Headlines


New Technology Could Cut Costs of Night Vision, Thermal Imaging
March 05, 2015
The University of Texas-Dallas issued the following news release: Engineers at The University of Texas at Dallas have created semiconductor technology that could make night vision and thermal imaging affordable for everyday use.

Strasbaugh and netMercury Team Up to Better Serve Texas, Idaho and the Four Corner States
March 04, 2015
Strasbaugh (OTC: STRB) is pleased to announce that on February 11th 2015, an agreement was signed with netMercury, making them an official representative of Strasbaugh's CMP and wafer grinding products in Texas, Idaho and the four corners region of the United States.

Amkor Technology Receives Intel's Preferred Quality Supplier Award
March 04, 2015
Amkor Technology, Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, today announced that it has been recognized as one of 19 companies receiving Intel Corporation's Preferred Quality Supplier (PQS) award for their performance in 2014. Amkor has demonstrated industry-leading commitment across all critical focus areas on which we are measured: quality, cost, availability, technology, customer service, labor and ethics systems and environmental sustainability. Amkor was recognized for its significant contributions in providing Intel with wafer probe, wafer bump, assembly, and final testing services that were deemed essential to Intel's success.

China Silicon Carbide Industry Report, 2014-2017
March 04, 2015
As a major producer and exporter of silicon carbide, China contributes about 80% to the global silicon carbide capacity. In 2013, China exported 286,800 tons of silicon carbide after the abolition of the export quota system, up 73.8% year on year. From January to November of 2014, China's silicon carbide export volume amounted to 289,800 tons.

European ADRs Register Two-Week Low
March 04, 2015
American depository receipts of European stocks hit a two week low on Wednesday, trading 0.9% lower at 142.15 on the Bank of New York Mellon Europe ADR Index.

Intel Honors 21 Companies with Preferred Quality Supplier and Achievement Awards
March 04, 2015
Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement. These companies achieve PQS status by demonstrating industry-leading commitment across all key performance focus areas: quality, cost, availability, technology, customer service, labor and ethics systems, and environmental sustainability. In addition to the PQS award, Intel recognized two suppliers with the Supplier Achievement Award, which is a focused recognition for extraordinary accomplishments in one or more key performance areas.This year's winners were acknowledged for exceptional results delivering leading-edge technology solutions and excellence in product availability to meet Intel's evolving needs as an industry leader. The 2014 PQS and Achievement winners will be honored at a ceremony tonight in Santa Clara, California.

Wireless Communications Breakthrough at Chalmers University Uses Multiple Technologies from Teledyne; Microwave Electronics Lab at Chalmers University of Technology Achieves D-Band 44Gbps Transmission Rate with Teledyne High Speed Semiconductor Process and High Bandwidth Oscilloscope
March 04, 2015
Teledyne Scientific & Imaging and Teledyne LeCroy today announced that researchers at the Microwave Electronics Lab at Chalmers University of Technology in Sweden have reached record-breaking signal transmission speeds of D-band wireless communication. The experiment was conducted using a Tx/Rx chipset developed by researchers at Chalmers University, using Teledyne Scientific's high performance Indium Phosphide (InP)-based double heterojunction bipolar transistor technology (DHBT) and the Teledyne LeCroy LabMaster 10 Zi oscilloscope. A data rate of 44Gbps was achieved, doubling the previous record. Advances in wireless transmission further reduce the need for long cables, and enable the delivery of high-resolution video to users without the delays inherent to wired networks. Results of the experiment were published at the 2014 IEEE Compound Semiconductor IC Symposium.

Silvaco Strengthens Leadership Team With Appointment of Seasoned Management Executives to Support Growth Strategy
March 04, 2015
Silvaco, Inc. (Silvaco) today announced key senior management appointments to its executive leadership team:  --  David L. Dutton - Chief Executive Officer (CEO) --  Thomas Sher - Vice President (VP) of Finance --  Stanley Jones - Director of Human Resources (HR) As CEO, Dutton will lead the company's strategic direction and drive the development and execution of its new growth strategies. As VP of Finance, Sher will manage and strengthen Silvaco's global financial organization. As HR Director, Jones is chartered with developing a dynamic people strategy framework that optimizes Silvaco's employee talent and corporate culture. Both Sher and Jones will report directly to Dutton, who reports to Iliya Pesic, Silvaco's Executive Chairman of the Board.

Teledyne DALSA to Present Complete Portfolio of Low Dose CMOS X-Ray Detectors at IDS 2015; New Xineos(TM) X-ray detectors deliver best in class low dose image quality
March 04, 2015
Editors Note: There is a photo associated with this press release. Teledyne DALSA (NYSE:TDY), a Teledyne Technologies company and global leader in digital X-Ray image sensing technology, will showcase its low dose, CMOS digital X-Ray detectors at the upcoming 36th International Dental Show (IDS). The fair will be held March 10-14 at the Kolnmesse in Cologne, Germany. Teledyne DALSA will be located in Hall 2.2 Stand B59. New Xineos models, including the 1511, 1501 and 2301 utilize Teledyne DALSA's sixth generation radiation-hard CMOS active pixel design with active areas of 15x11cm, 152x7mm, and 228x7mm respectively. Offering switchable saturation dose, low dissipation power and built-in gain, offset and defect correction, Xineos detectors are versatile, reliable and easy to integrate.

NXP's MIFARE DESFire Drives Smart Mobility in Barcelona; Full Interoperability and Additional Service Possibilities Offered With New T-Mobilitat Card
March 04, 2015
EINDHOVEN, Netherlands, March 4, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI) today announced that the Barcelona Metropolitan Transport Authority (ATM) will use MIFARE® DESFire® for their new mobility card, T-Mobilitat. Barcelona's long-term ambition to become a self-sufficient and innovative city through progressive urban transformation is one step closer with the new T-Mobilitat card, which will provide over 5.7 million inhabitants of the city with easy access to public transportation. NXP's MIFARE DESFire contactless solutions support this vision, delivering smart mobility services to more than 70 public transport operators in and around the Spanish city. The new T-Mobilitat mobility card from ATM will eventually replace all the old magnetic machinery and over 70 public transport integrated fares that coexist today. The card, which will be fully interoperable with all public transport operators in Barcelona, will greatly simplify travel across the city and foster greater efficiencies in the transportation network. First trials of T-Mobilitat are expected later this year.


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