Organic Electronics Market by Material (Semiconductor, Conductive, Dielectric and Substrate), by Application (Battery, Conductive Ink, Display, Lighting, Logic/Memory, Sensor, OPV, ORFID and Others), Geography - Global Analysis and Forecast (2014 - 2020)
October 21, 2014
Organic electronics, also called as polymer electronics or plastic electronics, is a branch of material science which deals with small conductive molecules and electrically conductive polymers. It is called as organic because small molecules and polymers are carbon based, made using synthetic strategies developed in the context of organic and polymer chemistry. One of the benefits of organic electronics is their low cost as compared to traditional inorganic electronics. The most important areas to focus on for key players are technology innovations and new product developments rather than existing product developments, as striving for product differentiation will boost a player ahead in the race in the current scenario. The focus on industry relations with OEM giants and pure technology solution providers is a key for survival in the organic electronics ecosystem, while relations with the government or private legislative and regulating bodies with a special focus is a must in the organic electronics industry.

ROHM Semiconductor's General-Purpose Automotive MCU System Power Supplies for Idling Stop Systems; Advanced design ensures optimum MCU performance even during cranking
October 21, 2014
ROHM Semiconductorhas recently announced the development of system power supplies optimized for high-performance microcontrollers in a variety of automotive systems, from electronic power steering to fuel injection, including HEVs and EVs.

EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED And Bioengineered Device Production; SmartNIL(TM) large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches
October 21, 2014
 EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms, including mask aligners as well as the industry benchmark EVG®720 and newly available EVG®7200 UV-NIL systems, SmartNIL provides a low-cost, large-area and high-volume-manufacturing solution for a variety of advanced devices, including: Photonic-based devices such as light-emitting diodes (LEDs), lasers and photovoltaics Micro arrays and nano-devices for medical devices and bioengineered applications Advanced storage media, including newly emerging forms of non-volatile memory (NVM)

Synopsys STAR Memory System Multi-Memory Bus Processor Enables 10 Percent Die Size Reduction for Marvell SoC; New Multi-Memory Bus Processor Cuts Test Logic in Half While Maintaining High Performance for Networking SoC
October 21, 2014
Highlights: Marvell achieved silicon success for networking SoC using the multi-memory bus (MMB) processor in the Synopsys DesignWare STAR Memory System for embedded test and repair Reduced area and power with a single MMB processor providing common test and repair logic for all memory instances mapped to a shared bus Decoupled embedded test and repair logic from the performance- and area-critical block under test by placing MMB processor outside the block Achieved high test coverage with comprehensive automated test and repair solution for embedded memory arrays Accelerated test pattern development and silicon bring-up Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Marvell Semiconductor, Inc. used Synopsys'DesignWare® STAR Memory System's new multi-memory bus (MMB) processor to achieve a 10 percent reduction in total die size while maintaining product quality and performance for its networking system-on-chip (SoC). Using the DesignWare STAR Memory System embedded test and repair solution, Marvell accelerated silicon bring-up and achieved silicon success.

TI strengthens DSP and vision processing on its "Jacinto" family of infotainment processors to enhance digital cockpit integration; New "Jacinto 6 EP" and "Jacinto 6 Ex" processors offer extended processing performance while enabling innovation fusion between infotainment and informational ADAS
October 21, 2014
 Today, Texas Instruments (TI) (NASDAQ: TXN) is adding signal processing functionality to its new DRA75x processors to enable customers  to augment infotainment and pair informational advanced driver assistance systems (ADAS) features. The combination of these two will allow customers to produce cars with digital cockpit integration as well as traditional infotainment features without compromising performance. The newDRA75x processors, "Jacinto 6 EP" and "Jacinto 6 Ex", both developed on the same architecture as other "Jacinto" devices, enable automotive manufacturers to scale their investment without additional R&D or significant Bill-of-Material (BOM) increase to deliver a diverse portfolio of products with hardware and software compatibility.

Axcelis 'Purion XE' High Energy System Chosen By Leading Chipmaker In Asia Pacific Region For DRAM Manufacturing; System Will Be Used To Support Major Capacity Expansion
October 21, 2014
 Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a new order for the Company's Purion XE(TM) single wafer, high energy implanter from a prominent chipmaker in the Asia Pacific region. The Purion XE will be used in high volume production of DRAM devices.  The system is scheduled to ship in Q4. 

Actions Semiconductor Debuts Its First 28nm OWL Series Chipset
October 21, 2014
Actions Semiconductor® Co., Ltd. (Nasdaq: ACTS), one of China's leading fabless semiconductor companies that provides comprehensive portable multimedia and mobile internet system-on-a-chip (SoC) solutions for portable consumer electronics, today announced that it debuted its latest innovative 28nm process based quad-core application processor offering for the tablet and OTT set-top box markets at Global Sources' China Sourcing Fair - Electronics & Components held October 11 - 14 at the Asia World-Expo in Hong Kong. The latest application processor is a 28nm process enhancement of its 40nm process twin, the ATM7039, announced in September 2013. Initially, Actions will offer two solutions, the ATM7039s, which is pin to pin compatible with its predecessor, the ATM7039c (40nm version), along with a more compact and efficient version, the ATM7059. Like their predecessor, the ATM7039s and the ATM7059 feature a quad-core ARM® CortexTM A9 CPU, high performance, world-class PowerVR GPU core from Imagination Technologies, 2K by 4K super high resolution decoding including support of the newest international standard - high definition HVEC/H.265 video decoding.

NXP Enables New Era in Cloud Services Security; Securing User Logins Using Secure Elements and FIDO U2F Authentication
October 21, 2014
SAN JOSE, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI), global leader in secure technology and solutions, today announced a strategic deployment of FIDO U2F secure element ICs for accessing consumer cloud services. As posted in its security blog today, Google announced support for FIDO U2F Security Keys for secure sign-in. Amid growing consensus that password-based security needs to be improved, the FIDO U2F ecosystem, consisting of web browsers, applications, hardware authentication devices and authentication servers, offers online users easy, private and secure login to cloud services such as email, shopping, financial and social sites from both their desktop and mobile devices. NXP secure element solution has been a cornerstone technology significantly contributing to the security advantages in the U2F standard.

DSP Group Introduces ULE for IoT Applications Over Intel(R) Puma(TM) 6-Powered Home Gateways; DSP Group's ULE (Ultra Low Energy) Solution Offers Simple Integration With Intel's Puma-Based SoC Delivering Data, Voice and Video Support
October 21, 2014
LOS ALTOS, Calif., Oct. 21, 2014 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, announced today the integration of its ULE-based chipset with home gateways based on Intel's Puma? 6 SoC. The solution uses DSP Group's advanced DECT / ULE SoC integrated with the Intel Puma platform.

October 03, 2014
FULL TEXT Israeli defense minister: Hamas has 20 percent of its weapons stockpile left Hamas has "around 20 percent of its rocket and mortar stockpile left" after Operation Protective Edge Israeli Defense Minister Moshe Ya'alon said Sept. 29. According to Ya'alon, most of the rocket-manufacturing facilities in Gaza were destroyed during the operation, something that will "make it harder for Hamas and Islamic Jihad to return to their course of rearmament as they did after Operation Cast Lead (2008-2009) and Operation Pillar of Defense (2012)." Obama reiterates alliance with Israel, fighting anti-Semitism in Rosh Hashanah message


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