Headlines


Sen. John McCain Tours Microsemi's Phoenix Facility
February 28, 2015
Microsemi Corp. on February 18 hosted Sen. John McCain, currently chairman of the Senate Committee on Armed Services, at its Phoenix facility. The company said that discussions during the visit addressed the criticality of having a trusted solution resource such as Microsemi when providing products for defense and government programs.

Canon to Create Semiconductor Lithography System Employing Nanoimprint Technology
February 28, 2015
Canon U.S.A. reported that its parent company, Canon, is developing a next-generation semiconductor lithography system employing nanoimprint technology that makes possible sub-20 nm1 high-resolution processes.

TI drives energy management and digital power innovation at APEC 2015; TI unveils breakthroughs in energy efficiency, power density and new tools to speed power supply design
February 27, 2015
 Texas Instruments (TI) (NASDAQ: TXN), the worldwide leader in power management integrated circuits, will demonstrate how its analog technologies and embedded processing are driving innovation in energy management for next-generation power designs at the Applied Power Electronics Conference (APEC), March 16-18, in Charlotte, North Carolina.

Broadcom Innovation Powers KT 4G LTE Small Cell Deployments; Highly Integrated Devices Enable Korean Operator to Increase Mobile Coverage and Capacity for Outdoor and Indoor Environments
February 27, 2015
 Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that KT Corporation (formerly Korea Telecom), a Korean telecommunications and Internet company, has successfully deployed Broadcom's industry-leading small cell system-on-chip (SoC) devices to enhance its high speed 4G LTE wireless broadband services. KT completed deployment and verification of its Broadcom-enabled small cells for commercial outdoor environments this quarter and plans to expand services to indoor residential locations in the second quarter of 2015. Broadcom will showcase its innovations for the mobile and carrier ecosystem atMobile World Congress in Barcelona, March 2-5. For more news, visit Broadcom'sNewsroom. ABI Research predicts the small cell equipment market to reach $5B by 2018 as carriers and operators increasingly leverage small cells to cost-effectively support growth in cellular data traffic1. Broadcom's 617XX chipset is extending its 3G leadership to be first to market with LTE multimode advanced small cell SOC's for enterprise and residential deployments. Broadcom's installed base of small cell solutions exceeds two million live deployments.

SMIC Achieves 8M Pixel CIS Production on 0.13-Micron BSI with Cista
February 27, 2015
Semiconductor Manufacturing International Corporation ("SMIC") (NYSE: SMI; SEHK: 981) the largest and most advanced pure-play foundry provider in China, and Cista System Corp. a fabless semiconductor company that specializes in CMOS Image Sensors (CIS) and System on Chip (SoC) designs, have jointly announced the achievement of mass production for two CIS-BSI products, of 1.3MP resolution with 1.75-micron pixel and 8MP resolution with 1.4-micron pixel, respectively. Both sensors are based on SMIC's independently developed 0.13-micron BSI technology platform. Back-Side Illumination (BSI) CMOS Image Sensor technology increases the amount of light captured by the sensor, and thus enables image sensors with improved low-light performance. SMIC's 0.13-micron CIS-BSI technology is independently developed and offers competitive performance. Based on a low leakage process, it only uses three aluminum metal layers for reduced cost and supports pixel sizes down to 1.4-micron for 8MP resolution CIS. SMIC also provides full in-house turn-key service which includes CIS wafer fabrication, color filter & micro-lens processing, TSV-CSP and testing to help customers shorten the supply chain with fast cycle time and low cost.

Samsung, Merck tie up for new chip materials
February 27, 2015
Samsung Electronics is teaming with Merck of Germany to develop cost-effective, next-generation materials for semiconductor equipment. Merck said new imaging materials could enable major semiconductor makers to develop advanced integrated circuits and microelectronic technologies, many of which could be used in consumer electronic devices such as smartphones.

Kansas: Semiconductor Equipment Tech, Diffusion/Implant/Metals OR Plating/Bump/Wafer Level or AMAT&thin film
February 27, 2015
National Defense Industrial Association, The State of Kansas has issued the following Job Vacancy: Job Summary Company A New Beginning-Genes​is 2 Location Multiple locations Industries Electronics, Components, and Semiconductor Mfg Job Type Full Time Employee Years of Experience 2+​ to 5 Years Education Level High School or equivalent Career Level Experienced (Non-Manager) Salary 0.​00 - 70,000.​00 $ /​year bonuses, health bennies, perks, 401k, etc Semiconductor Equipment Tech, Diffusion/Implant/Metals OR Plating/Bump/Wafer Level or AMAT&thin film About the Job

Kansas: Product Engineer, device physics & silicon wafer processing or EPI Process Engineer epitaxial
February 26, 2015
National Defense Industrial Association, The State of Kansas has issued the following Job Vacancy: Job Summary Company A New Beginning-Genes​is 2 Location Multiple locations Industries Electronics, Components, and Semiconductor Mfg Job Type Full Time Employee Years of Experience 2+​ to 5 Years Education Level Bachelor's Degree Career Level Experienced (Non-Manager) Salary 0.​00 - 85,000.​00 $ /​year bonuses, bennies, perks, etc Product Engineer, device physics & silicon wafer processing or EPI Process Engineer epitaxial About the Job

Ireland: Graduate Process Technicians (level 6/7)
February 26, 2015
Northern Ireland Environment Link has issued the following news release: Graduate Process Technicians (level 6/7) Leinster £15000 - 25000 Fixed term contract Updated 26/02/2015 Human Resources

ASML Announces New High Mark for EUV Productivity; TSMC Images More Than 1000 Wafers in a Single Day
February 26, 2015
Asml has issued the following news release: ASML Holding N.V. (ASML) today confirms that its customer, Taiwan Semiconductor Manufacturing Company Limited (TSMC) has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step towards insertion of EUV lithography in volume production of semiconductors.


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