March 04, 2015
WASHINGTON, March 4 -- Freescale Semiconductor Ltd., Austin, Texas, files Form 8-K (current report) with Securities and Exchange Commission on March 3. State or other jurisdiction of incorporation: Bermuda Item 8.01 Other Events On March 1, 2015, Freescale Semiconductor, Ltd., a Bermuda exempted limited liability company (the "Company"), entered into an Agreement and Plan of Merger (the "Merger Agreement"), by and among the Company, NXP Semiconductors N.V., a Dutch public limited liability company ("Parent"), and Nimble Acquisition Limited, a Bermuda exempted limited liability company and a wholly-owned subsidiary of Parent ("Sub"), providing for the merger of Sub with and into the Company (the "Merger"), with the Company surviving the Merger as an wholly-owned subsidiary of Parent. The Company distributed the following materials with respect to the proposed Merger, the full text of which are attached hereto as Exhibits 99.1-99.6 and incorporated herein by reference: * Letter from Gregg Lowe to Customers * Customer Q&A Relating to the Announcement of the Merger Agreement

Methodics Tapped as IP Management Solution by indie Semiconductor
March 04, 2015
indie Semiconductor has selected the Methodics ProjectIC and VersIC product bundle as its next generation Data Management and IP Lifecycle Management solution for its analog/mixed signal and system on chip (SoC) engineering groups.

Hall Sensors from Diodes Incorporated Minimize Power Consumption and Improve Accuracy
March 03, 2015
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced a family of micro-power 8-bit resolution Hall effect sensors for contactless switching in portable consumer electronic products, domestic appliances and industrial equipment. Operating over a supply range of 1.6V to 3.6V and a magnetic range of ±400G, the sensors allow the operating mode and sampling rate to minimize current consumption down to micro-power levels. The AH8500 and the higher accuracy AH8501, which both feature an enable pin, draw a current of just 9?A in sleep mode (default mode). The devices achieve a typical current consumption of only 12?A at 20Hz and 1.16mA at the maximum 7.14kHz sample rate.

Freescale Supports OpenDataPlane for Software-Defined Networking Based on QorIQ Processing Platforms; A founding member of the Linaro Networking Group, Freescale drives SDN evolution and promotes software interoperability for a smarter Internet of Tomorrow
March 03, 2015
Freescale Semiconductor (NYSE: FSL) today announced support for the OpenDataPlane (ODP) standard, a common programming model for software-defined networks (SDN) and network functions virtualization (NFV), created to promote broad portability of data plane software across different hardware platforms.

Semtech Expands Proximity Sensing Protection Platform with uClamp3601P - a 33V TVS Protection Device for Safeguarding Industrial Sensing and Control Applications; Semtech's uClamp3601P Safeguards Proximity Sensors from Dangerous ESD and EFT Transients
March 03, 2015
Semtech Corp . (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the uClamp3601P - a 33V, high-performance transient voltage suppression (TVS) device for protecting industrial sensors. The single-line uClamp3601P achieves the low-clamping voltage performance needed to safeguard today's small form factor proximity sensors from ESD, EFT and low level surge transients.

Toshiba: Expansion of IoT Solution ApP Lite(TM) TZ5000 Series; The TZ5000 family of products provide a stable and power efficient platform for the Internet of Things (IoT) and industrial applications
March 03, 2015
Toshiba Corporation (TOKYO:6502) today announced that it will expand its line-up of ApP LiteTM processors with the launch of TZ5010XBG, TZ5011XBG, TZ5021XBG and TZ5023XBG targeting the Internet of Things (IoT). These products reduce power consumption using Toshiba proprietary hardware-based power management technology and system integration technology, which enables high memory efficiency and robust security features.Sample shipments start today, with mass production scheduled to start in the end of this month for TZ5010XBG and TZ5011XBG, and in June for TZ5021XBG and TZ5023XBG. Toshiba: IoT Solution ApP Lite(TM) TZ5000 Series "TZ5010XBG" (Photo: Business Wire)

Samsung Electronics Addresses Imaging and Connectivity Trends for Advanced Mobile Devices with New Image Sensor and NFC IC
March 03, 2015
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced new cutting-edge mobile component solutions that advance users' mobile experiences. These solutions include an 8-megapixel (MP) RWB (Red-White-Blue) image sensor based on ISOCELL technology and an NFC (Near Field Communication) integrated circuit (IC) with improved RF (Radio Frequency) performance. "We are always looking for innovative ways to create leading logic solutions that meet the rapidly evolving requirements of the mobile industry and give consumers new and more exciting mobile experiences," said Dr. Kyushik Hong, Vice President of System LSI marketing at Samsung Electronics. "With our new RWB ISOCELL image sensor for richer images and NFC IC with outstanding RF performance, we are excited to offer mobile users more convenient imaging and connectivity applications."

Integration Engineer
March 03, 2015
Altera has issued the following Job vacancy: Integration Engineer Location: US-CA-San Jose Requisition ID: 4024 # of openings: 1 Description

EQS-News: SMIC Receives Investment from China Integrated Circuit Industry Investment Fund
February 13, 2015
(EQS-News / 13/02/2015 / 11:50 UTC+8) SMIC Receives Investment from China Integrated Circuit Industry Investment Fund SHANGHAI, Feb. 12, 2015 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI; SEHK: 981) China's largest and most advanced semiconductor foundry today announced an investment agreement from China Integrated Circuit Industry Investment Fund Co., Ltd., (CICIIF), the national fund established to promote the IC industry in China. Under the agreement, CICIIF will acquire 4.7 billion new shares at a subscription price of 0.6593 HKD per share. The gross proceeds will be used for SMIC's capital expenditure, debt repayment and general corporate purposes. Under the agreement CICIIF is entitled to nominate one member to SMIC's board of directors.

The Next Big Thing: Opportunities of Gallium Nitride
January 31, 2015
India, Jan. 31 -- Radar, if one simplifies it down to the basics, is a strikingly simple technology: radio waves go out, hit something and bounce back. With a little analysis of the return signal, you can "see" whatever is out there. The radar 'buzzword' over the last few years has been AESA - Active Electronically Scanned Array. To understand the importance of the AESA it is perhaps pertinent to explore the capabilities and limitations of mechanically steered antennas, and the first generation - that is passive - Electronically Steered Arrays (ESAs), before getting into the details of modern AESAs and the types of semiconductors used in their production. Radar basics The radar antenna on an aircraft transmits electromagnetic waves in a beam and receives reflected waves from targets, or terrain, or anything in the way of that beam. To locate targets, it points this beam all over the sky or ground or both. So a good radar antenna is not only defined by its emitting power and receiving sensitivity, but also by how quickly and precisely it can be steered.


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