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Organic Electronics Market by Material (Semiconductor, Conductive, Dielectric and Substrate), by Application (Battery, Conductive Ink, Display, Lighting, Logic/Memory, Sensor, OPV, ORFID and Others), Geography - Global Analysis and Forecast (2014 - 2020)
October 21, 2014
Organic electronics, also called as polymer electronics or plastic electronics, is a branch of material science which deals with small conductive molecules and electrically conductive polymers. It is called as organic because small molecules and polymers are carbon based, made using synthetic strategies developed in the context of organic and polymer chemistry. One of the benefits of organic electronics is their low cost as compared to traditional inorganic electronics. The most important areas to focus on for key players are technology innovations and new product developments rather than existing product developments, as striving for product differentiation will boost a player ahead in the race in the current scenario. The focus on industry relations with OEM giants and pure technology solution providers is a key for survival in the organic electronics ecosystem, while relations with the government or private legislative and regulating bodies with a special focus is a must in the organic electronics industry.

ROHM Semiconductor's General-Purpose Automotive MCU System Power Supplies for Idling Stop Systems; Advanced design ensures optimum MCU performance even during cranking
October 21, 2014
ROHM Semiconductorhas recently announced the development of system power supplies optimized for high-performance microcontrollers in a variety of automotive systems, from electronic power steering to fuel injection, including HEVs and EVs.

Synopsys STAR Memory System Multi-Memory Bus Processor Enables 10 Percent Die Size Reduction for Marvell SoC; New Multi-Memory Bus Processor Cuts Test Logic in Half While Maintaining High Performance for Networking SoC
October 21, 2014
Highlights: Marvell achieved silicon success for networking SoC using the multi-memory bus (MMB) processor in the Synopsys DesignWare STAR Memory System for embedded test and repair Reduced area and power with a single MMB processor providing common test and repair logic for all memory instances mapped to a shared bus Decoupled embedded test and repair logic from the performance- and area-critical block under test by placing MMB processor outside the block Achieved high test coverage with comprehensive automated test and repair solution for embedded memory arrays Accelerated test pattern development and silicon bring-up Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Marvell Semiconductor, Inc. used Synopsys'DesignWare® STAR Memory System's new multi-memory bus (MMB) processor to achieve a 10 percent reduction in total die size while maintaining product quality and performance for its networking system-on-chip (SoC). Using the DesignWare STAR Memory System embedded test and repair solution, Marvell accelerated silicon bring-up and achieved silicon success.

Axcelis 'Purion XE' High Energy System Chosen By Leading Chipmaker In Asia Pacific Region For DRAM Manufacturing; System Will Be Used To Support Major Capacity Expansion
October 21, 2014
 Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a new order for the Company's Purion XE(TM) single wafer, high energy implanter from a prominent chipmaker in the Asia Pacific region. The Purion XE will be used in high volume production of DRAM devices.  The system is scheduled to ship in Q4. 

Entegris Extends Its VaporSorb(TM) Filter Line for Advanced Yield Protection in Semiconductor Processing; New Filter Provides Total Acid Removal From Environmental Air in Chemical Mechanical Planarization (CMP) Process Tools
October 21, 2014
BILLERICA, Mass., Oct. 21, 2014 (GLOBE NEWSWIRE) -- Entegris, Inc. (Nasdaq:ENTG), a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, today announced a new product for its VaporSorb? line of airborne molecular contamination (AMC) filters. The new filter was created as an "all-in-one," single-filter solution for capturing critical AMC in the chemical mechanical planarization process, or CMP, in semiconductor manufacturing. VaporSorb, which is a leading brand of filter used in cleanroom environments and for process tools during key steps in manufacturing, is the first such filter available for CMP process tools that protects against weak acids as well as other contaminants.

