Headlines


IGBT and Super Junction MOSFET Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019
October 30, 2014
  /PRNewswire/ -- In recent years, environment compatibility, energy efficiency, flexibility and cost reduction have emerged as critical global issues across the semiconductor industry. Over the years, the electronics industry has been launching various power semiconductor solutions, such as insulated gate bipolar transistors (IGBTs) and super junction MOSFETs (metal oxide field effect transistor). IGBTs and super junction MOSFETs are used in switching applications in different end-user applications, including uninterrupted power supplies (UPS), wind turbines, PV inverters, rail tractions, electric vehicles and hybrid electric vehicles, and other industrial applications.

Retronix Semiconductor Taps Stewart Sullivan as Regional Service Operations Manager
October 30, 2014
Retronix Semiconductor reported the hire of Stewart Sullivan as a regional service operations manager in the U.S. According to a company release, Mark Diamond moves from his position of director of EU/Asia Sales and Operations with Retronix Semiconductor to assume the role of Chief Operating Officer. Jim Beatty was promoted from Director of U.S. Sales to the role of Worldwide Vice President of Sales.

Lucintel anticipates the global adhesive pastes and films market in semiconductor packaging industry to grow at a CAGR of 5.9% during 2012-2017; Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis
October 29, 2014
Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines. Photo -http://photos.prnewswire.com/prnh/20141029/155210

Lucintel anticipates the global adhesive pastes and films market in semiconductor packaging industry to grow at a CAGR of 5.9% during 2012-2017; Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis
October 29, 2014
Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines. Photo -http://photos.prnewswire.com/prnh/20141029/155210

ETF Preview: Broad Market ETFs Mixed: China-Related Funds Outperform Amid Improved Earnings
October 29, 2014
Pre-Market Movers YINN +4.4% UCO +2.5% TVIX +1.4% CURE -1.7% TQQQ -1.44% Broad Market Indicators Broad-market exchange-traded funds, including SPY, IWM and IVV are mostly higher pre-market; likewise, actively traded PowerShares QQQ (QQQ) was down 0.3% pre-bell, after a higher close Tuesday. Funds focused on China gained after China-related stocks rose to a five-week high in Hong Kong trading on the back of higher earnings. U.S. stock futures are mixed as investors wait for a statement from Federal Reserve Chair Janet Yellen at 2 pm ET in Washington. The Fed is expected to announce an end to the monthly bond purchases that have helped stimulate the market.

Lattice Semiconductor and Sensor to Image Demonstrate New FPGA-Based USB3 Vision Camera Reference Design at VISION 2014; Complete and Production-Ready Reference Design Enables Manufacturers to Accelerate Development of USB3 Vision Cameras;
October 29, 2014
Lattice Semiconductor Corporation (NASDAQ: LSCC), the leader in ultra-low power, small form factor, customizable solutions, today announced that Lattice and Sensor to Image GmbH will demonstrate a new FPGA-based USB3 Vision camera reference design at VISION 2014 in Stuttgart, Germany, November 4-6.

Skyworks Introduces High Fidelity Solutions for Streaming Music Platforms at Bose and Sonos; Ramping in Volume Production across All Key Customers
October 29, 2014
Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high performance analog semiconductors enabling a broad range of end markets, today announced it is enabling a variety of wireless solutions for high fidelity streaming music platforms. Skyworks has captured design wins with virtually every tier-one original equipment manufacturer (OEM) in this fast growing market segment. Skyworks' front-end devices integrate power amplifiers, low noise amplifiers, switches, filters and power detectors. Leveraging Skyworks' proprietary 802.11 technologies, these highly innovative solutions combine optimized hardware and software to deliver high quality, long range streaming audio. "Skyworks is excited to support the rapidly emerging music streaming platform market via highly advanced front-end solutions," said Carlos Bori, vice president of marketing at Skyworks. "Our partnerships with industry leaders, including Bose and Sonos, have enabled us to develop world-class audio solutions for streaming networks."

TSI Semiconductors and Silvaco Extend Collaboration to Accelerate Launch of 0.25um BCDMOS Process; Adoption of Utmost IV and HiSIM_HV2 for Accurate SPICE Modeling of LDMOS Devices
October 29, 2014
Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology. TSI Semiconductors' 0.25um BCD with deep trench isolation is a feature rich platform that enables high growth applications in lighting, automotive, power, automation, and consumer goods. The technology is a new offering at the companies' automotive qualified factory in Roseville, CA where there have been continuous manufacturing operations for over 30 years. TSI's TSBCD25 process imposes stringent requirements on modeling efficiency and model accuracy. This requires a SPICE parameter extraction flow that is easy to set up and utilize with convenient data measurement on different instruments. Flexibility in optimization and acquisition routines as well as plotting of results are key requirements for improved modeling productivity. TSI reviewed several industry leading SPICE modeling tools and ultimately selected Silvaco's Utmost IV as it delivered the required accuracy with the latest CMC standard HiSIM_HV2 model support. It also met the desired productivity and flexibility requirements with clear user examples for the different modeling tasks. Utmost IV covers a wide range of models from active devices such as BJT, MOSFET, high-voltage DMOS to passives, such as resistors, all with a single license.

Renesas Electronics Announces Consolidated Forecasts for the Nine Months Ending December 31, 2014
October 29, 2014
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced the consolidated forecasts for the nine months ending December 31, 2014. 1. Consolidated forecasts for the nine months ending December 31, 2014

Belgium,United States : Imec, Coventor partner to drive advanced CMOS process development through virtual fabrication
October 29, 2014
Belgian nanoelectronics research center imec has announced a joint development project with Coventor, a leading supplier of semiconductor process development tools. The collaboration will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to imec s 10- and 7-nanometer (nm) processes.


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