Headlines


Sector Update: Tech Stocks Falling; Tower Semiconductor Soars Following Supply Pact With Intel
March 03, 2015
Top Tech Stocks MSFT -1.46% AAPL -0.05% IBM +0.20% CSCO -2.34% GOOG -0.17% Technology stocks were broadly lower this afternoon, with shares of technology companies in the S&P 500 losing about 0.9%.

STMicroelectronics Announces Filing of its 2014 Annual Report Form 20-F
March 03, 2015
GENEVA, March 3, 2015 (GLOBE NEWSWIRE) -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it has filed its Annual Report on Form 20-F for the year ended December 31, 2014 with the United States Securities and Exchange Commission (SEC) on March 3, 2015. The Company's Form 20-F and complete audited financial statements can be found atwww.st.com and can also be accessed by visiting the SEC's website at www.sec.gov.

Factory wide, Data Analysis Solution Enabling Semiconductor Companies To Quickly Ramp To Production Volumes
March 03, 2015
PDF SOLUTIONS ("PDFS-Q") - Factory-wide, Data Analysis Solution Enabling Semiconductor - Companies To Quickly Ramp To Production Volumes PDF Solutions, Inc. -- The leading provider of yield improvement services and solutions for the integrated circuit (IC) industry, is announcing the release of its state-of-the art solution focused on semiconductor yield maximization. Exensio(TM), an enterprise-wide, Big Data platform, analyzes and reports critical data generated across the semiconductor ecosystem. The solution also provides tools and immediate information for foundries to rapidly adjust equipment for higher yields and reduced variability. Exensio provides a competitive edge to semiconductor and fabless companies, as well as foundries, by providing actionable information to rapidly identify and resolve manufacturing issues. "ON Semiconductor previously had a very successful experience using dataPOWER(r) in our manufacturing environment," said Kevin Haskew, Senior Vice President and Chief Information Officer at ON Semiconductor. "We have now transitioned from dataPOWER to Exensio Yield Module with the Automation and Reporting functionality. The new features and the single platform approach of Exensio are critical for the success of our new product introductions, enabling us to drive our manufacturing process to higher yields, higher efficiency, and help our customers get to market quickly."

AMD Takes Aim at Exceptional Content, Comfort and Compatibility With New LiquidVR(TM) Technologies; Never Break Presence: New AMD Technology Platform Is Architected for Immersion and Responsiveness in Virtual Reality Environments
March 03, 2015
Today, at the Game Developer Conference in San Francisco, AMD (NASDAQ: AMD) announced an initiative to deliver the best possible VR experience for developers and users through new AMD technologies and partnerships. The first output of AMD's initiative is LiquidVR(TM), a set of innovative technologies focused on enabling exceptional VR content development for AMD hardware, improved comfort in VR applications by facilitating performance, and plug-and-play compatibility with VR headsets. The upcoming LiquidVR SDK makes a number of technologies available which help address obstacles in content, comfort and compatibility that together take the industry a major step closer to true, life-like presence across all VR games, applications, and experiences. In virtual reality, the concept of 'presence' is described as the perception of being physically present in a simulated, nonphysical world in a way that fully immerses the user. A key obstacle to achieving presence is addressing motion-to-photon latency, the time between when a user moves their head and when his or her eye sees an updated image reflecting that new position. Minimizing motion-to-photon latency is critical to achieving both presence and comfort, two key elements of great VR.

Park Systems Announces Joint Development Partnership with imec to Develop Nanoscale AFM Metrology Solutions for Semiconductor Manufacturing
March 03, 2015
Park Systems, world-leader in Atomic Force Microscopes (AFM) announced today they have signed a Joint Development Project (JDP) with nanoelectronics research center imec, to develop in-line AFM metrology solutions of future technology nodes including but not limited to surface roughness, thickness, critical dimension (CD), and sidewall roughness.  The JDP will develop new protocol to increase production yield and device performance for the semiconductor industry.  Park Systems has officially joined imec's Industrial Affiliation Program and became a new member of IIAP at a signing ceremony in Seoul Korea on Feb 3, 2015.

