Headlines


Canon to Create Semiconductor Lithography System Employing Nanoimprint Technology
February 28, 2015
Canon U.S.A. reported that its parent company, Canon, is developing a next-generation semiconductor lithography system employing nanoimprint technology that makes possible sub-20 nm1 high-resolution processes.

Sen. John McCain Tours Microsemi's Phoenix Facility
February 28, 2015
Microsemi Corp. on February 18 hosted Sen. John McCain, currently chairman of the Senate Committee on Armed Services, at its Phoenix facility. The company said that discussions during the visit addressed the criticality of having a trusted solution resource such as Microsemi when providing products for defense and government programs.

Broadcom Innovation Powers KT 4G LTE Small Cell Deployments; Highly Integrated Devices Enable Korean Operator to Increase Mobile Coverage and Capacity for Outdoor and Indoor Environments
February 27, 2015
 Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that KT Corporation (formerly Korea Telecom), a Korean telecommunications and Internet company, has successfully deployed Broadcom's industry-leading small cell system-on-chip (SoC) devices to enhance its high speed 4G LTE wireless broadband services. KT completed deployment and verification of its Broadcom-enabled small cells for commercial outdoor environments this quarter and plans to expand services to indoor residential locations in the second quarter of 2015. Broadcom will showcase its innovations for the mobile and carrier ecosystem atMobile World Congress in Barcelona, March 2-5. For more news, visit Broadcom'sNewsroom. ABI Research predicts the small cell equipment market to reach $5B by 2018 as carriers and operators increasingly leverage small cells to cost-effectively support growth in cellular data traffic1. Broadcom's 617XX chipset is extending its 3G leadership to be first to market with LTE multimode advanced small cell SOC's for enterprise and residential deployments. Broadcom's installed base of small cell solutions exceeds two million live deployments.

Kansas: Semiconductor Equipment Tech, Diffusion/Implant/Metals OR Plating/Bump/Wafer Level or AMAT&thin film
February 27, 2015
National Defense Industrial Association, The State of Kansas has issued the following Job Vacancy: Job Summary Company A New Beginning-Genes​is 2 Location Multiple locations Industries Electronics, Components, and Semiconductor Mfg Job Type Full Time Employee Years of Experience 2+​ to 5 Years Education Level High School or equivalent Career Level Experienced (Non-Manager) Salary 0.​00 - 70,000.​00 $ /​year bonuses, health bennies, perks, 401k, etc Semiconductor Equipment Tech, Diffusion/Implant/Metals OR Plating/Bump/Wafer Level or AMAT&thin film About the Job

Samsung, Merck tie up for new chip materials
February 27, 2015
Samsung Electronics is teaming with Merck of Germany to develop cost-effective, next-generation materials for semiconductor equipment. Merck said new imaging materials could enable major semiconductor makers to develop advanced integrated circuits and microelectronic technologies, many of which could be used in consumer electronic devices such as smartphones.

Kansas: Product Engineer, device physics & silicon wafer processing or EPI Process Engineer epitaxial
February 26, 2015
National Defense Industrial Association, The State of Kansas has issued the following Job Vacancy: Job Summary Company A New Beginning-Genes​is 2 Location Multiple locations Industries Electronics, Components, and Semiconductor Mfg Job Type Full Time Employee Years of Experience 2+​ to 5 Years Education Level Bachelor's Degree Career Level Experienced (Non-Manager) Salary 0.​00 - 85,000.​00 $ /​year bonuses, bennies, perks, etc Product Engineer, device physics & silicon wafer processing or EPI Process Engineer epitaxial About the Job

FORM 8-K: ON SEMICONDUCTOR CORP FILES Current report
February 26, 2015
ON SEMICONDUCTOR CORP, Delaware, has filed FORM 8-K (Current report) with Securities and Exchange Commission on February 26, 2015 State or other Jurisdiction of Incorporation: Delaware

ASML Announces New High Mark for EUV Productivity; TSMC Images More Than 1000 Wafers in a Single Day
February 26, 2015
Asml has issued the following news release: ASML Holding N.V. (ASML) today confirms that its customer, Taiwan Semiconductor Manufacturing Company Limited (TSMC) has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step towards insertion of EUV lithography in volume production of semiconductors.

Rating Action: Moody's rates Lattice's new Senior Secured debt and CFR at Ba3; outlook stable
February 26, 2015
Moody's Investors Service has issued the following press release: Moody's Investors Service, ("Moody's"), assigned ratings to Lattice Semiconductor Corp. ("Lattice") -- Corporate Family Rating ("CFR") of Ba3, Probability of Default Rating of Ba3-PD, and Senior Secured Term Loan rating of Ba3 (LGD3). The rating outlook is stable. Lattice will use the proceeds of the $350 million Senior Secured Term Loan and balance sheet cash of both Lattice and Silicon Image, Inc ("Silicon Image") to fund the acquisition of Silicon Image for about $603 million plus about $28 million of transaction fees.

TriQuint Continues DoD's Trusted Source Status Through 2016
February 01, 2015
FULL TEXT TriQuint Semiconductor Inc. (now Qorvo) announced it has earned continued Trusted Source Category 1A accreditation through 2016 from the Department of Defense (DoD). According to the certification, the accreditation of trust expresses the confidence of the DoD Defense Microelectronics Activity (DMEA) and the National Security Agency's Trusted Access Program Office (TAPO) that TriQuint will continue to deliver trusted foundry microelectronic goods and services (category' 1 A), which meet the mission critical needs of end users, now and into the future.


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