Headlines


Global Semiconductor Industry Posts Highest-Ever January Sales; Worldwide sales increase 8.7 percent compared to last January; Americas post strongest growth among regional markets
March 02, 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.5 billion for the month of January 2015, the industry's highest-ever January total and an increase of 8.7 percent from January 2014 when sales were $26.3 billion. Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends. Regionally, sales in the Americas increased by 16.4 percent compared to last January to lead all regional markets. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. "After a record-setting 2014, the global semiconductor industry is off to a promising start to 2015, posting its highest-ever January sales led by impressive growth in the Americas market," said John Neuffer, president and CEO, Semiconductor Industry Association. "Global sales have increased on a year-to-year basis for 21 consecutive months and remain strong across most regions and product categories."

Waves MaxxVoice Technology Now Available for Cadence Tensilica HiFi Audio DSPs
March 02, 2015
 Cadence Design Systems, Inc. (NASDAQ: CDNS) and Waves today announced that the Waves MaxxVoice(TM) technology has been ported to and optimized for the Cadence® Tensilica® HiFi Audio/Voice digital signal processors (DSPs). The technology from Waves, a leading provider of audio plugins for the professional and consumer markets and recipient of a Technical GRAMMY® award, will appeal to designers integrating HiFi DSPs into their chip designs to supply a premium sound experience for audio, voice, speech, headphones, streaming and recording on consumer electronic devices.

Peraso PRS4000 Baseband SOC Selected by InterDigital for mm-Wave Mesh Backhaul; Innovative WiGig Solution Unveiled at Mobile World Congress 2015
March 02, 2015
 Peraso Technologies Inc. a fabless semiconductor company specializing in the development of mm-wave wireless chipsets, announced today that InterDigital, a mobile technology research and development company, has selected its PRS4000 series of baseband SOCs as an integral component for their innovative backhaul platform.  The platform is the world's first WiGig-based millimeter wave mesh backhaul solution for small cells. The PRS4000 baseband integrated circuit includes an 802.11ad compliant MAC/PHY, multi-Gbps processing, a USB 3.0 system interface, and analog I/Q interface which can be seamlessly connected to Peraso's 60 GHz RF ICs. Importantly, Peraso supports a highly flexible software architecture, which allows customers such as InterDigital to add proprietary functionality to the baseline operation of the device.

Broadcom Announces Next Generation Ultra HD Devices with MoCA 2.0 IP Interface; Set-top Box Chips with Multi-standard Support Enables Multiple 4K Content Options
March 02, 2015
 CableLabs Conference -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced two new Ultra High Definition (Ultra HD) system-on-chip (SoC) devices that integrate the advanced Multimedia over Coax Alliance (MoCA) 2.0 standard for cable home networking. Broadcom's new Ultra HD chips are the latest offerings in the company's portfolio of more than 40 MoCA-enabled SoCs and mark a milestone for shipping more than 100 million devices with this technology. Visithttp://www.broadcom.com to learn more. The BCM7448S and BCM7449S chips for connected home gateways and IP clients support multiple Ultra HD video compression standards for operators and manufacturers to cost-effectively deliver the widest variety of 4K content to home subscribers. With integrated MoCA 2.0, the BCM7448S and BCM7449S are hardware and software compatible for upgrade with Broadcom's widely deployed BCM74XX series Ultra HD chips.

Lattice Semiconductor Announces Expiration of HSR Waiting Period for Proposed Acquisition of Silicon Image
March 02, 2015
Lattice Semiconductor Corporation (NASDAQ:LSCC), a leading provider of programmable connectivity solutions, today made the following announcements related to its proposed acquisition of Silicon Image (NASDAQ:SIMG). As previously announced, Lattice Semiconductor has entered into a definitive agreement to acquire Silicon Image, and commenced a tender offer on February 9, 2015 for all outstanding shares of Silicon Image for $7.30 per share in cash.The waiting period for U.S. antitrust review under the Hart-Scott-Rodino Antitrust Improvements Acts of 1976, as amended ("HSR Act") relating the proposed acquisition of Silicon Image expired on February 24, 2015. The expiration of the waiting period under the HSR Act satisfied one of the conditions to closing of the tender offer.The condition related to the marketing period in connection with the financing for the transaction is expected to be satisfied before the expiration time of the tender offer on March 9, 2015. Other conditions remain to be satisfied, including the valid tender of at least a majority of outstanding Silicon Image shares. The tender offer is scheduled to expire at 12:00 midnight, New York City time, at the end of the day on March 9, 2015, unless the tender offer is extended or terminated earlier.