Media Alert: Plunify to Host "Got FPGA Timing Closure Problems?" Webinar March 10; Meant for FPGA Designers, Project Leaders, Engineering Managers Creating FPGA Designs With Timing Closure Problems
March 03, 2015
WHO: Plunify(R) Pte. Ltd., provider of groundbreaking field programmable gate array (FPGA) software WHAT: Will host the "Got FPGA Timing Closure Problems?" webinar to showcase InTime's ability to solve timing closure and explain the newly announced "Results-Based" pricing model for FPGA design optimization services

PDF Solutions(R) Announces Factory-Wide, Data Analysis Solution Enabling Semiconductor Companies to Quickly Ramp to Production Volumes; Exensio(TM) Multifunctional Platform Provides Rapid Access to Wafer and Real Time Data Processing Enabling Semiconductor Companies and Foundries to Maximize Yields
March 03, 2015
PDF Solutions, Inc. (NASDAQ: PDFS) -- The leading provider of yield improvement services and solutions for the integrated circuit (IC) industry, is announcing the release of its state-of-the art solution focused on semiconductor yield maximization. Exensio(TM), an enterprise-wide, Big Data platform, analyzes and reports critical data generated across the semiconductor ecosystem. The solution also provides tools and immediate information for foundries to rapidly adjust equipment for higher yields and reduced variability. Exensio provides a competitive edge to semiconductor and fabless companies, as well as foundries, by providing actionable information to rapidly identify and resolve manufacturing issues. "ON Semiconductor previously had a very successful experience using dataPOWER(R) in our manufacturing environment," said Kevin Haskew, Senior Vice President and Chief Information Officer at ON Semiconductor. "We have now transitioned from dataPOWER to Exensio Yield Module with the Automation and Reporting functionality. The new features and the single platform approach of Exensio are critical for the success of our new product introductions, enabling us to drive our manufacturing process to higher yields, higher efficiency, and help our customers get to market quickly."

Viper Networks Contracts With CMD to Target U.S. and Canadian Construction Projects for Intelligent LED Lighting
March 03, 2015
Viper Networks, Inc. (OTC: VPER), is pleased to announce that the Company (in partnership with Apollo Metro Solutions, Inc.) has contracted with CMD, to use their specEdge marketing solution, to drive greater sales for Apollo Metro's Intelligent LED Lighting technology for major construction projects throughout the U.S. and Canada.

CogniVue Announces Next Generation APEX Vision Processing Core
March 03, 2015
Mobile World Congress 2015: CogniVue Corporation, which licenses its automotive and consumer market proven APEX(TM) Image Cognition Processor (ICP) technology to semiconductor vendors, announced its next generation of APEX ICP technology with a 10x performance increase over its current APEX.  The automotive market continues to drive the need for high performance vision processing at low power.  Building on its expertise in automotive safety applications and working collaboratively with major automotive Tier-1s and OEMs, CogniVue's team has further improved APEX ICP architecture, hardware blocks and added new features for this next-gen core that provides the best performance per area per power for vision and image processing.  For instance, the next-gen APEX will enable simultaneous processing of multiple feature detectors (i.e. Canny, FAST, SIFT, SURF etc.), complex classifiers (i.e. SVM, CNN, etc.) and motion analysis (i.e. trackers, optical-flow, etc.) on multi-camera 2k video streams at a fraction of the power of competing processors.  In addition CogniVue expands on APEX scalability by enabling not only performance scalability inside APEX, but also improved multi-core processing between APEX cores.  Customers may license a range of APEX configurations to best suit their application requirements by scaling both the vector and scalar performance, and now also connect multiple APEX cores together for even higher performance.

NXP to acquire Freescale Semiconductor for USD40b
March 03, 2015
Chip maker NXP Semiconductors NV said it will acquire smaller peer Freescale Semiconductor Ltd and merge operations in a deal worth USD40 billion, Gulf News reported.


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