Nanometrics Announces Upcoming Investor Events
November 19, 2014
MILPITAS, Calif., Nov. 19, 2014 (GLOBE NEWSWIRE) -- Nanometrics Incorporated (Nasdaq:NANO), a leading provider of advanced process control metrology and inspection systems, today announced their participation in the following investor events:

Silicon Labs Migrates to FrontRange's HEAT Service Management in the Cloud; Industry Leading Producer of High-Performance Semiconductors Chooses FrontRange to Support Mobile-Friendly Service Desk Solution
November 19, 2014
FrontRange ,the Hybrid Service Management software company, today announced that Silicon Labs , a leading provider of silicon, software and system solutions for the Internet of Things, Internet infrastructure, industrial control, consumer and automotive markets, has migrated to the latest version of HEAT Service Management in the cloud. Silicon Labs, a longtime user of FrontRange's HEAT Help Desk solution, wanted a mobile-friendly service desk solution to support its BYOD policy that allows its workforce to access key applications from their mobile devices, including service desk apps. "Silicon Labs is moving to a BYOD strategy, so all services must be available from mobile devices," says Michael Skinner, systems administrator at Silicon Labs. "As part of our BYOD initiative, deploying HEAT Service Management in the cloud was very attractive."

OR'ing Controller from Diodes Incorporated Raises UPS Reliability
November 19, 2014
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced the ZXGD3108N8 controller. This 40V-rated active OR'ing controller helps increase the reliability of uninterruptible power supplies (UPS) in telecom, data centers and server duties. The ZXGD3108N8 is designed to fully enhance very low RDS(ON) power MOSFETs, enabling lossy Schottky blocking diodes to be replaced and resulting in lowered operating temperature and increased UPS system integrity.

PDSTI Completes Acquisition of Montage
November 19, 2014
SHANGHAI, China, Nov. 19, 2014 (GLOBE NEWSWIRE) -- Montage Technology Group Limited (Nasdaq:MONT) ("Montage" or the "Company"), a global fabless provider of analog and mixed-signal semiconductor solutions addressing the home entertainment and cloud computing markets, today announced that Montage Technology Global Holdings, Ltd., an entity jointly formed by Shanghai Pudong Science and Technology Investment Co., Ltd. ("PDSTI") and China Electronics Investment Holdings Limited ("CEC Investment"), has completed its acquisition of the Company. The merger values Montage's equity at approximately US$693 million, on a fully diluted basis. Montage's shareholders approved the transaction at a meeting of the Company's shareholders on July 31, 2014 and all of the other conditions to the completion of the transaction have been satisfied or waived.

SanDisk Expands its Commitment to the 'Connected Device' Market with a Strategic Investment in Altair Semiconductor; SanDisk Ventures Invests in the Leading Developer of High-Performance, Single-Mode LTE Chipsets
November 19, 2014
SanDisk Corporation (NASDAQ: SNDK ), a global leader in flash storage solutions, today announced that the company's venture arm, SanDisk Ventures , has invested in Altair Semiconductor , the leading developer of high-performance, single-mode LTE chipsets. Altair's high-performance products bring 4G LTE Internet connectivity to tablets, netbooks, USB dongles, portable hotspots, fixed routers and modems, machine-to-machine applications and other devices. SanDisk's investments through SanDisk Ventures enable the company to expand the possibilities of storage by advancing technologies and trends that are shaping the way that data is captured, stored, shared and managed.

Carbonics Revolutionizing Wireless Technology by Employing Carbon Nanomaterials to Improve Power Consumption and Performance; Startup Backed by $5.5 Million Investment, Leveraging Carbon Research Conducted at UCLA and USC
November 19, 2014
Carbonics, Inc. , aims to revolutionize traditional electronics by employing earth-abundant carbon nanomaterials to vastly improve the power consumption and performance of wireless products that include next-generation smartphone and wearable devices.

Hybrid Memory Cube Consortium Advances Hybrid Memory Cube Performance and Industry Adoption With Release of New Specification
November 19, 2014
SAN JOSE, Calif. and BOISE, Idaho, Nov. 19, 2014 (GLOBE NEWSWIRE) -- The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

BinOptics to be acquired by M/A-COM Technology
November 19, 2014
BinOptics Corporation, a provider of indium phosphide lasers for data centers, mobile backhaul, silicon photonics and access networks, has entered into a definitive agreement to be acquired by M/A-COM Technology Solutions Holdings, Inc. (Macom), a provider of analog semiconductor solutions, in an all-cash transaction valued at $230 million. Both the companies are based in the US. BinOptics is backed by Advantage Capital Partners, Arrowpath Venture Partners, Cayuga Venture Fund, Draper Fisher Jurvetson, FA Technology Ventures, Gefinor Ventures, Onondaga Venture Capital Fund, LLC, Rand Capital Corporation and STIC Investments, Inc. MACOM expects to fund the purchase price of the acquisition from a combination of cash on hand and incurrence of additional indebtedness from its existing $100 million revolving credit facility. Goldman, Sachs & Co. is acting as financial advisor and Perkins Coie LLP is acting as legal advisor to Macom. Raymond James & Associates, Inc. is acting as financial advisor and Bond Schoeneck & King, PLLC is acting as legal advisor to BinOptics. The transaction is expected to be complete by the end of 2015.

STMicroelectronics Supports Drive for Inverters in Smaller Boxes Everywhere, from PHEV Battery Chargers to Solar Generators; New silicon-carbide (SiC) diodes with increased surge-versus-normal current rating is well-suited for Little Box Challenge
November 18, 2014
GENEVA, Switzerland, Nov. 18, 2014 (GLOBE NEWSWIRE) -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top-ranking supplier of power components, has revealed new automotive-qualified silicon-carbide (SiC) diodes for advanced on-board battery chargers (OBCs) in electric vehicles such as Plug-in Hybrids (PHEVs) that demand high power-handing capability within a confined space. These diodes allow designers to build smaller power modules, which is good for automotive applications and makes them also a strong choice for tackling the Little Box Challenge presented by Google and IEEE. ST is a device-manufacturer partner of this new $1 million competition to design kW-scale inverters that are more than ten-times smaller than today's inverters for various applications, particularly solar micro-generators.

Champing Chatpata chips!
November 16, 2014
Munchable crunchies. The Indian potato has never had it so good in the food processing sector. It is all set to lord over the Indian retail shelves in numerous avatars, which are growing by the minute. From the ubiquitous many-flavoured potato chips and French fries, the companies are moving to potato snacks in other forms.


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