart" connected televisions, has created a need for security solutions that not only offer robust protection on par with set-top-boxes, but also work across broad ecosystems. Through adding in the CryptoFirewall core, MStar is taking a differentiated approach by integrating a provider-agnostic security block that resides within the SoC, available for all service providers. Operators and OTT distributors can benefit from hardware-based security that satisfies the most stringent requirements for premium content, all while continuing to use their existing CAS and DRM systems.

Image Sensor Market Worth $15.77 Billion by 2020
August 28, 2014
According to a new market research report "Image Sensor Market by Technology (CMOS, CCD), Spectrum, Array, Scanning Method, Application (Consumer Electronics, Healthcare, Industrial, Security, Automotive, Aerospace, and Defense) and by Geography - Analysis and Forecast (2013 - 2020)", published by MarketsandMarkets, Image Sensor Market is expected to reach $15.77 Billion by 2020 growing at a CAGR of 8.06% from 2014 to 2020. Browse 61 market data Tables with 83 Figures spread through 191 Pages and in-depth TOC on "Image Sensor Market".

SMIC Announces Unaudited 2014 Interim Results
August 28, 2014
 Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) one of the leading semiconductor foundries in the world, announces the unaudited interim results of operations of the Company and its subsidiaries for the six months ended June 30, 2014.

Renesas Electronics New R-Car V2H Device Offers High-Resolution Image Recognition for Safer Driver Assistance Systems in Conventional and Emerging Self-Driving Vehicles; Single-Chip Device Packs Company's Ground-Breaking Image Recognition Technology and Other Functions for High-Performance, Low Power, and Improved Safety
August 28, 2014
Renesas Electronics Corporation (TSE:6723), today announced the availability of its R-Car V2H, the company's newest system-on-a-chip (SoC) implementing state-of-the-art image recognition technology to support high-resolution surround viewing in advanced driver assistance systems (ADAS). This is the first R-Car ADAS device from Renesas and includes additional functionality for higher performance, lower power, and improved safety in traditional and emerging self-driving vehicles.

Skyworks Receives Diamond Supplier Award from Lenovo; Recognized for Unparalleled Support and Service; Highest Honor for Suppliers
August 28, 2014
Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that it received the Diamond Supplier Award from Lenovo for providing outstanding service and support. The award, which is the highest recognition Lenovo provides to suppliers, specifically recognizes Skyworks for being a strategic partner and playing an instrumental role in delivering low-cost, customized solutions supporting the company's recent product launches. Lenovo utilizes a variety of Skyworks front-end solutions including multimode, multiband power amplifiers, antenna switches, diodes and global positioning system devices. "Lenovo would like to thank Skyworks for their unparalleled support and service," said David Wang, vice president of procurement at Lenovo. "Over the past 10 years Skyworks has been a valuable partner, particularly as Lenovo has continued to diversify beyond the personal computer into smartphones, tablets and smart televisions. We value their leadership position, high performance devices and outstanding customer service - - - all of which are enabling us to deliver the best solutions to our customers and the Internet of Things market."

Toshiba's Mixed Signal IC Products Strategy
August 28, 2014
Toshiba (TOKYO:6502) develops products in three fields: automotive, communication and motor control. The characteristics of Toshiba mixed signal ICs are engineering power in the analog business (development, cost, quality and supply capacity) and proposal power that considers customer. In 2014, we are extending collaboration with other business units, utilizing strong in-house engineering (image recognition, motor control technology, etc.), improving integrated solution capacity and promoting new market development in collaboration with other in-house companies and Toshiba Group companies, so as to enhance our product competitiveness and line-up across our product range. (1) Automotive field (Image recognition, Automotive analog) The environment for automotive semiconductors is changing significantly and hybrid electric vehicles (HEV) and electric vehicles (EV) are becoming increasingly popular. Since the importance of Advanced Driver Assistance System (ADAS) as a means to realize safer and more comfortable driving continues to grow, we are strengthening product development for HEV, EV and ADAS, alongside LSIs for vehicle control and driving safety.

