ROHM Semiconductor's General-Purpose Automotive MCU System Power Supplies for Idling Stop Systems; Advanced design ensures optimum MCU performance even during cranking
October 21, 2014
ROHM Semiconductorhas recently announced the development of system power supplies optimized for high-performance microcontrollers in a variety of automotive systems, from electronic power steering to fuel injection, including HEVs and EVs.

Entegris Extends Its VaporSorb(TM) Filter Line for Advanced Yield Protection in Semiconductor Processing; New Filter Provides Total Acid Removal From Environmental Air in Chemical Mechanical Planarization (CMP) Process Tools
October 21, 2014
BILLERICA, Mass., Oct. 21, 2014 (GLOBE NEWSWIRE) -- Entegris, Inc. (Nasdaq:ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, today announced a new product for its VaporSorb? line of airborne molecular contamination (AMC) filters. The new filter was created as an "all-in-one," single-filter solution for capturing critical AMC in the chemical mechanical planarization process, or CMP, in semiconductor manufacturing. VaporSorb, which is a leading brand of filter used in cleanroom environments and for process tools during key steps in manufacturing, is the first such filter available for CMP process tools that protects against weak acids as well as other contaminants.

Automotive Bus Technology Delivers Superior Digital Audio Quality; AD2410 transceiver uses new Automotive Audio Bus (A²B) to deliver 50 Mbps bandwidth while reducing audio system cost, weight, and design complexity.
October 21, 2014
Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance semiconductors for signal processing applications, introduced today a digital audio bus technology capable of distributing audio and control data together with clock and power over a single, unshielded twisted-pair wire. The AD2410 transceiver is the first in a family of devices that enables ADI's new Automotive Audio Bus (A²B), which significantly reduces the weight of existing cable harnesses, resulting in improved vehicle fuel efficiency while delivering high fidelity audio. The AD2410 transceiver also eliminates the need for expensive microcontrollers with large memories that are required in existing digital bus architectures.Learn more about the AD2410 transceiver and A2B technology: http://www.analog.com/AD2410Watch a video: http://videos.analog.com/video/products/audiovideo-products/3832751027001/Automotive-Bus-Technology-Delivers-Superior-Digital-Audio-Quality/ "As an early implementer of ADI's A²B, Panasonic Automotive found the technology to significantly reduce cabling complexity and associated cost and weight of next-generation infotainment systems, key areas of focus for Panasonic's OEM customers," said Jonathan Lane, Group Manager, Audio & Acoustics, part of Panasonic Automotive Systems Company of America (PASA*) Advanced Development Engineering. "We believe A²B to be well suited to address applications such as microphone arrays and Active Noise Cancellation, a leading area of expertise for Panasonic that we expect to be an integral component of next-generation infotainment systems."

Freescale Announces the Industry's Most Power-Efficient 64-Bit Arm®-Based Processor for the New Virtual Network; Quad-core QorIQ LS series processor based on ARM Cortex®-A53 core enables "the intelligent edge," provides an optimized platform for the evolution of virtual edge services
October 21, 2014
Freescale Semiconductor [NYSE: FSL] today introduced the QorIQ LS1043A communications processor - the industry's most power-efficient 64-bit ARM-based processor for the new virtual network. The system-on-chip helps edge network equipment manufacturers easily scale power and performance to meet the changing needs of the world's highly virtualized, software-defined networks. Cloud and data center technologies are increasingly deployed in branch offices, retail stores and even residences, driving demand for standard, flexible and low-power platforms. Meanwhile, service providers' multiple "box" service delivery solutions are quickly giving way to a model of fewer on-premises gateways, since numerous services can now be consolidated into less on-site equipment. As virtual network functions and cloud orchestration technologies continue to mature, virtual CPE (vCPE) systems hold the potential for lower service provider opex and capex via reductions in local IT management costs and fewer physical devices to be deployed.

