Headlines


UCT Announces New 3D Printing Services Starting Q1, 2015; The 3D Printing Center will be based in Singapore and will service UCT customers worldwide
November 21, 2014
Ultra Clean Holdings, Inc. (Nasdaq: UCTT), a leading developer and supplier of critical systems and subsystems for the semiconductor capital equipment, flat panel, medical, energy and research industries, today announced the launch of its 3D Printing services through the acquisition of privately held Prototype Asia LLC and the opening of its Additive Manufacturing Center in Singapore.

SiTime's SiT1552 TCXO Recognized by EDN's Hot 100 Products of 2014; Accolades Continue for SiTime's Game-Changing 32 kHz MEMS Oscillators & TempFlatTM MEMS
November 20, 2014
SiTime Corporation , a MEMS and analog semiconductor company and a wholly owned subsidiary of MegaChips Corporation (Tokyo Stock Exchange: 6875), announced today that EDN has named SiTime's SiT1552 MEMS TCXO as one of the "100 Hot Products of 2014" in the Analog category. The 2014 EDN Hot 100 highlights the electronics industry's most significant products of the year based on innovation, significance, usefulness, and popularity. The TempFlat(TM) MEMS-based SiT1552 is the industry's smallest, most accurate and lowest power 32 kHz TCXO (temperature compensated oscillator). The SiT1552 is 20% of the size of legacy quartz products, and its 5 PPM stability enables up to 50% longer battery life in wearables and Internet of Things (IoT).

Amtech Obtains Repeat Order from US based Mission Solar Energy for its High Efficiency n-type Bifacial Cell Line
November 20, 2014
 Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced its subsidiary, Tempress Systems, has received a multi-million dollar order (in the low teens) for its solar equipment, including PECVD, to be used in the second phase of Mission Solar Energy's cell production line implementing next generation, high efficiency n-type bifacial cell technology. These units are expected to ship within the next six months. Mr. Fokko Pentinga, Chief Executive Officer of Amtech, commented, "Our innovative technology solutions are clearly bringing value to our customers. We are pleased to announce this repeat order for our world class production systems. The order includes our PECVD system, an important strategic product we developed during the solar down cycle to aggressively support the solar growth opportunity during the next recovery cycle and provides us the opportunity to double the size of our served available market. Our ongoing objective is to bring technology solutions to the market to increase cell efficiency at lower cost."  

IXYS Introduces the ComPack Thyristor Module Platform - A New Eco-Friendly Design That Reduces Material Costs with Higher Power Density
November 20, 2014
IXYS Corporation (NASDAQ:IXYS), a leader in power semiconductors and HVIC technologies for energy efficient products used in power conversion and motor control applications announced today a new bipolar module platform for high power applications. The new ComPack family represents a compact power platform with the highest power density in its class. Advancement in the module design as well as the silicon die technology leads to an eco-friendly product that fulfills the highest needs in reliability and functionality. First products available are dual thyristor, dual diode or thyristor/diode combinations. The modules have a rated current of 700 Amperes per leg, improved surge rating and a maximum junction temperature of 140 Deg C.

New Member Named to ON Semiconductor's Board of Directors; Paul A. Mascarenas, former Chief Technical Officer and Vice President of Research and Advanced Engineering at Ford Motor Co., has joined the Board of Directors of ON Semiconductor
November 20, 2014
ON Semiconductor Corporation (Nasdaq: ONNN ), driving energy efficiency innovations, today announced that Paul A. Mascarenas has joined its Board of Directors. The Board also appointed Mr. Mascarenas to its Science and Technology Committee.

Veeco Introduces Breakthrough MOCVD Platform to Enable Efficient GaN-Based Power Devices; New Propel Power GaN MOCVD System Expected to Accelerate the Transition from R&D to Production for GaN Power Electronics;
November 20, 2014
Veeco Instruments Inc. (Nasdaq:VECO) introduced today the Propel(TM) Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system , which incorporates single-wafer reactor technology for outstanding film uniformity, yield and device performance. This new 200mm MOCVD system and technology enables the development of highly-efficient GaN-based power electronic devices that will accelerate the industry's transition from R&D to high volume production. Veeco's new Propel Power GaN MOCVD system enables the development of highly-efficient GaN-based power electronic devices that will accelerate the industry's transition from R&D to high volume production. (Photo Credit: Business Wire)

ASE's Subsidiary USI Completes Capital Increase by Way of Domestic Private Placements in the PRC Capital Market
November 20, 2014
Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") announced today that its subsidiary Universal Scientific Industrial (Shanghai) Co., Ltd. ("USI")(SSE: 601231), which is responsible for electronics design and design manufacture service ("DMS"), completed its capital increase by way of domestic private placements through a bidding process on November 20, 2014, raising a total of RMB2.06 billion (approximately NTD10.43 billion).  The proceeds from this offering will be used to fund the production of wireless modules and wearable miniature modules.  USI's offering received overwhelming response from investors in the PRC capital markets.  The issue price per share was RMB27.06 (1.5 times the minimum issue price of RMB17.86).  After the offering, ASE's holdings in USI decreased by 6.18% from 88.30% to 82.12%.

X-FAB MEMS Foundry Wins "Foundry of the Year" Award at MEMS Executive Congress; Honored for Best in MEMS and Sensors Innovation; Named Runner-Up for "MEMS Supplier of the Year" Award
November 20, 2014
X-FAB MEMS Foundry today announced it received the "MEMS Foundry of the Year" award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group's 10th annual MEMS Executive Congress® held in Scottsdale, Arizona last week. X-FAB MEMS Foundry was chosen from among five finalists in an open voting process; it also was named runner-up in the "MEMS Supplier of the Year" category. The MEMS Industry Group is a trade association that advances MEMS and sensors across global markets.

Japan : Renesas Electronics Delivers Productivity Boost in Industrial Applications with the RZ/T1 Real-Time Processor Solution
November 20, 2014
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the RZ/T1 Group, a new factory automation solution with built-in industrial network functionality for use in many industrial applications such as AC servo drives, motion controllers, inverter control and general industrial equipment that require high speed, responsiveness, and excellent real-time performance.

United States : SanDisk Expands its Commitment to the Connected Device Market with a Strategic Investment in Altair Semiconductor
November 20, 2014
SanDisk Corporation, a global leader in flash storage solutions, today announced that the company s venture arm, SanDisk Ventures, has invested in Altair Semiconductor, the leading developer of high-performance, single-mode LTE chipsets. Altair s high-performance products bring 4G LTE Internet connectivity to tablets, netbooks, USB dongles, portable hotspots, fixed routers and modems, machine-to-machine applications and other devices.


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