Headlines


Veeco Ion Beam Deposition Technology Reaches Significant Milestone To Support EUV Commercialization Roadmap
September 18, 2014
Thursday, September 18, 2014: Veeco Instruments Inc. (Nasdaq:VECO) announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers. This represents a significant milestone toward the manufacture of semiconductor devices with advanced extreme ultraviolet (EUV) lithography.

MEDIA ALERT: NXP Hosts Roundtable to Discuss Connected Car Security; Leaders in Connected Mobility Meet to Share Ideas, Trends and Insights Into the Future of Connected Vehicles
September 17, 2014
SACRAMENTO, Calif., Sept. 17, 2014 (GLOBE NEWSWIRE) NXP Semiconductors N.V. (Nasdaq:NXPI), working with UC Davis' Institute of Transportation studies and E-Mobility Connection, will host an automobile security round table on Friday, September 19 at the UC Davis West Village in Davis, California. The roundtable will discuss the mounting security concerns around connected vehicles and how some of today's leading manufacturers and industry experts are overcoming these challenges.

Silicon Motion Announces the World's Fastest Single-Channel UHS-II SD Card Controller Solution; SM2704 Enables the Highest Performance and Cost Effective UHS-II SDHC/SDXC Designs
September 17, 2014
Silicon Motion Technology Corporation (NasdaqGS: SIMO) ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the SM2704, the world's fastest single-channel UHS-II SD card controller solution.  The SM2704 supports the highest-level SD card standards: UHS-II bus interface & UHS Speed Class 3 (U3) featuring a maximum data read speed of up to 280MB/s along with a maximum data write speed of up to 260MB/s.  By supporting the new U3 Speed Class, the SM2704 delivers ample performance to handle the needs of professional photography, high-definition video recording and compressed 4K video capture and playback. "Silicon Motion is the number one merchant supplier of UHS-I/II card controllers, which are the majority of our overall SD card controller sales.  The SM2704 extends the company's leadership with the highest performance UHS-II controller while utilizing a cost-effective, single-channel design," said Wallace Kou, President and CEO of Silicon Motion.  "We are pleased to partner with Micron in enabling the world's fastest UHS-II SD cards in the market today."

Linde Boosts Ultra-High Purity Nitrogen Supply to Semiconductor Customers in Oregon, Washington
September 17, 2014
Sept. 17 -- Linde North America issued the following news release: Linde Electronics and Specialty Gases, a division of Linde Gas North America LLC, has completed the capacity expansion to supply ultra-high purity (UHP) gaseous nitrogen and UHP oxygen to its customers in the Hillsboro, Oregon area.

Linde Boosts Ultra-High Purity Nitrogen Supply to Semiconductor Customers in Oregon, Washington
September 17, 2014
Sept. 17 -- Linde North America issued the following news release: Linde Electronics and Specialty Gases, a division of Linde Gas North America LLC, has completed the capacity expansion to supply ultra-high purity (UHP) gaseous nitrogen and UHP oxygen to its customers in the Hillsboro, Oregon area.

Linde Boosts Ultra-High Purity Nitrogen Supply to Semiconductor Customers in Oregon, Washington
September 17, 2014
Sept. 17 -- Linde North America issued the following news release: Linde Electronics and Specialty Gases, a division of Linde Gas North America LLC, has completed the capacity expansion to supply ultra-high purity (UHP) gaseous nitrogen and UHP oxygen to its customers in the Hillsboro, Oregon area.

Montage DDR4 RDIMM and LRDIMM Chipset Validated on Intel(R) Xeon(R) Processor E5-2600 v3 Platforms
September 17, 2014
SHANGHAI, China, Sept. 17, 2014 (GLOBE NEWSWIRE) Montage Technology Group Limited ("Montage") (Nasdaq:MONT), a global fabless provider of analog and mixed-signal semiconductor solutions for the home entertainment and cloud computing markets, today announced the successful validation of its DDR4 RDIMM and LRDIMM chipset on Intel® Xeon® Processor E5-2600 v3 based enterprise server platforms. Montage's DDR4 chipset includes DDR4 Registering Clock Drivers (RCD) and DDR4 Data Buffers (DB) for use on the RDIMMs and LRDIMMs. The RCD and DB are fully compliant with the latest JEDEC DDR4 specifications, which employ innovative memory architectures and technologies to deliver high capacity and energy efficient memory solutions for the compelling data center and cloud computing services. With Montage's DDR4 chipset, consumers will enjoy reduced power consumption and increased data rates over previous generation systems.

