Headlines


SUNEDISON SEMICONDUCTOR REPORTS MULTIPLE TRANSACTIONS BY DIRECTOR ARGOV (Missouri)
July 31, 2014
WASHINGTON, July 31 -- SunEdison Semiconductor Ltd. (SEMI), St. Peters, Mo., has filed a Form 4 with the Securities and Exchange Commission noting the change in the beneficial interest held by Director Gideon Argov, St. Peters. On July 29 the action involved acquisition of 21,400 restricted stock units. Argov now owns 21,400 restricted stock units directly. SunEdison Semiconductor Ltd. is involved in the development, manufacture and sale of silicon wafers to the semiconductor industry. For any query with respect to this article or any other content requirement, please contact Editor at htsyndication@hindustantimes.com

Fujitsu Announces New Direction for its Semiconductor Business
July 31, 2014
Tokyo and Yokohama, July 31, 2014 - (JCN Newswire) - Fujitsu Limited and Fujitsu Semiconductor Limited have today entered into an official contract with Panasonic Corporation and Development Bank of Japan Inc. (DBJ) whereby Fujitsu Semiconductor and Panasonic would integrate their System LSI businesses, and together with investment from DBJ, a new independent fabless company will be established. These developments are a result of the deliberations Fujitsu Limited and Fujitsu Semiconductor have made based on the February 7, 2013 announcement, "Fujitsu Announces Restructuring and New Direction of its Semiconductor Business." In addition, Fujitsu Limited and Fujitsu Semiconductor have decided to expand the scope of foundry operations. Fujitsu Semiconductor's manufacturing facilities in Mie and Aizu-Wakamatsu, Japan will respectively work to provide stable delivery to customers as new, independent companies, to be established by the end of 2014. The new Aizu foundry company will consist of a 150mm fab company and 200mm fab company, operating within the framework of an Aizu foundry general company.

Showa Denko to Acquire Air Products' High-Purity Chlorine Business in Taiwan; To Strengthen Special Material Gas Business by Transfer from Air Products San Fu, Taiwan
July 31, 2014
Tokyo, July 31, 2014 - (JCN Newswire) - Showa Denko K.K. (SDK) has decided to acquire a high-purity chlorine business in Taiwan, in order to strengthen its special material gas business.

-AkzoNobel to collaborate with SERIS on solar cell technology
July 31, 2014
ENP Newswire - 31 July 2014 Release date- 30072014 - AkzoNobel has partnered with the Solar Energy Research Institute of Singapore (SERIS) at the National University of Singapore in order to explore less costly ways of producing high-efficiency silicon wafer solar cells.

ON Semiconductor Engineers Integrated Switching Regulators
July 31, 2014
ON Semiconductor has added three new current mode, fixed frequency switching regulators to its power management product portfolio. According to a company release, targeted at use in compact, high reliability offline AC-DC switched-mode power supplies, the NCP1129, NCP1126, and NCP1124 incorporate an avalanche-rated 650 volt (V) MOSFET and frequency foldback along with skip mode that improve the light load and standby efficiency, meeting the ENERGY STAR EPS 2.0 Standard.

Sony DADC BioSciences and TSMC Garner AACC Industry Division Award
July 31, 2014
The 2014 American Association for Clinical Chemistry (AACC) awarded Sony DADC BioSciences and Taiwan Semiconductor Manufacturing Co. (TSMC) with its Best Abstract of Interest to the Industry Division Award.

Semiconductor & IC Packaging Materials Market Expected to Reach $ 26 Billion by 2019
July 31, 2014
July 31, 2014 The report defines and segments the "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019" with an analysis and forecast of revenues of types such as organic substrates, bonding wires, leadframes, encapsulation resins, and so on) individually. Along with this, the revenue of materials by types such as packaging technologies, and geography are also discussed.

Cavium Joins Red Hat Partner Early Access Program; Collaboration to accelerate ARMv8 Server Software Ecosystem for ThunderX(TM) Workload Optimized Processor Family
July 30, 2014
 Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, cloud, wired and wireless networking announced today that it has joined the Red Hat ARM Partner Early Access Program (PEAP). This collaboration will directly benefit Cavium partners and customers by enabling access to Red Hat software, documentation and tools for ThunderXTM.

Airoha Technology Adopts Cadence RTL Synthesis and Test Solution, Reducing Power Consumption by 15 Percent; Encounter RTL Compiler and Encounter Test also reduced test pattern count by 10 percent on Bluetooth wireless radio chip
July 30, 2014
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Airoha Technology Corp. adopted the Cadence® Encounter® RTL Compiler and Cadence Encounter Test solutions after a rigorous competitive evaluation, and achieved a 15 percent reduction in power consumption and 10 percent reduction in test pattern count on a Bluetooth wireless radio chip. Encounter RTL Compiler employs unique global mapping technology and advanced clock gating to reduce power consumption without compromising design performance goals.

Texas Instruments surpasses shipment of 15 million SoCs enabling the automotive industry to redefine advanced driver assistance systems; Awarded 2014 Frost & Sullivan Product Leadership for Semiconductor Solutions
July 30, 2014
 Confirming a leadership position in the automotive market, today Texas Instruments (TI) (NASDAQ: TXN) announces that more than 15 million of TI'sadvanced driver assistance systems (ADAS)System-on-Chip (SoC) devices are on the road. TI's open and flexible solutions are in series production in over 25 OEMs and over 100 car models, and are designed to help reduce the number of road collisions and enable more autonomous driving experiences.  With common hardware and software architecture across camera based front (mono and stereo), rear, surround view and night vision applications, as well as mid- and long-range radar and sensor fusion systems, TI's scalable solutions allow for reuse and reduced time and cost to market. Leveraging more than 30 years in signal processing, safety and automotive experience, TI developed the TDAx family of SoC processors to enable customers to further drive innovation and differentiation in ADAS applications.   


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