Keysight Technologies Introduces Transmitter Testing Solution for USB 3.1
October 24, 2014
SANTA ROSA, Calif. – Keysight Technologies, Inc. today introduced transmitter (TX) test support for the USB 3.1 specification with the U7243B USB 3.1 transmitter performance validation and compliance test software. The test software allows authorized test centers to certify SuperSpeed USB and SuperSpeed USB 10-Gbps devices and gives in-house test and performance validation engineers the tools to ensure their devices comply with the USB 3.1 specification. The Keysight USB 3.1 solution provides accurate test results to reduce development costs and simplify measurement processes for test engineers in the consumer electronics, cable manufacturing and semiconductor industries. The test software operates on Keysight’s 90000 X-, Q- and Z-Series Infiniium real-time oscilloscopes with bandwidths of 16 GHz and higher. Access to the test signals through a USB test fixture is required.

-NXP Unveils Professional Performance LED Solutions for Core Segment Applications at Hong Kong International Light Fair
October 24, 2014
ENP Newswire - 24 October 2014 Release date- 22102014 - Hong Kong Lighting Fair - NXP Semiconductors N.V. (NASDAQ: NXPI) announced it will exhibit its latest lighting technology at the Hong Kong International Lighting Fair (27th-30th October 2014) including its new core segment LED driver platform for non-dimmable and dimmable LED applications, ranging from Candela shaped lamps that use 5W of power to integrated fixtures/luminairs, TLED or PAR lamps that require 25W of power.

Actions Semiconductor Unveils 28nm OWL Series Chipset
October 24, 2014
Actions Semiconductor debuted its latest 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets at Global Sources' China Sourcing Fair - Electronics & Components held October 11 - 14 at the Asia World-Expo in Hong Kong.

Aehr Test Systems Announces Follow-On Order for ABTS(TM) Test System From Leading IC Manufacturer
October 23, 2014
FREMONT, Calif., Oct. 23, 2014 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received a follow-on order for an ABTS test and burn-in system from a leading multi-national manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. The order includes a down payment and volume pricing discount. This system is planned to ship in the second quarter of Aehr Test's fiscal 2015. "We are extremely pleased to receive this order for an additional very high capacity production system from this customer that is in the process of ramping up production of automotive devices," said Mark Allison, vice president of sales at Aehr Test Systems. "Because of the need for extremely high reliability in automotive applications, there is a strong need for both qualification and production burn-in of these devices. Also, with decreasing geometries and increasing densities, the absolute power and variation in power is increasing, which we believe makes ABTS systems an ideal solution with their ability to dissipate up to 36kW of power and to individually control the temperature of each device. We believe that these capabilities provide the largest device capacity in the industry."

Cascade Microtech's MeasureOne(TM) Best-of-Breed Solutions Program Joined by Keysight Technologies; Companies Collaborate to Give Customers Faster Time to First Measurement
October 23, 2014
Cascade Microtech, Inc. (NASDAQ: CSCD), a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced Keysight Technologies, Inc. as a MeasureOne(TM) solution partner. MeasureOne is a framework for collaboration with best-of-breed partners to offer test and measurement solutions with validated performance. MeasureOne collaborations offer customers access to expertise enabling faster time to first measurement -- accelerating time to market. The specification of a test system to perform wafer-level measurements can be challenging when equipment is sourced from multiple suppliers. The configuration must be proven on-site before the first device can be tested. Wafer probers and other components, including software controls, must be integrated. Customers often need to correlate data and measurement accuracy between different locations. It can take weeks, or even months, to execute the first measurements. Cascade Microtech, with MeasureOne partner Keysight Technologies, addresses these challenges by providing a fully integrated wafer-level measurement solution with guaranteed system configuration, installation and support.

Soft Machines Unveils VISC(TM) Microprocessor Architecture Breakthrough; Revives Performance-per-Watt Scaling
October 23, 2014
Soft Machines Inc., a Silicon Valley-based semiconductor startup company, today announced the Soft Machines VISC(TM) architecture. The VISC architecture is a breakthrough in microprocessor performance-per-watt scaling and will significantly improve performance and power for all segments of the computing ecosystem. The VISC architecture has been developed in response to single-core frequency and power-scaling issues and multi-core programming challenges. "I believe VISC ushers in the third wave of computer architecture," stated Soft Machines co-founder, vice chairman and CEO Mahesh Lingareddy. "We've been quietly building the company and developing the VISC architecture for more than seven years. Now that we have working silicon proving the invention, the time to unveil our breakthrough has arrived, and I could not be more excited. We have also proven that you can still build successful semiconductor startup companies and create value with the right vision, technology, team and investors."

Teledyne DALSA to Showcase Vision Inspection Solutions at Pack Expo International
October 23, 2014
Teledyne DALSA (NYSE:TDY), a Teledyne Technologies company and global leader in machine vision technology, will feature the latest advancements for packaging and processing applications at Pack Expo International 2014, in South Hall Booth S-4147. Pack Expo International, the leading show dedicated to the latest advancements in packaging materials, containers, machinery, will be held in Chicago, on November 2-5, 2014.

eSilicon Simplifies the Online Customer Experience; New One-Click Access to Automated Online MPW and GDSII Quoting Portals
October 23, 2014
eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced enhancements aimed at simplifying the customer experience for its online quoting portals. One-click MPW and GDSII quoting access eSilicon's automated online multi-project wafer (MPW) and GDSII quoting portals now have one-click access. These portals deliver real, executable quotes in just a few minutes. "We've seen broad customer acceptance for eSilicon's online quoting portals. We've had over 300 registrations from 43 countries and users have generated nearly 700 quotes," said Mike Gianfagna, eSilicon's VP, marketing. "We've been able to reach out to people all over the world with our online tool suite."

Mattson Continues to Gain Millisecond Anneal Market Position With Millios Shipment to a New Customer for Advanced Foundry Production
October 23, 2014
Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that its Millios(TM) millisecond anneal (MSA) system was accepted at a major foundry customer and an additional Millios system was shipped for their volume production facility. This new customer acceptance for sub-20 nanometer volume production continues the growing position of the Millios in the MSA market. "Working with our new Millios customer, Mattson established both the technical and operational performance to best support their upcoming sub-20 nanometer production ramp," said Johannes Keppler, Vice President and General Manager of Mattson Technology's Thermal Products Group. "As with our previous customer shipments, the Millios was selected based on superior device performance and higher productivity compared to other millisecond anneal technologies," added Keppler.

FORM 8-K: Freescale Semiconductor, Ltd FILES Current report
October 23, 2014
Freescale Semiconductor, Ltd, Bermuda, has filed FORM 8-K (Current report) with Securities and Exchange Commission on October 23, 2014 State or other Jurisdiction of Incorporation: Bermuda Item 2.02--Results of Operations and Financial Condition. On October 23, 2014, Freescale Semiconductor, Ltd. issued a press release announcing its financial results for the fiscal quarter ended October 3, 2014. A copy of the press release is attached as Exhibit 99.1 to this report. The information in Item 2.02 of this Report and the attached exhibit shall not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), nor shall it be deemed incorporated by reference in any filing under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly stated by specific reference in such filing. Section 9—Financial Statements and Exhibits.


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