Headlines


ON Semiconductor Reports Ticker Symbol Change to 'ON'
March 26, 2015
ON Semiconductor on March 23 reported that it will change its NASDAQ trading symbol to "ON" - effective upon the market's open on April 6.

NTT Electronics Introduces Industry-First 20nm Low-Power Coherent DSP
March 26, 2015
NTT Electronics (NEL) reported that its second generation Low-Power DSP product, NLD0640 Gen2 LP-DSP, is now generally available for manufacturers, and is shipping thousands of the new LP-DSP Integrated Circuits (IC's) in its first quarter to fifteen manufacturers worldwide for upgrading and/or downsizing their optical module and system.

Local bourse hit by Wall Street fall, but losses limited
March 26, 2015
Local bourse hit by Wall Street fall, but losses limited Central News Agency2015-03-26 03:51 PM Taipei, March 26 (CNA) Shares in Taiwan closed down Thursday as investors took hints from a plunge on Wall Street overnight caused by the latest disappointing economic data from Washington, dealers said. The bellwether electronics sector followed the tech-heavy NASDAQ index to suffer relatively heavier downward pressure, led by blue chips such as Taiwan Semiconductor Manufacturing Co. (TSMC, ???), while old economy and financial stocks bucked the downturn to help the broader market recoup part of its earlier losses, the dealers said.

MAGNACHIP SEMICONDUCTOR: S&P Lowers CCR to 'B-'; Outlook Stable
March 26, 2015
Standard & Poor's Ratings Services said that it has lowered to'B-' from 'B+' its long-term corporate credit and debt ratings onKorea-based analog and mixed-signal semiconductor manufacturerMagnaChip Semiconductor Corp. (MagnaChip).  At the same time, S&Premoved the ratings from CreditWatch, where it placed them withnegative implications on Dec. 10, 2014.  The outlook on the long-term corporate credit rating is stable.

Broadcom Announces Cable Broadband Solution Optimized for Multi-dwelling Units in China; C-HPAV 1.0 Technology Provides Operators with Cost-effective IP-based Transport
March 25, 2015
 CCBN 2015 -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced a complete high-speed coaxial cable solution with new access technology for Chinese subscribers in multi-dwelling units (MDUs). The new BCM63500 and BCM63333 devices integrate the China HomePlug AV 1.0 (C-HPAV 1.0) standard endorsed by the State Administration of Radio, Film and Television (SARFT), the Chinese government agency overseeing broadcasting in the region, to provide operators with an economical solution for broadband services over cable. For more news, visit Broadcom'sNewsroom. The new chipset will allow Chinese cable operators to extend broadband services to home subscribers outside of China's major coastal cities, particularly in densely-populated apartment buildings. The integrated C-HPAV 1.0 standard complements Broadcom's existing C-DOCSIS technology by addressing different bandwidth and subscriber density levels than are required for C-DOCSIS deployments.  Broadcom will showcase its latest innovations at CCBN in Beijing, March 26-28.

Broadcom Delivers DOCSIS 3.0 Cable Set-top Box Platform for China; Cost-Effective, Small Form-factor Design Adds Advanced C-DOCSIS Technology for Home Networking
March 25, 2015
 CCBN 2015 -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a new cost efficient, small form-factor DOCSIS® 3.0 set-top box (STB) engineered for the growing cable market in China. The new offering is designed to deliver more advanced features to cable subscribers in the region, including over-the-top (OTT) video content, broadband data services, and both wired and/wireless home networks. For more news, visit Broadcom'sNewsroom. Broadcom's new cable STB design includes DOCSIS 3.0 capabilities, AVS+ decoding support for high definition (HD) content and is TVOS-compatible. These new features support increasing bandwidth transmission requirements for new subscriber applications and cable services on China's C-DOCSIS network, and provide operators with easy-to-install equipment for home subscribers. Broadcom will demonstrate its DOCSIS 3.0 cable STB platform at CCBN in Beijing, March 26-28.

MESA COMPLEX STARTS LARGEST PRODUCTION SERIES IN ITS HISTORY
March 25, 2015
The following information was released by Sandia National Laboratories: Sandia National Laboratories has begun making silicon wafers for three nuclear weapon modernization programs, the largest production series in the history of its Microsystems and Engineering Sciences Applications complex. MESA's silicon fab in October began producing base wafers for Application-Specific Integrated Circuits for the B61-12 Life Extension Program, W88 Alteration 370 and W87 Mk21 Fuze Replacement nuclear weapons. Planning and preparation took years and involved more than 100 people. "We left no one untouched. If you were standing still, you got something to do," said Jayne Bendure, who was in charge of organizing 1,000 line items to be checked off before wafer production began.

Washington: Method of Promoting Single Crystal Growth During Melt Growth of Semiconductors
March 25, 2015
National Aeronautics and Space Administration, The Government of USA has issued the following news release: The method of the invention promotes single crystal growth during fabrication of melt growth semiconductors. A growth ampoule and its tip have a semiconductor source material placed therein. The growth ampoule is placed in a first thermal environment that raises the temperature of the semiconductor source material to its liquidus temperature. The growth ampoule is then transitioned to a second thermal environment that causes the semiconductor source material in the growth ampoule's tip to attain a temperature that is below the semiconductor source material's solidus temperature. The growth ampoule so-transitioned is then mechanically perturbed to induce single crystal growth at the growth ampoule's tip.

Emerald Therapeutics Unveils ECL-1: The First Emerald Cloud Lab Production Facility and Announces First Customers
March 25, 2015
Biotechnology Industry Organization has issued the following news release: Emerald Therapeutics, a scientist-led company re-imagining the way laboratory research is conducted, today announced the opening of its first Emerald Cloud Lab (ECL) production facility, ECL-1, in the biotech corridor of South San Francisco. ECL-1 is a state-of-the-art life sciences laboratory that scientists can remotely access via the Internet where automated robotics conduct experiments exactly as specified by the user.

Huawei and NXP to Jointly Explore the Industry 4.0 Market
March 25, 2015
NXP Semiconductors has issued the following news release: Huawei Technologies Co., Ltd. and NXP Semiconductors N.V. (NASDAQ: NXPI) decided to jointly explore the Chinese and global Industry 4.0 market at the Industry 4.0 Roundtable held at Hanover CeBIT 2015 (Hanover Consumer Electronics, Information and Communication Expo). Through technical cooperation and joint innovation, the two companies will create an open, robust and secure Industry 4.0 Information and Communication Technology platform. The joint decision marks a milestone in the partnership between the two companies.


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