Freescale brings the Internet of Things to the vehicle; Automotive hardware/software solution streamlines development of infotainment systems incorporating Ethernet Audio Video Bridging (AVB) for the connected car of the future
October 21, 2014
Freescale Semiconductor (NYSE: FSL) today introduced a comprehensive hardware/software development system for enabling automotive grade Ethernet connectivity for next generation infotainment, instrument cluster, camera telematics and rear seat entertainment designs. The new solution will support real-time data transport throughout the vehicle and replace expensive digital technologies and other alternatives. Freescale's SABRE AI enables automotive grade Ethernet connectivity for next-generation infotainment, instrument cluster, camera, telematics and rear seat entertainment designs. (Photo: Business Wire)

NXP Enables New Era in Cloud Services Security; Securing User Logins Using Secure Elements and FIDO U2F Authentication
October 21, 2014
SAN JOSE, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI), global leader in secure technology and solutions, today announced a strategic deployment of FIDO U2F secure element ICs for accessing consumer cloud services. As posted in its security blog today, Google announced support for FIDO U2F Security Keys for secure sign-in. Amid growing consensus that password-based security needs to be improved, the FIDO U2F ecosystem, consisting of web browsers, applications, hardware authentication devices and authentication servers, offers online users easy, private and secure login to cloud services such as email, shopping, financial and social sites from both their desktop and mobile devices. NXP secure element solution has been a cornerstone technology significantly contributing to the security advantages in the U2F standard.

Efficient Power Conversion (EPC) Introduces Wide-Input, 20 Amp GaN-Based Buck Converter Demonstration Board for Telecom, Industrial, and Medical Applications; EPC9118 demonstrates size reduction and efficiency enhancement for power conversion readily achieved using high frequency switching eGaN® FETs for supply voltages up to 48 V or more
October 21, 2014
Efficient Power Conversion Corporation (EPC) introduces the EPC9118 , a fully functional buck power conversion demonstration circuit. This board is a 30 V-60 V input to 5 V, 20 A maximum output current, 400 kHz buck converter. It features the EPC2001 and EPC2015 enhancement-mode (eGaN®) field effect transistors (FETs), as well as the LTC3891 buck controller. This buck converter design is ideal for distributed power solutions in telecom, industrial, and medical applications.

REMINDER: MEDIA ALERT: Presentations From Formal Verification Experts Highlight Next Decoding Formal Club Meeting Hosted by Oski Technology, Sponsored by Synopsys; October 23 Agenda Includes Talks on Formal Verification Methodologies, Real-World Applications, Experiences
October 21, 2014
WHO: Three formal verification experts -- Formal Verification Pioneer Robert Kurshan, Vigyan Singhal, Oski's chief executive officer, and Syed Suhaib, formal verification team manager at NVIDIA -- will share their formal verification insights and expertise using real-world examples

Dialog Semiconductor Multi-Touch Display Sensor IC Enters Mass Production with Major PC OEM; SmartWaveTM Multi-Touch Integrated Circuit (MTICTM) now in volume production with products anticipated in-store before year end with a major PC OEM
October 21, 2014
Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC, solid-state lighting and Bluetooth(R) Smart wireless technology, today announced its DA8901 Multi-Touch IC has entered mass production. First volume shipments have been integrated into touch modules using Dialog's SmartWaveTM and FlatFrog's optical In-GlassTM touch technologies. These low-cost, optically superior, Windows 8-certified touch modules will feature in a range of PCs, with first products anticipated to hit stores before the end of the year. "Since announcing the launch of our Multi-Touch sensor IC, we have been collaborating with our technology partner FlatFrog alongside high-volume manufacturing partners to complete the design-in, qualification and pre-production phases required to bring our customer's products to market," said Mark Tyndall, Senior Vice President Corporate Development & Strategy and General Manager Emerging Products Business Group for Dialog Semiconductor. "Having successfully completed this process, we are delighted that a leading PC OEM has realised the unique advantages of the technology and is now entering mass production."

DSP Group Introduces ULE for IoT Applications Over Intel(R) Puma(TM) 6-Powered Home Gateways; DSP Group's ULE (Ultra Low Energy) Solution Offers Simple Integration With Intel's Puma-Based SoC Delivering Data, Voice and Video Support
October 21, 2014
LOS ALTOS, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, announced today the integration of its ULE-based chipset with home gateways based on Intel's Puma? 6 SoC. The solution uses DSP Group's advanced DECT / ULE SoC integrated with the Intel Puma platform.


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