Ships 100th Syndion(r) Etch Module
October 21, 2014
LAM RESEARCH CORP ("LRCX-Q") - Ships 100th Syndion(r) Etch Module Lam Research Corp., a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion(R) module for deep silicon etch applications, including CMOS image sensors (CIS), interposers, and through-silicon vias (TSVs). Lam's production-proven 2300(R) Syndion(R) product family is the etch market leader for manufacturing advanced CIS chips, which are used in mobile, automotive, and medical devices. The systems are also used to create TSVs for stacked memory and other three-dimensional integrated circuits (3D ICs). To enable the transition of 3D ICs from development to high-volume production, Lam's Syndion products provide industry-leading performance in etch uniformity, profile control, and productivity. As a result, Syndion is the development tool of record for TSV etch with the majority of leading IC manufacturers worldwide.

Automated Test Equipment Market by Component (Industrial PC, Mass Interconnect, Handler, Prober), Type (Memory, Mixed Signal, Digital), Application (Consumer, Automotive, Aerospace & Defense, Medical) and by Geography - Analysis & Forecast (2013-2020)
October 20, 2014
Automated Test Equipment (ATE) is a system which is designed to perform various test operations on different semiconductor devices, referred to as a Device Under Test (DUT). Automated test systems, along with their several test mechanisms, run automatic high-level electronic tests such as wafer testing, Integrated Circuits (IC) testing, Printed Circuit Boards (PCB) testing, and so on. In the semiconductor industry, ATE plays a very important role to detect faulty DUT, resulting in the prevention of faulty devices entering into the market. The adoption of ATE helps to increase the throughput and quality of production.

Global Unichip Corporation Uses Cadence Encounter Digital Implementation System to Complete Its First Production Design on TSMC 16FF+ Process; Cadence Digital Solution Enabled GUC to Improve System Performance by 2X and Deliver 180 Million Gate SoC Design
October 20, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and Global Unichip Corporation (GUC), the Flexible ASIC LeaderTM, today announced that GUC used the Cadence® Encounter® Digital Implementation System to tape out its first production high performance computation ASIC design on TSMC's 16nm FinFET Plus (16FF+) process. The combination of the Cadence digital solution with the 16FF+ process provided GUC with a 2X system performance improvement, an 18 percent frequency increase, and a 28% power reduction over their previous design.

Media Alert: Cadence to Host Mixed-Signal Technology Summit
October 20, 2014
 Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it plans to host theMixed-Signal Technology Summiton October 28, 2014, at its headquarters in San Jose, Calif.

ISSI Debuts 20W Per Channel Stereo Class-D Amplifier; Reduces design complexity and improves audio performance with fewer components and more protection features, enhancing long term reliability
October 20, 2014
 Integrated Silicon Solution, Inc. (Nasdaq:ISSI), a leader in advanced memory and analog IC solutions, today announced the release of the IS31AP2110, a high-performance differential input Class-D power amplifier for consumer and professional audio equipment manufacturers. It integrates a host of features that increase audio quality and reliability for next-generation multimedia applications, such as sound bars, LCD projectors, HDTVs, media docking stations and radio equipment. "ISSI offers a broad portfolio of low power audio amplifiers for portable applications. This product introduction marks entry into the medium to high power Class-D amplifier segment, opening new application areas and extending  ISSI's analog market. This serves as our base for our new medium to high power audio amplifier portfolio targeting the consumer, industrial and automotive markets," stated Ven Shan, VP of Analog Products at ISSI.

VIA Technologies Cuts Silicon Test Time by 11X Using Synopsys' DFTMAX Ultra; Standardizes on DFTMAX Ultra for Designs with Few Test Pins
October 20, 2014
Highlights: DFTMAX(TM) Ultra compression technology deliver 11X higher compression and reduced test time Higher test quality with shorter test time drove VIA's standardization on DFTMAX Ultra for pin-limited designs Deployment of DFTMAX Ultra, built into Synopsys' Design Compiler® RTL Synthesis solution, was done within a week Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that VIA Technologies, the foremost fabless supplier of power efficient x86 processor platforms, successfully taped out a system-on-chip (SoC) design using Synopsys' DFTMAX Ultra compression, meeting test time and quality goals. The need to shorten test time in conjunction with increasing design complexity drove VIA Technologies requirement for higher test compression. DFTMAX Ultra and Synopsys' TetraMAX® ATPG delivered 11X higher compression while maintaining high test quality and requiring only one week to deploy. As a result, VIA Technologies has standardized on DFTMAX Ultra and TetraMAX for all pin-limited designs.