Automotive Bus Technology Delivers Superior Digital Audio Quality; AD2410 transceiver uses new Automotive Audio Bus (A²B) to deliver 50 Mbps bandwidth while reducing audio system cost, weight, and design complexity.
October 21, 2014
Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance semiconductors for signal processing applications, introduced today a digital audio bus technology capable of distributing audio and control data together with clock and power over a single, unshielded twisted-pair wire. The AD2410 transceiver is the first in a family of devices that enables ADI's new Automotive Audio Bus (A²B), which significantly reduces the weight of existing cable harnesses, resulting in improved vehicle fuel efficiency while delivering high fidelity audio. The AD2410 transceiver also eliminates the need for expensive microcontrollers with large memories that are required in existing digital bus architectures.Learn more about the AD2410 transceiver and A2B technology: http://www.analog.com/AD2410Watch a video: http://videos.analog.com/video/products/audiovideo-products/3832751027001/Automotive-Bus-Technology-Delivers-Superior-Digital-Audio-Quality/ "As an early implementer of ADI's A²B, Panasonic Automotive found the technology to significantly reduce cabling complexity and associated cost and weight of next-generation infotainment systems, key areas of focus for Panasonic's OEM customers," said Jonathan Lane, Group Manager, Audio & Acoustics, part of Panasonic Automotive Systems Company of America (PASA*) Advanced Development Engineering. "We believe A²B to be well suited to address applications such as microphone arrays and Active Noise Cancellation, a leading area of expertise for Panasonic that we expect to be an integral component of next-generation infotainment systems."

Actions Semiconductor Debuts Its First 28nm OWL Series Chipset
October 21, 2014
Actions Semiconductor® Co., Ltd. (Nasdaq: ACTS), one of China's leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today announced that it debuted its latest innovative 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets at Global Sources' China Sourcing Fair - Electronics & Components held October 11 - 14 at the Asia World-Expo in Hong Kong. The latest application processor is a 28nm process enhancement of its 40nm process twin, the ATM7039, announced in September 2013. Initially, Actions will offer two solutions, the ATM7039s, which is pin to pin compatible with its predecessor, the ATM7039c (40nm version), along with a more compact and efficient version, the ATM7059. Like their predecessor, the ATM7039s and the ATM7059 feature a quad-core ARM® CortexTM A9 CPU, high performance, world-class PowerVR GPU core from Imagination Technologies, 2K by 4K super high resolution decoding including support of the newest international standard - high definition HVEC/H.265 video decoding.

NXP Enables New Era in Cloud Services Security; Securing User Logins Using Secure Elements and FIDO U2F Authentication
October 21, 2014
SAN JOSE, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI), global leader in secure technology and solutions, today announced a strategic deployment of FIDO U2F secure element ICs for accessing consumer cloud services. As posted in its security blog today, Google announced support for FIDO U2F Security Keys for secure sign-in. Amid growing consensus that password-based security needs to be improved, the FIDO U2F ecosystem, consisting of web browsers, applications, hardware authentication devices and authentication servers, offers online users easy, private and secure login to cloud services such as email, shopping, financial and social sites from both their desktop and mobile devices. NXP secure element solution has been a cornerstone technology significantly contributing to the security advantages in the U2F standard.

Dialog Semiconductor Multi-Touch Display Sensor IC Enters Mass Production with Major PC OEM; SmartWaveTM Multi-Touch Integrated Circuit (MTICTM) now in volume production with products anticipated in-store before year end with a major PC OEM
October 21, 2014
Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC, solid-state lighting and Bluetooth(R) Smart wireless technology, today announced its DA8901 Multi-Touch IC has entered mass production. First volume shipments have been integrated into touch modules using Dialog's SmartWaveTM and FlatFrog's optical In-GlassTM touch technologies. These low-cost, optically superior, Windows 8-certified touch modules will feature in a range of PCs, with first products anticipated to hit stores before the end of the year. "Since announcing the launch of our Multi-Touch sensor IC, we have been collaborating with our technology partner FlatFrog alongside high-volume manufacturing partners to complete the design-in, qualification and pre-production phases required to bring our customer's products to market," said Mark Tyndall, Senior Vice President Corporate Development & Strategy and General Manager Emerging Products Business Group for Dialog Semiconductor. "Having successfully completed this process, we are delighted that a leading PC OEM has realised the unique advantages of the technology and is now entering mass production."

DSP Group Introduces ULE for IoT Applications Over Intel(R) Puma(TM) 6-Powered Home Gateways; DSP Group's ULE (Ultra Low Energy) Solution Offers Simple Integration With Intel's Puma-Based SoC Delivering Data, Voice and Video Support
October 21, 2014
LOS ALTOS, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, announced today the integration of its ULE-based chipset with home gateways based on Intel's Puma? 6 SoC. The solution uses DSP Group's advanced DECT / ULE SoC integrated with the Intel Puma platform.


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