Global Microscopes Market
October 24, 2014
This report analyzes the worldwide markets for Microscopes in US$ Million/Thousands by the following Product Segments: Optical Microscopes, Charged Particle Microscopes, and Scanning Probe Microscopes. The report also analyzes the world market by the following End-Use Applications: Semiconductor Manufacturing, Life Sciences, Materials, Nanotechnology, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East, and Latin America. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 88 companies including many key and niche players such as - Agilent Technologies, Inc.

Global Silicon and Ferrosilicon Market
October 23, 2014
This report analyzes the worldwide markets for Silicon and Ferrosilicon in Metric Tons. The report analyzes the market for Silicon by the following End-Use Applications: Metallurgy, Chemicals, Semiconductors, and Others. Also the report analyzes the market for Ferrosilicon by the following End-Use Applications: Ferrous Foundry, Steel Industry, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East, and Latin America. Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 60 companies including many key and niche players such as - AMG Advanced Metallurgical Group N.V China National BlueStar (Group) Co., Ltd. Dow Corning Corporation Erdos Xijin Kuangye Co., Ltd. Evonik Industries AG Read the full report:http://www.reportlinker.com/p02438194-summary/view-report.html

Accelerate control systems and increase integration while decreasing system cost with TI's new C2000(TM) Piccolo(TM) F2807x MCUs; Enabling system flexibility and platform scalability for industrial control applications such as digital power, renewable energy and automotive control
October 23, 2014
 Need a microcontroller (MCU) that allows you to quickly double system performance without doubling your cost or changing your hardware or software design? With the powerful combination of the C28x CPU and accelerators, the new C2000(TM) Piccolo(TM) F2807x MCUs from Texas Instruments (TI) (NASDAQ: TXN) boost execution speeds of control tasks in industrial applications such as telecom rectifiers, server power, solar micro inverters, frequency inverters and automotive HEV/EV. The F2807x MCUs also provide many analog and control peripherals to enable more integrated control applications. They are scalable with the previously announced C2000 Delfino(TM) F2837xS and F2837xD MCU generations. 

Avago Technologies, Lithia Motors, Amazon.com and Netflix highlighted as Zacks Bull and Bear of the Day
October 23, 2014
 Zacks Equity Researchhighlights Avago Technologies (Nasdaq:AVGO-Free Report) as the Bull of the Day and Lithia Motors (NYSE:LAD-Free Report) as the Bear of the Day. In addition, Zacks Equity Research provides analysis onAmazon.com Inc. (Nasdaq:AMZN-Free Report) and Netflix (Nasdaq:NFLX-Free Report). Here is a synopsis of all five stocks:

Cascade Microtech's MeasureOne(TM) Best-of-Breed Solutions Program Joined by Keysight Technologies; Companies Collaborate to Give Customers Faster Time to First Measurement
October 23, 2014
Cascade Microtech, Inc. (NASDAQ: CSCD), a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced Keysight Technologies, Inc. as a MeasureOne(TM) solution partner. MeasureOne is a framework for collaboration with best-of-breed partners to offer test and measurement solutions with validated performance. MeasureOne collaborations offer customers access to expertise enabling faster time to first measurement -- accelerating time to market. The specification of a test system to perform wafer-level measurements can be challenging when equipment is sourced from multiple suppliers. The configuration must be proven on-site before the first device can be tested. Wafer probers and other components, including software controls, must be integrated. Customers often need to correlate data and measurement accuracy between different locations. It can take weeks, or even months, to execute the first measurements. Cascade Microtech, with MeasureOne partner Keysight Technologies, addresses these challenges by providing a fully integrated wafer-level measurement solution with guaranteed system configuration, installation and support.