Lattice Semiconductor Announces Expiration of HSR Waiting Period for Proposed Acquisition of Silicon Image
March 02, 2015
Lattice Semiconductor Corporation (NASDAQ:LSCC), a leading provider of programmable connectivity solutions, today made the following announcements related to its proposed acquisition of Silicon Image (NASDAQ:SIMG). As previously announced, Lattice Semiconductor has entered into a definitive agreement to acquire Silicon Image, and commenced a tender offer on February 9, 2015 for all outstanding shares of Silicon Image for $7.30 per share in cash.The waiting period for U.S. antitrust review under the Hart-Scott-Rodino Antitrust Improvements Acts of 1976, as amended ("HSR Act") relating the proposed acquisition of Silicon Image expired on February 24, 2015. The expiration of the waiting period under the HSR Act satisfied one of the conditions to closing of the tender offer.The condition related to the marketing period in connection with the financing for the transaction is expected to be satisfied before the expiration time of the tender offer on March 9, 2015. Other conditions remain to be satisfied, including the valid tender of at least a majority of outstanding Silicon Image shares. The tender offer is scheduled to expire at 12:00 midnight, New York City time, at the end of the day on March 9, 2015, unless the tender offer is extended or terminated earlier.

Connected IO Develops Altair-Based Cellular Module for Internet of Things-Based Applications; Verizon Certified, Semi-Rugged M2M Modem Provides 4G/LTE Connection for Wide Range of Products, from Vending Machines to Digital Signs
March 02, 2015
Connected IO (http://www.connectedio.com), a provider of embedded product engineering, software development and industrial design services to communications and networking companies, and Altair Semiconductor (http://www.altair-semi.com), the world's leading developer of ultra-low power, small footprint and high-performance 4G LTE chipsets, today announced the commercial availability of the LT1001 4G LTE M2M Modem, a low-cost, semi-rugged LTE modem for M2M and IoT markets.

Marvell Partners with Google's Advanced Technology and Products (ATAP) Group to Support Project Ara; Marvell's industry-leading quad-core 64-bit 5-mode 4GLTE ARMADA Mobile PXA1928 solution supports Google in revolutionizing smartphone designs
March 02, 2015
Marvell(NASDAQ:MRVL) - a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment and in-home content delivery, and Kinoma® software enabling the "Smart Life and Smart Lifestyle," - today announced that it is partnering with Google's Advanced Technology and Products (ATAP) Group to support Project Ara with Marvell's industry-leading quad-core 64-bit 5-mode 4GLTE ARMADA® Mobile PXA1928 platform. The Project Ara modular smartphone platform is designed to lower barriers to entry, increase the talent pool for hardware developers and significantly compress hardware development and new technology insertion time scales.

IDT Wireless Power Transmitter Adopted for Samsung Galaxy; IDT's Wireless Technology Deployed to Offer a Better User Experience for Phones and a Variety of Other Applications
March 02, 2015
Integrated Device Technology, Inc. ( IDT ®) (NASDAQ:IDTI) announced today that Samsung adopted an IDT wireless power transmitter to enable wireless charging for its Galaxy smart phone. With the integration of IDT's P92xx magnetic induction transmitter in the Galaxy charging pad, Samsung joins the list of leading innovators deploying IDT wireless power technology into cutting-edge products. In addition to smart phones and accessories, IDT's wireless power transmitters and receivers have been designed into wearables, charging stations, remote controls, and furniture.

IDT Introduces 'Wireless PowerShare' Technology, Enabling Mobile Devices to Wirelessly Charge One Another; The New Solution Can Serve as Both Receiver and Transmitter, Supporting All 3 Major Wireless Power Standards
March 02, 2015
Integrated Device Technology, Inc. ( IDT ®) (NASDAQ:IDTI) today introduced its "Wireless PowerShare(TM)" technology, a cutting-edge innovation that will enable consumers to wirelessly charge a mobile device from another device. The semiconductor is a multi-mode, multi-function chip-receiver and transmitter-that supports all major wireless power standards for magnetic resonance and magnetic induction charging. With IDT's Wireless PowerShare technology, consumers will be able to charge their wearable devices by simply setting them atop or near an enabled smart phone.


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