Lenovo Selects PMC 12Gb/s SAS Storage Solution for ThinkServer Portfolio; Adaptec by PMC Host Bus Adapter Provides High-Density External Connectivity for Storage Expansion
November 24, 2014
PMC-Sierra, Inc. (PMC®) (Nasdaq:PMCS), the semiconductor and software solutions innovator transforming networks that connect, move and store big data, today announced that Lenovo has selected PMC storage solutions for external connectivity across its ThinkServer portfolio . The Lenovo 8885E by PMC card delivers the full throughput of 12Gb/s SAS and 6.6GB/s PCI Express® 3.0 to maximize the performance of ThinkServer scale-out storage. The card will be offered on Lenovo rack and tower servers.

Market Chatter: ASML Holding Expects Sales To Double To $12B By 2018-2020, Shares Fall
November 24, 2014
ASML Holding (ASML) reportedly told an investor conference it could nearly double sales to $12 billion by 2018, but the goal could slip to 2020 if its customers delayed their buying decisions. Shares fell.

Programmable Op-Amp from Diodes Incorporated Brings Power/Performance Flexibility
November 24, 2014
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced its own variant of the TLC271 programmable op-amp. The part offers a bias-select mode, enabling closer matching of power dissipation and AC performance with the specific requirements of battery-powered consumer and industrial products.

BitFury Adds Long-Time Silicon Valley Executive and Entrepreneur Young Sohn to Its Strategic Advisory Board
November 24, 2014
BitFury Group, the leading Bitcoin infrastructure provider and Bitcoin transaction processing company has added Young Sohn, Samsung Electronics president and chief strategy officer, to its strategic advisory board. Young Sohn has served as the president and chief strategy officer for Samsung Electronics since 2012.

RF Micro Devices And TriQuint Semiconductor Announce Closing Date For Merger
November 24, 2014
 RF Micro Devices, Inc. (Nasdaq: RFMD) and TriQuint Semiconductor, Inc. (Nasdaq: TQNT) today announced the two companies have received all necessary shareholder and regulatory approvals to move forward with their previously announced merger of equals and have set Wednesday, December 31, 2014, as the anticipated closing date for the transaction. Trading in the common stock of the new combined company, Qorvo, Inc., is expected to commence on the NASDAQ Global Select Market on January 2, 2015, under the stock ticker symbol "QRVO."  TriQuint shareholders will receive 1.675 shares of Qorvo and RFMD shareholders will receive 1 share of Qorvo for each TriQuint or RFMD share held. At the closing of the transaction, the Company will execute a one-for-four reverse stock split.

Lattice's MachXO3L(TM) Family Named One of the 2014 Hot 100 Products by UBM Canon's EDN
November 24, 2014
Lattice Semiconductor Corporation (NASDAQ: LSCC), the leader in ultra-low power, small form factor, customizable solutions, today announced that its MachXO3L(TM) FPGA family has been chosen by EDN as one of the "100 Hot Products of 2014." The 2014 EDN Hot 100 highlights the electronics industry's most significant products of the year based on innovation, significance, usefulness and popularity. The MachXO3L family is the world's most advanced programmable platform for expanding system capabilities and bridging emerging connectivity interfaces using both parallel and serial I/O, in packages as small as 2.5 mm x 2.5 mm. MachXO3L devices combine small-footprint packaging with on-chip resources to simplify the implementation of emerging connectivity interfaces - such as MIPI®, CSI and DSI - as well as robust control and connectivity interfaces, including SPI and I2C hard IP. By using advanced package technology to eliminate bond wires and enable lowest-cost and increased I/O density in a small footprint, the MachXO3L family can be used in multiple market segments, including consumer, communications, compute, storage, industrial and automotive.

TowerJazz to Present at the LD Micro Conference in Los Angeles
November 24, 2014
TowerJazz (NASDAQ: TSEM), the global specialty foundry leader, today announced that its Chief Executive Officer, Mr. Russell Ellwanger, will present at the LD Micro Conference on December 2, 2014.

SPTS Technologies' Versalis fxP Multi-Technology System Selected by Mapper Lithography for New Russian Fab; SPTS' Etch and PECVD Process Solutions Key to Production of E-Beam Lenses for Maskless Lithography
November 24, 2014
SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that Mapper Lithography has selected SPTS' etch and low temperature chemical vapor deposition (CVD) systems on a Versalis fxP multi-technology platform for their new fab in Moscow. Mapper will use SPTS' deep reactive ion etch (DRIE) module to create through silicon via holes with high dimensional accuracy, a critical and essential requirement in the production of electron beam (e-beam) lenses for their groundbreaking maskless lithography technology. Mapper also selected SPTS' plasma enhanced CVD system (PECVD) because it allows for a lower deposition temperature than competing systems, enabling a novel integration scheme.

EE Times-China survey indicates rapid advancement in mainland China's fabless industry; With use of 28nm or below process technologies for digital ICs quadrupling YOY
November 24, 2014
EE Times-China, a leading electronic engineering title ofGlobal Sources' (NASDAQ: GSOL) joint venture subsidiary, eMedia Asia Limited, has revealed the results of its 13th annual China IC Design Survey and seventh IC Design Awards. Survey findings show marked improvement in the fabless industry's design capability: 29 percent of respondent companies utilize cutting-edge 28nm or below process technologies for digital IC designs, more than quadrupling from 7 percent in 2013. For analog and mixed-signal ICs, the use of sophisticated 0.18μm or below technologies has also increased substantially to 51 and 60 percent, respectively (2013: 44 and 43 percent, respectively). Brandon Smith, Publisher of EE Times-China, said: "The semiconductor industry is a strategic sector supported by the Chinese government, and we have seen continual growth in the scale of local fabless companies. In this year's Survey, 34 percent reported annual sales of more than US$50 million, a welcomed increase from 22 percent last year. The average workforce has also substantially expanded from 194 to 263, and the number of IC designers from 109 to 160. While the typical fabless still lags behind the world's top players in scale, the leading mainland China IC design companies already see annual sales of more than US$1 billion."

GIGAPHOTON Starts Providing New Function "eTGM" That Enables 50% Reduction of Neon Gas Consumption for ArF Immersion Laser Users; Gigaphoton Takes an Immediate Measure Against Supply Uncertainty of Neon Gas with New "eTGM" Function, Released This August to Support The Industry;
November 24, 2014
Gigaphoton Inc. , a major lithography light source manufacturer, today announces the provision of a new function, called "eTGM (eco-Total Gas Management)," for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time (*1). Today, ArF immersion lasers used for leading-edge semiconductor fabrication utilize a mixture of neon, fluorine, and argon gases as a laser gas, with neon gas accounting for more than 96% of the laser gas mixture. Therefore, a fairly large amount of neon gas is consumed to run ArF immersion lasers. However, on top of a recent reduction in supply of neon gas, political uncertainty in Ukraine, one of major Ne production countries, and flooding in Odessa Oblast this Septemberhave currently limited the supply of this rare gas, leading to a rise in its price. (*2) This may cause a critical challenge to its major user, the world semiconductor industry.


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