Headlines


'Make in India' Gains The Pace With Semicon Manufacturing Facility In India
December 19, 2014
Jaiprakash Associates Limited with IBM USA as technology partner and HSMC Technologies India Pvt. Ltd with ST Microelectronics as technology partner will lead the fabrication (FAB) manufacturing facilities in India.

Global Semiconductor Market Outlook 2020
December 18, 2014
The global semiconductor market has been experiencing a stimulating growth in recent times despite the industry suffering from a decline in revenue due to the economic downturn in 2010. Advancement in technology, emergences of mobile devices and consumer electronics, and new application areas are further expected to lead the global semiconductor market in the coming years. Although intense competition, pricing pressure and product life cycle & cost hamper the growth of semiconductor market, it is anticipated that the global semiconductor market will sustain positive growth in the coming years.

Vishay Intertechnology Automotive-Grade PIN Photodiodes Deliver 7.5 mm² Sensitive Area in Low-Profile Packages; AEC-Q101-Qualified, Surface-Mount Devices Offer High Reverse Light Current to 48 µA and Low Dark Current of 2 nA
December 18, 2014
Vishay Intertechnology, Inc. (NYSE: VSH) is broadening its optoelectronics portfolio with the introduction of two new automotive-grade high-speed silicon PIN photodiodes in top-view, surface-mount packages measuring 5 mm by 4 mm by 0.9 mm. Offering a large sensitive area of 7.5 mm², the Vishay Semiconductors VEMD5010X01 and VEMD5110X01 provide high radiant sensitivity with a reverse light current of 48 µA and a very low dark current of 2 nA for automotive, industrial, and medical applications.

LED Driver from Diodes Offers High E-Transformer Compatibility in Non-Dimmable MR16 Lamp Design
December 18, 2014
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced the AL8820 LED driver converter. This device is a compact, two-stage, boost/buck non-dimmable MR16 lamp design solution that is simultaneously characterized by high power factor, low total harmonic distortion (THD) and low-output current ripple. For example, in a 6W MR16 application, the device operates flicker-free with most common LED lighting transformers at a power factor of 0.9 and THD of 30%.

Exar Promotes Daniel Wark to Vice President of Worldwide Operations
December 18, 2014
 Exar Corporation(NYSE: EXAR), a leading supplier of high-performance integrated circuits and system solutions, today announced the promotion of Daniel Wark to the position of Vice President, Worldwide Operations. Mr. Wark succeeds Robert Todd Smathers, who is retiring after three years of service with Exar and over 35 years of service in the semiconductor industry.

TowerJazz to Present at the 17th Annual Needham Growth Conference in New York
December 18, 2014
TowerJazz (NASDAQ: TSEM), the global specialty foundry leader, today announced that its Chief Executive Officer, Mr. Russell Ellwanger, will present at the 17th Annual Needham Growth Conference.

Nordic Semiconductor IPv6 Over Bluetooth Smart Protocol Stack for nRF51 Series SoCs Enables Small, Low Cost, Ultra-Low Power Internet of Things Applications
December 18, 2014
Now available for download, the nRF51 IoT Software Development Kit (SDK) is a complete IPv6-ready Internet Protocol Suite for Nordic's market-leading nRF51 Series Bluetooth Smart SoCs. The SDK enables native and interoperable IP-based connectivity between a Bluetooth Smart 'thing' and a cloud service. It also enables Bluetooth Smart to be used in large, distributed, cloud-connected, heterogeneous networks such as home, industrial, and enterprise automation       (Photo:http://photos.prnewswire.com/prnh/20141218/721236)

Synapse Design to Moderate "Evolve or Die" Technical Panel
December 18, 2014
Where: Storage Visions Conference 2015 The Rivera Hotel, Las Vegas - January 4-5, 2015 When: January 4, from 4:00-5:00p

North American Semiconductor Equipment Industry Posts November 2014 Book-to-Bill Ratio of 1.02
December 18, 2014
The Semiconductor Equipment and Materials International issued the following news release: North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

STACKING TWO-DIMENSIONAL MATERIALS MAY LOWER COST OF SEMICONDUCTOR DEVICES
December 11, 2014
BOONE, N.C., Dec. 11 -- Appalachian State University issued the following press release: A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs. "This work demonstrates that by stacking multiple two-dimensional (2-D) materials in random ways we can create semiconductor junctions that are as functional as those with perfect alignment" says Dr. Linyou Cao, senior author of a paper on the work and an assistant professor of materials science and engineering at NC State.


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