Headlines


Lattice Semiconductor unveils USB 3.1 Type-C power delivery solution
September 16, 2014
HIGHLIGHT: Lattice Semiconductor Corporation has unveiled a USB 3.1 Type-C power delivery solution that enables manufacturers to develop USB 3.1 Type-C connectors.

ON Semiconductor launches new KAI-08670 Image Sensor
September 16, 2014
HIGHLIGHT: ON Semiconductor has announced the launch of new KAI-08670 Image Sensor, an 8.6-megapixel CCD in an APS-H optical format.

IQE PLC Iqe Plc : Continued Growth In Underlying -7-
September 16, 2014
 Finance leases due within one year           (790)        (770)        (802) Total borrowings                          (39,717)     (41,544)     (37,609) Net debt                                  (35,487)     (37,659)     (34,351)As At        As At        As At 9 PROVISIONS FOR OTHER LIABILITIES AND CHARGES                            30 Jun 2014  30 Jun 2013  31 Dec 2013(All figures GBP'000s)                  Unaudited    Unaudited     AuditedAs at 1 January                             -            -            - Charged/(Credited) to the income statement                                   6,652            -            - Utilised during the period                       -            -            - Foreign exchange                             (273)            -            - As at 30 June / 31 December                  6,379            -            -

IQE PLC Iqe Plc : Continued Growth In Underlying -2-
September 16, 2014
Therefore, in order to help readers assess the Group's underlying performance, we have provided details of these items in note 5. First half revenues reduced by 17% to GBP52.0m (H1 2013: GBP63.0m) which primarily reflect the impact on the group of an industry-wide inventory reduction of approximately GBP8.5m and the translational impact of a strong sterling to US dollar exchange rate which accounts for approximately GBP4.2m of the shortfall. Despite lower revenues, adjusted profit before tax increased by 11% from GBP5.1m to GBP5.6m, which includes the benefit of cost reductions realised from our restructuring programme. This restructuring is now largely complete and is expected to deliver further recurring savings from H2. After exceptional charges, the group incurred a loss before tax of GBP2.3m. As set out in note 5, the cash impact of the non-recurring exceptional charges was GBP3.1m during the period.

IQE PLC Iqe Plc : Continued Growth In Underlying Earnings Despite Customer Inventory De-stocking. Good Progress With
September 16, 2014
Cardiff, UK. 16 September 2014: IQE plc (AIM: IQE, "IQE" or the "Group"), the leading global supplier of advanced wafer products and wafer services to the semiconductor industry, announces its half year results for the six months to 30 June 2014. FINANCIAL HIGHLIGHTS -- EBITDA up 6% to GBP11.1m (H1 2013: GBP10.5m) -- Revenues down 17% to GBP52.0m (H1 2013: GBP63.0m) reflecting inventory de-stocking and strength of sterling

Orange selects IDT's RapidIO interconnect switches and bridges
September 12, 2014
HIGHLIGHT: Integrated Device Technology, Inc., or IDT, which designs, develops, manufactures and markets semiconductor solutions, has announced that Orange Silicon Valley has selected IDT's x86 compute cluster and 20Gbps RapidIO interconnect switches and bridges as the processing platform to execute analytics on social media traffic during the FIFA World Cup finals.

MStar integrates STB SoC solution with Irdeto's FlexiCore Processing technology
September 11, 2014
HIGHLIGHT: MStar Semiconductor, Inc. has announced that its new set-top box system-on-chip, or STB SoC, solution is integrated with Irdeto's Media Protection suite, its new FlexiCore Processing technology.

Toshiba and SanDisk provide update on NAND project
September 10, 2014
HIGHLIGHT: Toshiba Corporation and SanDisk Corporation have opened the second phase of the No. 5 semiconductor fabrication facility, or Fab 5, and the start of construction of the new No. 2 fabrication facility, or Fab 2, at Yokkaichi Operations, Toshiba's NAND Flash memory plant in Mie prefecture, Japan.

Inventek Systems Announces Distribution Agreement with Macnica Americas, Inc.
September 10, 2014
  Billerica, MA (PRWEB) September 10, 2014     Inventek Systems, a USA-based, full-service modular solutions provider focused on WiFi, Bluetooth (BT), Bluetooth Low Energy (BTLE), Near Field Communications (NFC), GPS, combo-radios, Broadcom WICED platforms and antennas for embedded connectivity & IoT-ready applications, has signed a distribution agreement with Macnica Americas, a fully franchised semiconductor distributor covering North America with expertise in design services, IP, applications support, and logistics. Macnica Americas is a division of Macnica Inc., a $2.4B global leader in semiconductor distribution and design services.         Inventek's expertise in modular connectivity solutions firmly positions the company as the premier leader in market competitive wireless systems across a wide range of market segments including the consumer, industrial, embedded, medical & military segments.     Al Serpa, CMO & Co-Founder at Inventek Systems, stated that, "the partnership with Macnica Americas will enable Inventek to leverage one of the most technical organizations available in distribution. The combination of Macnica's applications-engineering expertise and Inventek's connectivity portfolio will enable customers to seamlessly ramp their platforms to market with cost effective, leading-edge technology, services and support."           "We are pleased to be able to offer Inventek wireless products to our customers," said John Burton, President of Macnica Americas.

Global and China IC Advanced Packaging Industry Report 2013-2014brbr
August 16, 2014
During 2011-2013 the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized thus leading to a dramatic decline in unit prices these packaging technologies including FC-BGA WLCSP QFN SiP and PoP etc.


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