Headlines


FORM 8-K: PEREGRINE SEMICONDUCTOR FILES CURRENT REPORT
November 21, 2014
WASHINGTON, Nov. 21 -- Peregrine Semiconductor Corp., San Diego, files Form 8-K (current report) with Securities and Exchange Commission on Nov. 20. State or other jurisdiction of incorporation: Delaware

Gate Driver Board and SPICE Models for Silicon Carbide Junction Transistors (SJT) Released
November 21, 2014
Dulles, VA, November 21, 2014 --(PR.com)-- GeneSiC Semiconductor, a pioneer and global supplier of a broad range of Silicon Carbide (SiC) power semiconductors today announces the immediate availability of Gate Driver evaluation board and has expanded its design support for the industry's lowest loss switches - the SiC Junction Transistor (SJT) - with a fully-qualified LTSPICE IV model. Using the new Gate Driver Board, power conversion circuit designers can verify the benefits of sub-15 nanosecond, temperature independent switching characteristics of SiC Junction Transistors, with low driver power losses. Incorporating the new SPICE models, circuit designers can easily evaluate the benefits GeneSiC's SJTs provide for achieving a higher level of efficiency than is possible with conventional silicon power switching devices for comparably-rated devices.

UCT Announces New 3D Printing Services Starting Q1, 2015; The 3D Printing Center will be based in Singapore and will service UCT customers worldwide
November 21, 2014
Ultra Clean Holdings, Inc. (Nasdaq: UCTT), a leading developer and supplier of critical systems and subsystems for the semiconductor capital equipment, flat panel, medical, energy and research industries, today announced the launch of its 3D Printing services through the acquisition of privately held Prototype Asia LLC and the opening of its Additive Manufacturing Center in Singapore.

UCT Announces New 3D Printing Services Starting Q1, 2015; The 3D Printing Center will be based in Singapore and will service UCT customers worldwide
November 21, 2014
Ultra Clean Holdings, Inc. (Nasdaq: UCTT), a leading developer and supplier of critical systems and subsystems for the semiconductor capital equipment, flat panel, medical, energy and research industries, today announced the launch of its 3D Printing services through the acquisition of privately held Prototype Asia LLC and the opening of its Additive Manufacturing Center in Singapore.

Amtech Obtains Repeat Order from US based Mission Solar Energy for its High Efficiency n-type Bifacial Cell Line
November 20, 2014
 Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced its subsidiary, Tempress Systems, has received a multi-million dollar order (in the low teens) for its solar equipment, including PECVD, to be used in the second phase of Mission Solar Energy's cell production line implementing next generation, high efficiency n-type bifacial cell technology. These units are expected to ship within the next six months. Mr. Fokko Pentinga, Chief Executive Officer of Amtech, commented, "Our innovative technology solutions are clearly bringing value to our customers. We are pleased to announce this repeat order for our world class production systems. The order includes our PECVD system, an important strategic product we developed during the solar down cycle to aggressively support the solar growth opportunity during the next recovery cycle and provides us the opportunity to double the size of our served available market. Our ongoing objective is to bring technology solutions to the market to increase cell efficiency at lower cost."  

ASE's Subsidiary USI Completes Capital Increase by Way of Domestic Private Placements in the PRC Capital Market
November 20, 2014
Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) ("ASE", or the "Company") announced today that its subsidiary Universal Scientific Industrial (Shanghai) Co., Ltd. ("USI")(SSE: 601231), which is responsible for electronics design and design manufacture service ("DMS"), completed its capital increase by way of domestic private placements through a bidding process on November 20, 2014, raising a total of RMB2.06 billion (approximately NTD10.43 billion).  The proceeds from this offering will be used to fund the production of wireless modules and wearable miniature modules.  USI's offering received overwhelming response from investors in the PRC capital markets.  The issue price per share was RMB27.06 (1.5 times the minimum issue price of RMB17.86).  After the offering, ASE's holdings in USI decreased by 6.18% from 88.30% to 82.12%.

X-FAB MEMS Foundry Wins "Foundry of the Year" Award at MEMS Executive Congress; Honored for Best in MEMS and Sensors Innovation; Named Runner-Up for "MEMS Supplier of the Year" Award
November 20, 2014
X-FAB MEMS Foundry today announced it received the "MEMS Foundry of the Year" award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group's 10th annual MEMS Executive Congress® held in Scottsdale, Arizona last week. X-FAB MEMS Foundry was chosen from among five finalists in an open voting process; it also was named runner-up in the "MEMS Supplier of the Year" category. The MEMS Industry Group is a trade association that advances MEMS and sensors across global markets.

North American Semiconductor Equipment Industry Posts October 2014 Book-to-Bill Ratio of 0.93
November 20, 2014
The Semiconductor Equipment and Materials International issued the following news release: North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 0.93 means that $93 worth of orders were received for every $100 of product billed for the month.

United States : SanDisk Expands its Commitment to the Connected Device Market with a Strategic Investment in Altair Semiconductor
November 20, 2014
SanDisk Corporation, a global leader in flash storage solutions, today announced that the company s venture arm, SanDisk Ventures, has invested in Altair Semiconductor, the leading developer of high-performance, single-mode LTE chipsets. Altair s high-performance products bring 4G LTE Internet connectivity to tablets, netbooks, USB dongles, portable hotspots, fixed routers and modems, machine-to-machine applications and other devices.

Japan : Renesas Electronics Delivers Productivity Boost in Industrial Applications with the RZ/T1 Real-Time Processor Solution
November 20, 2014
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the RZ/T1 Group, a new factory automation solution with built-in industrial network functionality for use in many industrial applications such as AC servo drives, motion controllers, inverter control and general industrial equipment that require high speed, responsiveness, and excellent real-time performance.


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