January 31, 2015
ALEXANDRIA, Va., Jan. 31 -- The trademark AMERICAN SEMICONDUCTOR (Reg. No. 4677472) was issued on Jan. 27 by the USPTO.

Amtech Systems Completes Acquisition of BTU International; Combination reinforces Amtech's Solar Growth Opportunity
January 30, 2015
Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced that it has completed its acquisition of BTU International (BTU). J.S. Whang, Executive Chairman of Amtech, said, "The addition of BTU supports our business model of growth through strategic acquisition and continuous innovation. This acquisition further advances our strategy to expand our technology portfolio in adjacent markets and creates an even stronger platform to drive the growth of our solar business."

QuantumClean® and ChemTrace® to exhibit at SEMICON Korea 2015; Leading global providers of validated Atomically Clean Surfaces(TM) outsourced process tool parts cleaning, performance coatings, refurbishment, and analytical & engineering services for sub-20nm manufacturing processes to exhibit at SEMICON Korea 2015 tradeshow.
January 30, 2015
 QuantumClean® andChemTrace®today announced that they will be exhibiting at the SEMICON Korea 2015 tradeshow, held at the Coex in Seoul, South Korea from February 4th through 6th. SEMICON Korea features the people, products and technologies advancing the future of microelectronics.  QuantumClean® and ChemTrace® will be exhibiting at booth number 2408.

UPDATE - INVESTOR ALERT: Levi & Korsinsky, LLP Announces an Investigation of the Board of Directors of Silicon Image Inc. Regarding the Fairness of the Sale of the Company to Lattice Semiconductor Corporation
January 30, 2015
Levi & Korsinsky commences an investigation into the Board of Directors of Silicon Image Inc. ("Silicon Image" or "the Company") (NASDAQ:SIMG) for possible breaches of fiduciary duty and other violations of state law in connection with the sale of the Company to Lattice Semiconductor Corporation.

Diodes Incorporated Targets Chargers for Cell Phones and Portable Devices with Highly Efficient Synchronous Rectification Controller
January 30, 2015
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced the APR343 synchronous rectification controller. This device addresses the need for a highly integrated, efficient and cost-effective solution for cell phone and similar portable electronic device chargers.

January 30, 2015
 ChipMOS TECHNOLOGIES (Bermuda) LTD. ("ChipMOS" or the "Company") (Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it has signed a Letter of Intent to cooperate on the development of new equipment and process automation with Tokyo Seimitsu Co., Ltd. ("ACCRETECH") at ChipMOS's Tainan fab. Under the agreement, ACCRETECH will be responsible for the equipment design and manufacturing. This is expected to include, but will not be limited to, probers for wafer testing and wafer dicing equipment. ChipMOS will provide engineering resources for development, testing and evaluation of the jointly-developed new equipment and production lines.

Firan Technology Group Corporation (FTG) Announces a Supply Contract With Shanghai Avionics Corporation (SAVIC) for Various Display Suite Control Panel Assemblies Used on the C919 Aircraft
January 30, 2015
Firan Technology Group Corporation ("FTG") (TSX:FTG), a leader in aerospace and defense electronics, announced today that they have signed a supply contract with SAVIC for the design, development, certification support and long-term production of various Control Panel Assemblies for the Display System on the new COMAC C919 aircraft. This contract replaces the Letter-of-Intent between FTG and SAVIC first announced in 2012. Under the terms of the contract, FTG will design, develop, manufacture and supply the Display Suite control panel assemblies. The design, development and initial manufacturing will be completed at FTG Aerospace - Toronto. SAVIC and FTG have agreed to share the cost of the design and development of the control panel products. The control panel assemblies incorporate advanced electronics and software that are integral to the overall Display Suite to be provided by SAVIC for the C919 aircraft. Volume manufacturing will be performed at FTG's facility in Tianjin, China. The contract covers a minimum of 1,440 production ship sets consisting of 9 control panel assemblies per set.

Regional Applications Engineer
January 30, 2015
Altera has issued the following Job vacancy: Regional Applications Engineer Location: Japan-Tokyo Requisition ID: 4429 # of openings: 1 Description As a Regional Applications Engineer, you will be responsible for supporting design, embedded system, IP and software issues. You will be involved in all phases of the customer design process from concept through silicon implementation, and be able to contribute to the resolution of problems in the areas of hardware, Altera design tools and third party EDA tools. You will understand software/hardware trade-offs. You will also work with local team members and factory specialist colleagues to bring issues to closure as efficiently as possible. Your day to day interaction will be with direct customers, Altera FAE and distribution FAE teams.

Integration Engineer
January 30, 2015
Altera has issued the following Job vacancy: Integration Engineer Location: US-CA-San Jose Requisition ID: 4024 # of openings: 1 Description

Honeywell tackles chip challenges with new PCMs
December 15, 2014
Honeywell says its thermal interface materials (TIMs), which transfer thermal energy from the chip to the heat sink, where it is dissipated into the surrounding environment, are being adopted by leading smartphone, tablet, and other mobile-device manufacturers. Honeywell has ramped up development of TIM phase change materials (PCMs) to help meet the needs of new, higher-power applications, Glenn Mitchell, director of technology, electronic materials at Honeywell tells CW. "There is a need in the industry for really thin thermal interface materials that can absorb a lot of heat while meeting many criteria," Mitchell says. "We have developed a blended polymer substance that Changes from a solid state to a gel-like state as the heat is absorbed in the material. There's no shrink or pull. It goes back to its original structure after heating."


Ultratech Cambridge NanoTech introduces the Savannah G2 ALD system
01/08/2015Ultratech, Inc., a supplier of ALD systems, as well as lithography, laser-processing and inspection systems used to manufacture semico...
Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...