November 21, 2014
WASHINGTON, Nov. 21 -- Peregrine Semiconductor Corp., San Diego, files Form 8-K (current report) with Securities and Exchange Commission on Nov. 20. State or other jurisdiction of incorporation: Delaware

Gate Driver Board and SPICE Models for Silicon Carbide Junction Transistors (SJT) Released
November 21, 2014
Dulles, VA, November 21, 2014 --(PR.com)-- GeneSiC Semiconductor, a pioneer and global supplier of a broad range of Silicon Carbide (SiC) power semiconductors today announces the immediate availability of Gate Driver evaluation board and has expanded its design support for the industry's lowest loss switches - the SiC Junction Transistor (SJT) - with a fully-qualified LTSPICE IV model. Using the new Gate Driver Board, power conversion circuit designers can verify the benefits of sub-15 nanosecond, temperature independent switching characteristics of SiC Junction Transistors, with low driver power losses. Incorporating the new SPICE models, circuit designers can easily evaluate the benefits GeneSiC's SJTs provide for achieving a higher level of efficiency than is possible with conventional silicon power switching devices for comparably-rated devices.

UCT Announces New 3D Printing Services Starting Q1, 2015; The 3D Printing Center will be based in Singapore and will service UCT customers worldwide
November 21, 2014
Ultra Clean Holdings, Inc. (Nasdaq: UCTT), a leading developer and supplier of critical systems and subsystems for the semiconductor capital equipment, flat panel, medical, energy and research industries, today announced the launch of its 3D Printing services through the acquisition of privately held Prototype Asia LLC and the opening of its Additive Manufacturing Center in Singapore.

MILITARY $138,564 Federal Contract Awarded to Kulite Semiconductor Products
November 21, 2014
WASHINGTON, Nov. 21 -- Kulite Semiconductor Products Inc., Leonia, New Jersey, won a $138,564.16 federal contract from the Defense Logistics Agency's Defense Supply Center, Richmond, Virginia, for motional tranducers. For more information about Targeted News Service contract awards please contact: Myron Struck, Editor, Direct: 703/866-4708, Cell: 703/304-1897, Myron@targetednews.com 22DayandanteA 141121-AD-788547 22DayandanteA

-Minco Technology Labs and Northrop Grumman Ink Distribution Agreement
November 21, 2014
ENP Newswire - 21 November 2014 Release date- 18112014 - Austin, TX - The Northrop Grumman name is synonymous with leading edge process and product technology and Minco is proud to work with them to bring their semiconductor expertise to the commercial market' Minco Technology Labs, LLC (Minco) and Northrop Grumman Corporation have signed a distribution agreement authorizing Minco to market and sell Northrop Grumman's line of radiation hardened semiconductor products to customers in North America, Europe, and the Pacific Rim.

-New Member Named to ON Semiconductor's Board of Directors
November 21, 2014
ENP Newswire - 21 November 2014 Release date- 20112014 - PHOENIX, Ariz. - ON Semiconductor Corporation (Nasdaq: ONNN), driving energy efficiency innovations, today announced that Paul A. Mascarenas has joined its Board of Directors.

-NXP Semiconductors - European test drive to showcase the future of 'intelligent traffic' concludes in Helmond/Rotterdam
November 21, 2014
ENP Newswire - 21 November 2014 Release date- 19112014 - Eindhoven, Netherlands and Munich, Germany - NXP Semiconductors N.V. (NASDAQ: NXPI), alongside leading industry partners and government officials, has celebrated the completion of the 'Communicating Cars' test drive along the Cooperative ITS (Intelligent Transport Systems) Corridor spanning Austria, Germany and the Netherlands.

New Semiconductor Device Could Lead to Better Photodetectors
November 20, 2014
The University of California-Los Angeles issued the following news release: UCLA researchers have developed a perovskite photodetector that could reduce manufacturing costs and improve the quality of medical and commercial light sensors.

North American Semiconductor Equipment Industry Posts October 2014 Book-to-Bill Ratio of 0.93
November 20, 2014
The Semiconductor Equipment and Materials International issued the following news release: North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 0.93 means that $93 worth of orders were received for every $100 of product billed for the month.

EJL Wireless Research adds the Nokia Networks LTE FSME Unit to its DesigN Analysis Infrastructure; DNA-I series of teardown reports.
November 20, 2014
  Salem, NH (PRWEB) November 20, 2014         EJL Wireless Research is announcing a new report within its proprietary DNA-I series, a Nokia Networks (formerly Nokia Siemens Networks) LTE FSME (Flexi System Module version E) eNodeB.         "This is our second look into the Flexi digital baseband unit design for Nokia Networks (we previously analyzed a FSMB for W-CDMA) but our first analysis of a LTE capable eNodeB. The FSME forms the core of the Flexi eNodeB platform for Nokia Networks and allows mobile operators a seamless migration path for a multi-mode configuration supporting both W-CDMA/HSPA and LTE. We note however, that the FSME does not support GSM/EDGE technology. A separate Flexi EDGE system module is required for GSM/EDGE support" said founder and President, Earl Lum.           "The FSME eNodeB unit supports a maximum downlink throughput of 150Mbps and uplink throughput of 50Mbps.


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