December 17, 2014
WASHINGTON, Dec. 17 -- Peregrine Semiconductor Corp., San Diego, files Form 8-K (current report) with Securities and Exchange Commission on Dec. 15. State or other jurisdiction of incorporation: Delaware Item 1.02. Termination of a Material Definitive Agreement On December 11, 2014, Peregrine Semiconductor Corporation, a Delaware corporation ("Peregrine") terminated its Second Amended and Restated Loan and Security Agreement, dated as of June 30, 2010, between Silicon Valley Bank and Peregrine (together with all amendments and ancillary and/or related documents thereto, the "Loan and Security Agreement"). There were no outstanding obligations under the Loan and Security Agreement. Item 2.01. Completion of Acquisition or Disposition of Assets On December 12, 2014, Peregrine completed its previously announced merger (the "Merger") pursuant to the Agreement and Plan of Merger, dated as of August 22, 2014 (the "Merger Agreement") by and among Murata Electronics North America, Inc., a Texas corporation ("Murata"), PJ Falcon Acquisition Company, Limited, a Delaware corporation and a wholly-owned subsidiary of Murata ("Merger Sub") and Peregrine. Pursuant to the terms of the Merger Agreement, Merger Sub merged with and into Peregrine, with Peregrine surviving the Merger as a wholly-owned subsidiary of Murata.

Power Integrations Launches New Reference Design for High-Power LED-Lighting Applications; Innovative design drastically shrinks component count, improving efficiency, size and reliability of LED streetlights and high-bay lighting
December 16, 2014
Power Integrations (Nasdaq: POWI ), the leader in high-efficiency, high-reliability LED-driver ICs, today announced a new reference design for LED streetlights, high-bay lights and other high-power LED-lighting applications. The new design, RDR-382 , describes a constant current, 43 V (nominal), 150 W reference power supply for 90-265 VAC solid-state lighting, utilizing Power Integrations HiperPFS(TM)-2 PFC controller ICsand HiperLCS(TM) integrated LLC power stageICs. Power Integrations Launches New Reference Design for High-Power LED-Lighting Applications. (Photo: Business Wire)

Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES
December 16, 2014
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology. The agreement provides for the transfer of Amkor's copper pillar wafer bump technology to GLOBALFOUNDRIES and a license under Amkor's intellectual property to enable GLOBALFOUNDRIES to bump wafers based on this technology.

Chip-Scale Bi-Directional MOSFETs from Diodes Incorporated Save Space to Enable Higher Capacity Lithium Batteries
December 16, 2014
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today introduced chip-scale bi-directional MOSFETs. The DMN2023UCB4 provides superior protection for charging 1- and 2-cell lithium batteries. Its low on-state resistance reduces power loss while its thin chip-scale packaging allows designers to use the space saved to increase battery capacity. Target end-markets include smartphones, tablets, cameras, portable media players, and similar consumer products where size, weight and battery life are all key performance factors.

Analogix Ships Over One Billion DisplayPort Devices; Milestone Reflects Company's Leadership in Mobile Display Connectivity
December 16, 2014
Analogix Semiconductor, Inc. , today announced that it has now shipped more than 1 billion DisplayPort(TM) devices into the consumer electronics market. This important milestone underscores Analogix's leadership in DisplayPort technology, which enables smartphones, tablets and notebooks to connect with the latest high-resolution TVs, projectors and monitors.

VivaLnk Showcases New Wearable Thermometer Patch Based on Breakthrough eSkin(TM) Technology at CES
December 16, 2014
VivaLnk, Inc. announced today that it will be demonstrating a new innovation, eSkin(TM) Thermometer, that will transform the way you measure and monitor your body temperature at the 2015 International Consumer Electronics (CES) Show in Las Vegas. VivaLnk's breakthrough eSkin(TM) technology enables complex electronic circuitry with embedded tiny sensors on a thin flexible material to adhere comfortably to your skin. Using an NFC chip solution from NXP Semiconductors, together with state-of-the-art temperature sensing technology, this electronic patch makes highly accurate temperature measurements without requiring a battery. "VivaLnk's eSkin(TM) technology has placed NXP's technology adoption into new and exciting applications," emphasized Victor Vega, Director, NFC/RFID Solutions at NXP Semiconductors. Leveraging this extraordinary form factor, the engineering team at VivaLnk created an easy-to-use, function-rich smart thermometer for parents to measure and monitor fevers of young children.