Himax Imaging Chooses TowerJazz Panasonic Semiconductor's State of the Art 65nm Process with Outstanding 1.12um Pixel for Its Next Generation Cameras for Smart Phone Applications; The market for high end cameras for smart phones having resolution of above 8Mp is estimated to grow from 500M units in 2013 to 1300M units in 2017
August 28, 2014
TowerJazz (NASDAQ: TSEM)(TASE: TSEM), the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) today announced its first major third party CMOS image sensor (CIS) customer, Himax Imaging, Inc ., a subsidiary of Himax Technologies, Inc. (Nasdaq: HIMX), that is developing its next generation high end cameras for smart phone applications using TPSCo's state of the art 1.12um-pixel CMOS image sensor (CIS) 65nm process. According to a report from Yole Développement on mobile phone business, 500 million units of high end cameras for smart phones having resolution of above 8Mp were sold in 2013 and sales of such cameras are expected to grow to 1300 million units in 2017.

Sigma Designs Launches Enhanced SDK for 5th Generation Z-Wave(R) Chipset; New Features Reduce Time to Market for Developers
August 28, 2014
Sigma Designs(R) (NASDAQ: SIGM), a leading provider of intelligent system-on-chip (SoC) solutions for Smart TV, Smart home and IP-based set-top-boxes (STBs), today announced a new feature-rich SDK for its 500 Series chips and modules to further enhance Z-Wave's primary position in the rapidly growing wireless home control market. The Z-Wave installed base has over 25 million interoperable products from market-leading manufacturers world-wide who have adopted Z-Wave for its persistent laser focus on residential and light commercial device control, and its mature hardware and development tools. The 6.51.03 release of the SDK fully enables the advanced functionality found in Sigma Designs 500 Series SoC platform and includes:

MEMS Industry Group Hosts 10th Annual MEMS Executive Congress US; Tech Business Leaders Explore MEMS and Sensors in Consumer, Environmental, Healthcare/Medical, Industrial Apps
August 28, 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress(R) US 2014, the annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ. Spanning environmental sensors for safe drinking water to personalized healthcare, cybersecurity for connected systems, and spectral imaging in wearable devices, micro-electromechanical systems (MEMS) and sensors enable human-machine interactions in unprecedented ways. "This year's MEMS Executive Congress US speakers reflect some of the most fascinating uses of MEMS and sensors in commercial applications," said Karen Lightman, executive director, MEMS Industry Group. "Ayasdi is tracking disease via smartphone. MoboSens uses a smartphone sensor to monitor nitrate in drinking water. VTT's microspectromers are likely to be used for skin cancer analysis, among many other uses. GE is advancing MRI. Wurldtech's technology protects critical infrastructure for oil and gas, smart grid and medical devices. And those are just a few of our speakers who will enlighten the C-level audience about maximizing the potential of MEMS and sensors -- the theme of this year's MEMS Executive Congress. Equally exciting, Congress attendees will also hear from entrepreneurs, academic innovators and one of the world's largest foundries, TSMC."

KLA-Tencor launches systems for 5D patterning control solution
August 28, 2014
Process control and yield management solutions provider KLA-Tencor Corp of Milpitas, CA, USA has introduced the WaferSight PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system, and the K-T Analyzer 9.0 advanced data analysis system. The three new products support KLA-Tencor's 5D patterning control solution, which addresses five elements of patterning process control — the three geometrical dimensions of device structures, time-to-results, and overall equipment efficiency. The 5D patterning control solution is being developed to drive optimal patterning results through the characterization, optimization and monitoring of processes inside and outside the lithography module. By combining these measurements with intelligent feedback and feed-forward process control loops, the solution can help chipmakers to obtain faster, more cost-effective ramps of multi-patterning, spacer pitch splitting and other advanced patterning technologies using existing process equipment, says the firm.


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