Headlines


Cavium Breaks 100Gbps IPsec Throughput Barrier using OpenDataPlane(TM) at Mobile World Congress 2015; OCTEON® III 48 Core 64-bit Processor SoC Provides 2.5X+ Performance Boost delivering the critical secure backhaul requirements for future LTE-A and 5G Wireless Core Network Applications
March 02, 2015
 Mobile World Congress - Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless networking, will demonstrate its single-chip OCTEON III processor running a full IPsec security application at 100Gbps throughput, necessary for next generation LTE-A and 5G networks using standard OpenDataPlane (ODP) software API's at Mobile World Congress 2015. 

Cavium to Showcase Wireless Infrastructure Innovations at Mobile World Congress 2015; Solution demos Covering Cloud Data Centers, NFV, Cloud-RAN, vEPC, Wireless Core, Macro Cells and Small cells
March 02, 2015
Mobile World Congress - Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless networking, will showcase innovative solutions spanning wireless infrastructure from the edge to the core, during Mobile World Congress 2015. Live demonstrations will include Cavium's industry leading ThunderX(TM), OCTEON®, OCTEON Fusion® processors and LiquidIO® adapters.

Cavium Introduces OCTEON Fusion-M(TM); A Family of Single Chip Solutions for Next Generation Macrocell BTS and Smart Radio Heads
March 02, 2015
Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking, today announced the introduction of a family of highly integrated single chip solutions that enable a new category of Macrocells and Smart Radio Heads supporting a wide range of deployment scenarios and setting a new bar for cost, performance, power and footprint. The OCTEON Fusion-M family is a scalable architecture that ranges from the single chip CNF75xx macrocell to the single chip CNF74xx for use in Smart Radio Heads. Market Dynamics for Radio Networks and Cloud RAN With the ever increasing demand for data and more concentrated and denser networks, operators are increasingly looking at ways to make the RAN more efficient and more scalable, as part of a wider trend towards virtualization of wireless networks through NFV and SDN technologies. Analysts predict that the overall wireless network infrastructure market encompassing macrocell RAN, HetNet, Small Cells and Cloud RAN will witness tremendous growth of 45% CAGR over the coming years, reaching $104 Billion in annual spending by the end of 2020.

Post Reference Number 2940BR
February 28, 2015
Cardiff University of United Kingdom has issued the following job vacancy: Post Reference Number 2940BR Job Title Senior Operations Manager Job Category Business / Strategic Management Career Pathway Managerial, Professional and Specialist Staff – MPSS School / Directorate PHYSX - School of Physics & Astronomy Advert Senior Operations Manager

Canon develops next-generation semiconductor lithography system
February 26, 2015
HIGHLIGHT: Canon Inc. has developed a next-generation semiconductor lithography system employing nanoimprint technology.

COLLABORATIONS
February 01, 2015
FULL TEXT L-3 Southern California Microwave announced that it has been selected by Lockheed Martin's Mission Systems and Training business to provide its MICRO Secure Digital Data Link as the secure command & control and ISR communications backbone for the UK Ministry of Defence's (MoD) digital Desert Hawk III DDL small unmanned aircraft system (SUAS) platform. The MICRO SDDL transceivers enable optimal utilization of frequency spectrum through a single RF channel supporting an IPbased, bidirectional TDMA secure communications link.

125 W GaN HEMT Covers 1 to 2700 MHz
February 01, 2015
FULL TEXT Freescale Semiconductor Tempe, Ariz. The significant advantages of gallium nitride (GaN) have mostly been discussed in relation to delivering high peak power in narrowband pulsed applications, primarily active electronically scanned array (AESA) radar. However, as GaN devices are inherently broadband, they are also appealing for use in electronic warfare (EW) or applications with multiple narrow frequency bands, such as military radios. To serve these, Freescale Semiconductor has introduced the MMRF5014H, a GaN on SiC HEMT power transistor that delivers at least 125 W, CW or pulsed, up to 2700 MHz and 100 W CW from 200 to 2500 MHz. FEATURES AND BENEFITS

TriQuint Continues DoD's Trusted Source Status Through 2016
February 01, 2015
FULL TEXT TriQuint Semiconductor Inc. (now Qorvo) announced it has earned continued Trusted Source Category 1A accreditation through 2016 from the Department of Defense (DoD). According to the certification, the accreditation of trust expresses the confidence of the DoD Defense Microelectronics Activity (DMEA) and the National Security Agency's Trusted Access Program Office (TAPO) that TriQuint will continue to deliver trusted foundry microelectronic goods and services (category' 1 A), which meet the mission critical needs of end users, now and into the future.

Solving an Organic Semiconductor Mystery
January 17, 2015
The U.S. Department of Energy's Lawrence Berkeley National Laboratory issued the following news release: Organic semiconductors are prized for light emitting diodes (LEDs), field effect transistors (FETs) and photovoltaic cells. As they can be printed from solution, they provide a highly scalable, cost-effective alternative to silicon-based devices. Uneven performances, however, have been a persistent problem. Scientists have known that the performance issues originate in the domain interfaces within organic semiconductor thin films, but have not known the cause. This mystery now appears to have been solved. Naomi Ginsberg, a faculty chemist with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory and the University of California (UC) Berkeley, led a team that used a unique form of microscopy to study the domain interfaces within an especially high-performing solution-processed organic semiconductor called TIPS-pentacene. She and her team discovered a cluttered jumble of randomly oriented nanocrystallites that become kinetically trapped in the interfaces during solution casting. Like debris on a highway, these nanocrystallites impede the flow of charge-carriers.

Mind the Gap
December 01, 2014
FULL TEXT Wide bandgap semiconductors will spur new demand for power electronics. "Mind the g ap" is an expression that's frequently heard on the London Underground. It also applies to manufacturers that build products equipped with battery chargers, converters, inverters, regulators, transformers, transistors and other types of power electronics. In England, "mind the gap" is a polite w ay to warn people to be careful when entering and exiting trains. In the manufacturing world, it means engineers should pay attention to wide bandgap (WBG) semi - conductors.


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