Soft Machines Unveils VISC(TM) Microprocessor Architecture Breakthrough; Revives Performance-per-Watt Scaling
October 23, 2014
Soft Machines Inc., a Silicon Valley-based semiconductor startup company, today announced the Soft Machines VISC(TM) architecture. The VISC architecture is a breakthrough in microprocessor performance-per-watt scaling and will significantly improve performance and power for all segments of the computing ecosystem. The VISC architecture has been developed in response to single-core frequency and power-scaling issues and multi-core programming challenges. "I believe VISC ushers in the third wave of computer architecture," stated Soft Machines co-founder, vice chairman and CEO Mahesh Lingareddy. "We've been quietly building the company and developing the VISC architecture for more than seven years. Now that we have working silicon proving the invention, the time to unveil our breakthrough has arrived, and I could not be more excited. We have also proven that you can still build successful semiconductor startup companies and create value with the right vision, technology, team and investors."

NeoPhotonics Announces Acquisition of EMCORE's Narrow Linewidth Tunable Laser Product Line; Expands NeoPhotonics Portfolio of Optical Components for High Speed 100G and 400G Coherent Transmission Systems
October 23, 2014
NeoPhotonics Corporation (NYSE:NPTN), a leading designer and manufacturer of photonic integrated circuits, or PIC, based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced that it has entered into a definitive purchase agreement with EMCORE Corporation (NASDAQ:EMKR) under which NeoPhotonics will purchase the assets of EMCORE's tunable laser and transceiver product lines for approximately $17.5 million, which consists of $15.0 million and a working capital and inventory adjustment of approximately $2.5 million. Consideration will be in the form of $1.5 million in cash plus the balance in a promissory note. The transaction is subject to customary closing conditions and is expected to close by early January 2015. "EMCORE's narrow linewidth tunable laser product line is highly complementary to our broad existing portfolio of optical components for 100 Gigabits per second coherent transport systems, and this acquisition significantly expands our footprint in this rapidly growing segment," said Tim Jenks, Chairman and CEO of NeoPhotonics. "EMCORE's External Cavity Laser tunable laser has the narrowest linewidth in the industry, which we believe will become increasingly important for advanced modulation schemes at 400G and beyond. Combining this business into NeoPhotonics will allow us to provide customers with a full product suite that serves the entire coherent market," continued Mr. Jenks.

SMIC and Maxscend collaborate on 55nm RF IP platform; Bluetooth RF IP silicon proven and in customer usage
October 23, 2014
Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI, SEHK: 981) and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage (LL) logic process. This IP has now been integrated into one of SMIC customers' product tape-out. The silicon proven Bluetooth RF IP is the result of a collaborative effort between SMIC and Maxscend and marks a significant milestone in SMIC RF IP platform setup. It has achieved a leading edge position in the industry and will provide mutual customers an excellent IP solution for the booming IoT market, as well as the prosperous mobile and tablet markets.

Teledyne DALSA to Showcase Vision Inspection Solutions at Pack Expo International
October 23, 2014
Teledyne DALSA (NYSE:TDY), a Teledyne Technologies company and global leader in machine vision technology, will feature the latest advancements for packaging and processing applications at Pack Expo International 2014, in South Hall Booth S-4147. Pack Expo International, the leading show dedicated to the latest advancements in packaging materials, containers, machinery, will be held in Chicago, on November 2-5, 2014.

Mattson Continues to Gain Millisecond Anneal Market Position With Millios Shipment to a New Customer for Advanced Foundry Production
October 23, 2014
Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that its Millios(TM) millisecond anneal (MSA) system was accepted at a major foundry customer and an additional Millios system was shipped for their volume production facility. This new customer acceptance for sub-20 nanometer volume production continues the growing position of the Millios in the MSA market. "Working with our new Millios customer, Mattson established both the technical and operational performance to best support their upcoming sub-20 nanometer production ramp," said Johannes Keppler, Vice President and General Manager of Mattson Technology's Thermal Products Group. "As with our previous customer shipments, the Millios was selected based on superior device performance and higher productivity compared to other millisecond anneal technologies," added Keppler.


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