Broadcom Announces Industry's First Fully Integrated Chip for Virtual Customer Premise Equipment
March 05, 2015
Extends Portfolio Breadth for Carriers and Enables New Service Offerings IRVINE, Calif., – Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first fully integrated system-on-a-chip (SoC) for the virtual customer premise equipment (vCPE) market. Broadcom's latest SoC is designed to provide carriers with flexibility to add new services in a dynamic, multi-vendor environment. Broadcom will showcase its innovations for the mobile and carrier ecosystem at Mobile World Congress in Barcelona, March 2-5. For more news, visit Broadcom's Newsroom. Today's legacy business-access solutions are hard-wired and lack fault management and standard operations, administration and management (OAM), thereby impacting the agility to rapidly provision new services.  Broadcom's new SoC gives operators the ability to decouple services from the physical hardware and run them on standard compute infrastructure, thus facilitating faster time-to-market and enabling customers to customize their equipment based on evolving requirements.

Intel Honors 11 Companies with Supplier Continuous Quality Improvement Award
March 05, 2015
March 4, 2015 SANTA CLARA, Calif. - Intel Corporation today announced the 11 winners of the company's most prestigious award for suppliers, the Supplier Continuous Quality Improvement (SCQI) award. These companies set themselves apart from the thousands of suppliers that work with Intel by demonstrating industry-leading results and commitment across all critical focus areas on which they are measured: quality, cost, availability, technology, customer service, labor and ethics systems, and environmental sustainability.

Amendments to Existing Validated End-User Authorization in the People's Republic of China: Samsung China Semiconductor Co. Ltd.; Federal Register Extracts
March 05, 2015
SUMMARY: In this rule, the Bureau of Industry and Security (BIS) amends the Export Administration Regulations (EAR) to revise the existing authorization for Validated End User Samsung China Semiconductor Co. Ltd. (Samsung China) in the People's Republic of China (PRC). Specifically, BIS amends Supplement No. 7 to Part 748 of the EAR to add two items to Samsung China's eligible items that may be exported, reexported or transferred (in country) to the company's eligible facilities (also known as "eligible destinations") in the PRC. EFFECTIVE DATE: This rule is effective March 5, 2015. FOR FURTHER INFORMATION CONTACT: Mi-Yong Kim, Chair, End-User Review Committee, Office of the Assistant Secretary, Export Administration, Bureau of Industry and Security, U.S. Department of Commerce, Phone: 202-482-5991; Fax: 202-482-3911; Email: ERC@bis.doc.gov

SIA: Global Semiconductor Industry Posts 'Highest-Ever' January Sales
March 05, 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, reported that worldwide sales of semiconductors reached $28.5 billion for the month of January 2015, the industry's highest-ever January total and an increase of 8.7 percent from January 2014 when sales were $26.3 billion.

UC research partnership explores how to best harness solar power
March 05, 2015
A University of Cincinnati research partnership is reporting advances on how to one day make solar cells stronger, lighter, more flexible and less expensive when compared with the current silicon or germanium technology on the market. Yan Jin, a UC doctoral student in the materials science and engineering program, Department of Biomedical, Chemical, and Environmental Engineering, will report results on March 2, at the American Physical Society Meeting in San Antonio, Texas. Jin will present on how a blend of conjugated polymers resulted in structural and electronic changes that increased efficiency three-fold, by incorporating pristine graphene into the active layer of the carbon-based materials. The technique resulted in better charge transport, short-circuit current and a more than 200-percent improvement in the efficiency of the devices.

Hermes shares up on upbeat outlook
March 05, 2015
Taipei, March 5 (CNA) Shares of Hermes Microvision Inc. (???), a leading Taiwan-based semiconductor inspection tool and equipment supplier, moved higher Thursday after the company gave an optimistic assessment of sales growth for 2015, dealers said.

Cannibalization by LED Lighting Technology Aggravates the Decline in Demand for Fluorescent Bulbs, According to a New Report by Global Industry Analysts, Inc.
March 04, 2015
  San Jose, California (PRWEB) March 04, 2015             Follow us on LinkedIn – Despite being considered as energy efficient and an ideal replacement for traditional incandescent bulbs, fluorescent bulbs are facing a strong competitive threat from light-emitting diode (LED) bulbs. As a semiconductor based light source, LEDs are far more efficient than fluorescent bulbs and in the coming years are forecast to take over the global lighting market. Technology advancements and improvements in performance are helping prepare the emergence of LED as an ideal replacement for not just incandescent bulbs but also for compact fluorescent lamps (CFLs). A key drawback of CFL bulbs is the incompatibility of the technology with light and motion sensors. On the other hand, key benefits of LED driving its adoption worldwide include longer life, energy efficiency, environment friendly, zero UV emissions, efficient and effective light dispersement, resistance to extreme temperatures and instant lighting when powered on.           CFLs have currently hit their saturation levels, growing continuously ever since their full-fledged commercial launch in the 1990s. Over the years, incremental technology developments in CFL have helped address issues related to low lighting quality, lightbulb flickering, and mercury content.

Ireland: Graduate Process Technicians (level 6/7)
March 04, 2015
Northern Ireland Environment Link has issued the following news release: Graduate Process Technicians (level 6/7) Leinster £15000 - 25000 Fixed term contract Updated 04/03/2015 Human Resources

Stop Hunger Now Opens Facility in Bangalore.
March 03, 2015
  Bangalore, India (PRWEB) March 03, 2015     Stop Hunger Now, an international non-governmental organization (NGO), today announces the opening of its first permanent facility in Bangalore, India. To celebrate the launch, 150 employee volunteers from Broadcom Corporation and SanDisk Corporation will package 45,000 highly nutritious dehydrated meals comprised of rice, soy or dal, vegetables and 23 essential vitamins and minerals to distribute to children and families in need throughout India. The event, sponsored by Broadcom and SanDisk, is located at Broadcom's Bangalore Campus at Campus 1A, 5th Floor, RMZ Ecospace, Bellandur, Bangalore – 560 038.

As the Internet of Things Drives Demand for Low Cost Electronics, a Study of Roll-to-Roll Printed Organics Reveals an Inkron Product as a Preferred Material of Choice.
March 03, 2015
  Helsinki/Munich (PRWEB) March 03, 2015       Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries, today revealed its contribution to technology developments led by VTT Technical Research Centre of Finland Ltd.. The goal of the collaboration was to test a commercially scalable roll-to-roll (R2R) printing process for the fabrication of printed organic thin film transistors. Inkron's core technology platform, based on new nanomaterials and siloxane polymer chemistries, provides a variety of products for emerging printed electronics applications including solar cells, wearables, sensors, displays, touch screens and transistors. Please visit us in Munich at LOPEC 2015 conference at booth #B0 102 to learn about Inkron's offerings for advanced printed electronics applications.           In a publication in the January 2015 issue of Organic Electronics, authors by VTT and BASF highlighted Inkron's IPC-114 product as the preferred material for the fabrication of the gate metal layer in a R2R printed organic transistor process.


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