18.9% CAGR for Silicon on Insulator Market Globally to 2020 Says a New Research Report Available at RnRMarketResearch.com.
September 17, 2014
  (PRWEB) September 17, 2014       The term 'Silicon on Insulator' was first introduced by IBM in August 1998. The potential benefits from technologies associated with the Silicon on Insulator (SOI) lies in the intersection of multiple capabilities. With new technological inventions and its seamless integration in our day to day lives, it is evident that the Silicon on Insulator concept has already laid down the foundation for a promising future.           Developments in semiconductor devices have necessitated greater performance from silicon-substrate semiconductors. This has led to the development of the Silicon-on-Insulator (SOI) technology, which improves the semiconductor performance by reducing the capacitance between different layers. While the SOI market is expected to show a huge growth due to the increasing demand for semiconductors, there is still a considerable scope for development as SOI is new compared to the silicon substrate semiconductor technology. Complete report is available at http://www.rnrmarketresearch.com/silicon-on-insulator-market-by-technology-besoi-eltran-sos-simox-and-smart-cut-product-optical-soi-soi-transistor-mems-image-sensor-and-memory-devices-application-automotive-computing-market-report.html .             The SOI technology effectively addresses a major concern involved in designing semiconductor devices-reduced power consumption.

Increasing Demand from End-Use Industries Drives the Global Silicon and Ferrosilicon Market, According to New Report by Global Industry Analysts, Inc.SD 3295 Minerals, ground or treatedSD 3339 Primary nonferrous metals, not elsewhere classified
September 17, 2014
  San Jose, California (PRWEB) September 17, 2014         Follow us on LinkedIn – Although silicon and ferrosilicon are manufactured using the same process and are characterized by more or less similar physical properties, they have very diverse applications. While silicon is used in the production of metallurgy metals such as aluminum, chemicals, semiconductors and other products; ferrosilicon mainly finds application in the production of iron, steel and magnesium. Silicon metal is one of the most important inorganic materials used in a range of end-use industries. Valued for its metallic and non-metallic characteristics, silicon is utilized extensively in the primary and secondary aluminum industries and chemical industry. The form of silicon metal utilized in the aluminum and chemical industry is distinctively different, influenced to a large extent by each industry's unique needs and requirements. Ferrosilicon, an alloy of iron and silicon is widely used in molten crude steel as a de-oxidizing agent. It is usually added to steel to enhance its corrosion-resistance and electrical conductivity properties.       Growing GDP rates, rising disposable income levels, recovering economic conditions, and rapid rates of industrialization, urbanization and westernization in developing countries are driving growth in demand for silicon-based products from various end-use industries.

Silicon Mechanics announces ribbon cutting ceremony celebrating award of annual research cluster grant to Wayne State University.
September 17, 2014
  (PRWEB) September 17, 2014       For Immediate Release             SILICON MECHANICS ANNOUNCES RIBBON CUTTING CEREMONY CELEBRATING AWARD OF ANNUAL RESEARCH CLUSTER GRANT TO WAYNE STATE UNIVERSITY       High-performance compute cluster will make research infrastructure even more competitiveSilicon Mechanics, Inc., a leading manufacturer of rackmount servers, storage, and high-performance computing clusters, announces its participation in a ribbon cutting ceremony celebrating Wayne State University's receipt of a high-performance compute cluster as part of Silicon Mechanics' 3rd Annual Research Cluster Grant. The ceremony will be held September 18, 2014 from 11:30-12:30 at Wayne State University (WSU) in the Computing Services Center, 5925 Woodward Avenue. The ceremony will be attended by Wayne State's Associate Vice President and CIO Joe Sawasky; Deputy CIO for Research Patrick Gossman; Dean of the College of Engineering Farshad Fotouhi; and Dean of the College of Liberal Arts and Sciences Wayne Raskind; along with Silicon Mechanics CEO Eva Cherry and Education/Research/Gov't Vertical Group Manager Art Mann.         "We are proud to celebrate with WSU, which stood out in the competitive field of applicants based on the high level of collaboration across departments, as well as the positive impact their research has on faculty, students, and the greater Detroit community," Mann said.


NEW PRODUCTS

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
08/28/2014SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion ...
Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...