MACOM Successfully Completes Acquisition of BinOptics Corporation
December 16, 2014
LOWELL, Mass., Dec. 16, 2014 (GLOBE NEWSWIRE) -- M/A-COM Technology Solutions Holdings, Inc. (Nasdaq:MTSI) (MACOM), a leading supplier of high-performance RF, microwave, millimeterwave and photonic products, today announced that it has successfully completed its previously announced acquisition of BinOptics Corporation, a leading merchant provider of Indium Phosphide lasers for Data Centers, Mobile Backhaul, Silicon Photonics and Access Networks, in an all-cash transaction valued at $230 million. John Croteau, President and Chief Executive Officer of MACOM stated, "Our goal with this acquisition will be to further extend MACOM's preeminent position in the optical space, as we now have an even broader platform to benefit from what we anticipate will be a strong secular growth driver for many years to come. Based on feedback from our optical customers thus far, we continue to expect significant operational and sales synergies as we integrate the acquired business."

Cabot Microelectronics Corporation Names David H. Li as Chief Executive Officer; William P. Noglows to Serve as Chairman
December 16, 2014
AURORA, Ill., Dec. 16, 2014 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing CMP pad supplier to the semiconductor industry, announced today that its Board of Directors has elected David H. Li as President and Chief Executive Officer (CEO) and member of the Board, effective January 1, 2015. William P. Noglows will continue to serve as Executive Chairman of the Board of Directors. As President and CEO, Mr. Li, who is currently Cabot Microelectronics' Vice President of the Asia Pacific Region, will succeed Mr. Noglows, who has served as the company's Chairman, President and CEO since 2003. A photo accompanying this release is available at http://www.globenewswire.com/newsroom/prs/?pkgid=29668

ON Semiconductor Introduces Two New Series of Power Factor Corrected Ac-Dc Drivers for LED Lighting Applications; Extends single stage solutions with high power factor capability and broadens two stage solutions up to 150 watts
December 15, 2014
ON Semiconductor (Nasdaq: ONNN ), driving energy efficient innovations, announces two new series of power factor corrected (PFC) offline Ac-Dc drivers for high performance LED lighting applications. Extending the NCL3008x family of products, the NCL30085 , NCL30086 and NCL30088 address single stage design implementations up to 60 watts (W) that require high power factor. The NCL30030 broadens the existing solutions which support higher power (up to 150 W) two stage topologies that require low optical ripple and wide LED forward voltage variation. "Compact, robust and flexible, these new PFC controllers address the need for higher performance solutions in the LED lamp and driver market," said Shane Chilton, senior director of the Ac-Dc Power Conversion division at ON Semiconductor. "These solutions deliver precise current regulation via our unique architecture. This translates into LED lighting designs that are more flexible and can be future proofed with a common control approach."

ZMDI a global semiconductor company is proud to be exhibiting at the 2015 Consumer Electronics Show in Las Vegas Nevada on January 6-9 2015
December 15, 2014
Milpitas California ndash;15 December 2014ndash; ZMD AG (ZMDI) an award-winning global semiconductor company headquartered in Dresden Germany and specializing in enabling energy-efficient solutions today announces that in association with MEMS Industry GroupZMDIwill be exhibiting at the 2015 Consumer Electronics Show (CES) in Las Vegas Nevada on January 6-9 2015. This year ZMDI will be located at booth72032in the TECH WEST section of the show which highlights pioneering technologies including health/fitness wearables the Internet of Things (IoT) and sensors as well as other high growth markets for consumer products.


Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....