Marvell Unveils Groundbreaking SRAM-Based Network Search Engine with Industry's Highest Capacity, Fastest Performance and Lowest Power Consumption; New Marvell Questflo product line delivers 4X capacity and fastest speed at 1/3 the power consumption to support next-generation flow-based services for the Mobile Internet and Internet of Things
October 20, 2014
Marvell(NASDAQ: MRVL) today introduced Questflo(TM) (98TX1100), a groundbreaking Static Random Access Memory (SRAM)-based network search engine, that delivers the industry's highest capacity and fastest performance while using a fraction of the power of existing solutions today. Marvell's new Questflo product line delivers 4X capacity at 1/3 the power consumption to address the needs of next generation networking equipment to collectively support the explosive growth of mobile devices, Internet of Things (IoT) and automotive connectivity where today's traditional Ternary Content Addressable Memory (TCAM)-based solutions are unable to address these future scaling requirements of both bandwidth and service density from a system cost, power, form-factor and reliability perspective. Marvell's new Questflo product line marks a technology breakthrough that will help carriers and service providers introduce, manage and rapidly scale new revenue-generating services while offering enhanced security and network quality. Applications for the 98TX1100 include carrier and enterprise service/edge routers, security appliances, network probes, data center switches, servers, load-balancers and new classes of Software Defined Network (SDN) and Network Functions Virtualization (NFV) platforms.

Freescale introduces world's smallest integrated tire pressure monitoring system; Highly integrated tire pressure monitoring device combines the smallest package and lowest power consumption for improved safety through precise tire pressure sensing
October 20, 2014
Freescale Semiconductor (NYSE: FSL) today introduced the FXTH87 tire pressure monitoring system (TPMS) family, which is the smallest integrated package TPMS solution available at an extremely light weight of 0.3 grams. The FXTH87 family is 50 percent smaller than competing products, helping designers reduce overall bill of materials costs. Freescale's newest TPMS system-in-package solution provides low power consumption combined with the highest level of functional integration in one package, featuring a dual-axis accelerometer architecture, pressure and temperature sensor, integrated MCU, RF transmitter and low frequency receiver. Freescale's new FXTH87 is the world's smallest tire pressure monitoring system (Photo: Business Wire)

Broadcom Showcases End-to-End Automotive Connectivity Portfolio at Detroit SAE Convergence Event; Live Demonstration of Industry Leading Wired and Wireless Solutions Powering the World's Top Automotive Brands
October 20, 2014
 At the 2014 SAE Convergence Conference & Exhibition, Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, will showcase its full line of automotive connectivity technologies, including its market-leading BroadR-Reach® Automotive Ethernet portfolio and wireless combo chips. Broadcom's automotive integrated circuits (ICs) are driving disruptive innovation throughout the industry, providing the technology required to deliver advanced driver safety and infotainment features to a broad spectrum of vehicles. For more news, visit Broadcom'sNewsroom. Industry analysts predict100 percent of new cars to be Internet-enabled by 2025, an industry revolution that will redefine the driving experience. As a result of the significant increase in volume and complexity of in-car electronics, demand for connectivity solutions that offer low-cost, high speed transmission and bandwidth is on the rise. Collision warnings, comfort controls, infotainment and advanced driver assistance are just some of today's sophisticated features enabled by Broadcom® technology.

Global Automated Test Equipment (ATE) Market By Product (Memory, Non-memory, Discrete), By Application (Automotive, Consumer, Defense, IT & Telecommunication) is Expected to Reach USD 4.48 Billion by 2020: New Report By Grand View Research, Inc; Market Size - $3.77 billion in 2013, Market Growth - CAGR of 2.5% from 2014 to 2020, Market Trends - Need for effective testing measures due to increased design complexity is expected to drive market demand over the forecast period.
October 20, 2014
San Francisco, California, Oct. 20, 2014 (GLOBE NEWSWIRE) -- The global Automated Test Equipment (ATE) market is expected to reach USD 4.48 billion by 2020, according to a new study by Grand View Research, Inc. Increased demand for consumer electronics is expected to drive the market over the forecast period. Increased design complexity due to adoption of system on chip has resulted in need for effective testing, which is expected to favorably impact the market. Fluctuating demand for semiconductors is expected to pose a challenge to the growth of this market due to its adverse effects on the profitability of industry participants. Consolidated nature of the market may prove to be a barrier for industry growth. Expansion of wireless networks and significant developments in the manufacturing process of semiconductors are factors conducive for market growth over the next six years.


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