Analysts: Texas Instruments Q3 'Not A Read-Through' For Industry
October 21, 2014
Texas Instruments Incorporated's (NASDAQ: TXN) third-quarter earnings beat might make it appear immune from weakness in the semiconductor industry, but analysts say the company could still catch a cold.

Freescale Announces the Industry's Most Power-Efficient 64-Bit Arm®-Based Processor for the New Virtual Network; Quad-core QorIQ LS series processor based on ARM Cortex®-A53 core enables "the intelligent edge," provides an optimized platform for the evolution of virtual edge services
October 21, 2014
Freescale Semiconductor [NYSE: FSL] today introduced the QorIQ LS1043A communications processor - the industry's most power-efficient 64-bit ARM-based processor for the new virtual network. The system-on-chip helps edge network equipment manufacturers easily scale power and performance to meet the changing needs of the world's highly virtualized, software-defined networks. Cloud and data center technologies are increasingly deployed in branch offices, retail stores and even residences, driving demand for standard, flexible and low-power platforms. Meanwhile, service providers' multiple "box" service delivery solutions are quickly giving way to a model of fewer on-premises gateways, since numerous services can now be consolidated into less on-site equipment. As virtual network functions and cloud orchestration technologies continue to mature, virtual CPE (vCPE) systems hold the potential for lower service provider opex and capex via reductions in local IT management costs and fewer physical devices to be deployed.

Freescale brings the Internet of Things to the vehicle; Automotive hardware/software solution streamlines development of infotainment systems incorporating Ethernet Audio Video Bridging (AVB) for the connected car of the future
October 21, 2014
Freescale Semiconductor (NYSE: FSL) today introduced a comprehensive hardware/software development system for enabling automotive grade Ethernet connectivity for next generation infotainment, instrument cluster, camera telematics and rear seat entertainment designs. The new solution will support real-time data transport throughout the vehicle and replace expensive digital technologies and other alternatives. Freescale's SABRE AI enables automotive grade Ethernet connectivity for next-generation infotainment, instrument cluster, camera, telematics and rear seat entertainment designs. (Photo: Business Wire)

Efficient Power Conversion (EPC) Introduces Wide-Input, 20 Amp GaN-Based Buck Converter Demonstration Board for Telecom, Industrial, and Medical Applications; EPC9118 demonstrates size reduction and efficiency enhancement for power conversion readily achieved using high frequency switching eGaN® FETs for supply voltages up to 48 V or more
October 21, 2014
Efficient Power Conversion Corporation (EPC) introduces the EPC9118 , a fully functional buck power conversion demonstration circuit. This board is a 30 V-60 V input to 5 V, 20 A maximum output current, 400 kHz buck converter. It features the EPC2001 and EPC2015 enhancement-mode (eGaN®) field effect transistors (FETs), as well as the LTC3891 buck controller. This buck converter design is ideal for distributed power solutions in telecom, industrial, and medical applications.

REMINDER: MEDIA ALERT: Presentations From Formal Verification Experts Highlight Next Decoding Formal Club Meeting Hosted by Oski Technology, Sponsored by Synopsys; October 23 Agenda Includes Talks on Formal Verification Methodologies, Real-World Applications, Experiences
October 21, 2014
WHO: Three formal verification experts -- Formal Verification Pioneer Robert Kurshan, Vigyan Singhal, Oski's chief executive officer, and Syed Suhaib, formal verification team manager at NVIDIA -- will share their formal verification insights and expertise using real-world examples

October 21, 2014
ESSEX JUNCTION, Vt., Oct. 20 -- Gov. Peter Shumlin, R-Vt., issued the following press release: Gov. Peter Shumlin was joined today by business groups, employers, local officials, lawmakers and others to offer strong state partnership to GlobalFoundries. The Santa Clara-based semiconductor manufacturer today announced its intention to purchase IBM's facilities in Vermont and continue operations and employment at the plant. GlobalFoundries said that manufacturing at the facility will continue, with robust demand supporting plant operations and employment. The announcement ends months of uncertainty about the fate of the plant due to IBM's strategic realignment of its business away from silicon chip manufacturing.

October 21, 2014
ONTPELIER, Vt., Oct. 20 -- Gov. Peter Shumlin, R-Vt., issued the following press release: "IBM announced this morning that it plans to sell its semiconductor production business, including its facilities in Vermont, to GlobalFoundries, a company with a strong track record of performance in semiconductor manufacturing. GlobalFoundries plans to maintain the workforce and continue operations in Vermont, good news for the talented Vermonters employed by the plant and for our whole state.

Mubadala chip unit in $1.5bn deal with IBM
October 21, 2014
IBM will pay GlobalFoundries US$1.5 billion over the next three years for the Mubadala-owned company to take on its floundering microelectronics business. IBM is shedding the unit to focus on the development of cloud computing, mobile and big data analytics and semiconductor research in which it has invested $3bn over five years.

Indium Doping Effect on Structural, Optical and Electrical Properties of Sprayed ZnO Thin Films
September 01, 2014
FULL TEXT Abstract: In the current work, indium doped zinc oxide thin films were deposited by spray pyrolysis technique on glass substrate at 350 °C. The effect of the preparation conditions on the structural, morphological, optical and electrical properties of the films has been studied. The molar ratio of indium in the spray solution was varied from 0 to 5 at %. All the deposited films are polycrystalline with a (002) preferential orientation at low indium concentration. X-ray diffraction technique shows that the quality of the films was deteriorated when increasing indium concentration. Scanning Electron Microscopy and Atomic Force microscopy were performed to examine the surface morphology of the films. The deposited films showed an average optical transmittance around 85 % in the visible region; meanwhile the band gap value was varied between 3.13 and 3.25 eV. Hall Effect measurements revealed that the indium doping induces an increase in the electron concentrations, making the films heavily n type. A lowest resistivity (0.3 ohmcm), compared to that of the undoped ZnO (66 ohmcm), is obtained for the film doped with 3 % of indium. Copyright © 2014 IFSA Publishing, S.L. Keywords: ZnO, TCO, Spray Pyrolysis, Thin films, Characterization.

Machine Vision based Micro-crack Inspection in Thin-film Solar Cell Panel
September 01, 2014
FULL TEXT Abstract: Thin film solar cell consists of various layers so the surface of solar cell shows heterogeneous textures. Because of this property the visual inspection of micro-crack is very difficult. In this paper, we propose the machine vision-based micro-crack detection scheme for thin film solar cell panel. In the proposed method, the crack edge detection is based on the application of diagonal-kernel and cross-kernel in parallel. Experimental results show that the proposed method has better performance of micro-crack detection than conventional anisotropic model based methods on a cross-kernel. Copyright © 2014 IFSA Publishing, S. L. Keywords: Edge detection, Diagonal-kernel, Cross-kernel, Heterogeneously textured, Solar cell, Micro-crack inspection.


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Next-generation nanoimprint lithography technology
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SEMI-GAS broadens gas mixing capabilities for highly corrosive gases
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