Headlines


KLA-Tencor Introduces Key Systems for 5D(TM) Patterning Control Solution; Accelerating The Ramp Of Advanced Patterning Techniques For Sub-20nm Design Nodes
August 26, 2014
Today,KLA-Tencor Corporation(NASDAQ: KLAC) introduced the WaferSight(TM) PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer® 9.0 advanced data analysis system. These three new products support KLA-Tencor's unique 5D(TM) patterning control solution, which addresses five elements of patterning process control-the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The 5D patterning control solution is being developed to drive optimal patterning results through the characterization, optimization and monitoring of processes inside and outside the lithography module. By combining these measurements with intelligent feedback and feed forward process control loops, this solution can help chipmakers obtain faster, more cost-effective ramps of multi-patterning, spacer pitch splitting and other advanced patterning technologies using existing process equipment. To view the multimedia assets associated with this release, please click:http://www.multivu.com/players/English/7065552-kla-tencor-wafersight-5d-patterning-control-solution/

Vitesse Adds William C. Martin to Board of Directors
August 26, 2014
Vitesse Semiconductor Corporation (Nasdaq: VTSS), a leading provider of advanced IC solutions for Carrier, Enterprise and Internet of Things (IoT) networks, announced the appointment of William C. Martin to its board of directors.

Eyelit Inc. Releases a New Recipe Management System (RMS) Module to Improve Quality and Lower Manufacturing Costs; Eyelit Manufacturing RMS(TM) coordinates dynamic equipment recipes for automation and advanced process control (APC)
August 26, 2014
Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, life sciences, medical device, semiconductor, and photovoltaic (solar) industries, announced today the general availability of the new Eyelit Manufacturing RMS(TM) module. Automation has become critical for high-tech manufacturers due to the complexity of tight specifications, a high mix of products, fast cycle times, and a need to maximize overall equipment effectiveness (OEE). Eyelit's RMS helps enforce precision automation that prevents mistakes, increases throughput and yield, and adjusts processing to prolong the time between required maintenance activities.

Diodes Incorporated Introduces Octal Logic Selection to Simplify Data Bus Engineering
August 26, 2014
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today expanded its low-voltage CMOS logic family with the addition of octal devices, provided in the space-saving QFN and TSSOP 20-pin packages. Thirteen popular 8-channel logic parts have been introduced, suitable for data bus applications in a wide range of consumer electronics and data communication products.

MaxLinear MxL267 Full-Spectrum CaptureTM Receiver Powers AVM's EuroDOCSIS® 3.0 Cable Gateway Family; AVM's FRITZ!Box6490 Cable Gateway Achieves EuroDOCSIS 3.0 Certification with Design Based on MxL267 24-Channel Digital Cable Front End
August 26, 2014
MaxLinear, Inc. (NYSE: MXL), a leading provider of integrated radio frequency (RF) and mixed-signal integrated circuits for broadband communications applications, today announced that AVM GmbH, a global broadband networking company, has selected the MxL267 Full-Spectrum Capture (FSCTM) digital cable front-end receiver for a new family of EuroDOCSIS 3.0 cable modems and gateways. AVM's new cable gateway, the FRITZ!Box 6490 Cable, recently achieved certification from Cable Europe Labs®. The FRITZ!Box6490 Cable is a high-speed gateway designed using the MxL267 cable tuner capable of receiving over 1Gb/s via 24 bonded downstream channels.

Renesas Electronics Introduces an IEC 61508 TÜV-CertifiedRX631, 63N Safety Packageto Accelerate Implementation of Safety Systems for Industrial Equipment
August 26, 2014
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package, featuring a robust self-diagnostic software and a safety manual for microcontrollers (MCUs) necessary to implement functional safety in industrial equipment. An RX631, RX63N Safety Solution Evaluation Kit will be available in September 2014, providing a hardware evaluation board with the RX63N MCU, the evaluation version of the self-diagnostic software library, and a Users Guide. "Renesas is committed to the quality and the inherent functional safety of our devices, and we understand the complexity that comes with stringent standards like the IEC 61508," said Ritesh Tyagi, vice president of marketing, Renesas Electronics America. "Our Functional Safety Package solution provides customers one less thing to worry about, reducing their risk in certifying their own safety solutions and allowing them to focus on their core areas of expertise."

TowerJazz Qualifies an Additional Factory to Support its Rapidly Growing Customers' Demand for RF Front-End Modules; Market research firm, Mobile Experts forecasts RF front-end component market size to reach $8.9B in 2014, rising rapidly to over $13B in 2018
August 26, 2014
TowerJazz (NASDAQ: TSEM)(TASE: TSEM), the global specialty foundry leader, announced today that it has qualified Migdal HaEmek (Fab 2) capacity for RF SOI switch and bulk CMOS controller process platforms to augment its existing factory in Newport Beach, CA and support the growing demand for RF front-end modules. The move has more than doubled the company's total wafer capacity for these technologies while providing flexible dual sourcing capability to its customers. To date, over 30 products have been taped out to Migdal HaEmek and initial wafer production has begun. The product pipeline remains strong and is now feeding both of these factories. The R&D effort has also been expanded with an R&D team established at each site to take advantage of local talent accelerating the roadmap and ensuring TowerJazz continues to provide its customers a technology advantage in addition to increased supply flexibility. TowerJazz's SOI technology (CS18) offers industry leading insertion loss, isolation and harmonics necessary to support current and future generations of RF products. CS18 together with its CMOS controller technology (CA18) also offer enabling features such as dense digital libraries, MIM capacitors, inductors, multiple resistors, eFuse, and best in class process design kits (PDKs) to ensure first-time success.

TowerJazz to Participate in the Brean Capital 2014 Global Technology Conference on September 3
August 26, 2014
TowerJazz (NASDAQ: TSEM), the global specialty foundry leader, today announced that its Chief Executive Officer, Mr. Russell Ellwanger, will participate in the Brean Capital 2014 Global Technology Conference. The conference is being held on September 3, 2014 at the Millennium Broadway Hotel in New York, New York.

ASE Collaborates on Leading MEMS Device With Bosch Sensortec GmbH; Deep technology integration using ASE's advanced wafer level packaging delivers an industry first in the MEMS accelerometer arena
August 26, 2014
Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (NYSE:ASX), the world's largest semiconductor assembly and test service provider, today announced that it has been selected by Bosch Sensortec GmbH as a key manufacturing and technology partner for production of a leading edge sensor device. Through utilizing advanced wafer level packaging technologies developed at ASE, Bosch Sensortec has successfully brought to market the industry's smallest 3-axis MEMS accelerometer available today. Geared towards highly integrated low-power consumer electronics applications, this leading edge sensor device features digital interfaces in an advanced wafer level chip scale package. With sensor technologies playing an integral role in emerging applications within the Internet of Things and the smart world evolving around us, there is high demand for innovative IC packaging solutions to meet stringent performance, efficiency, and footprint requirements. As an industry leader, ASE was one of the world's first providers of wafer level packaging, which enables the smallest package size possible, that being the same size as the die itself. ASE's proven WLCSP portfolio includes an expanding scope of highly customizable options, encompassing technologies such as high density routing, very thin WLCSPs, low temperature processing, enhanced WLCSP Structures and materials, Wafer Level integrated passives, 3D WLPs, WL MEMS, and embedded die packaging.

FAIRCHILD CLOSING PENANG PLANT
August 26, 2014
Fairchild Semiconductor is closing down its Bayan Lepas manufacturing plant along with its facilities in West Jordan, Utah and Bucheon, South Korea as the group plans to consolidate is operations.


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