January 29, 2015
WASHINGTON, Jan. 29 -- MagnaChip Semiconductor Corp., Luxembourg, files Form 8-K (current report) with Securities and Exchange Commission on Jan. 28. State or other jurisdiction of incorporation: Delaware Item 8.01. Other Events. On January 28, 2015, MagnaChip Semiconductor Corporation (the "Company") issued a press release announcing that it expects to complete and file its Annual Report on Form 10-K for the fiscal year ended December 31, 2013, which will include its restated annual financial statements for the years ended December 31, 2012 and 2011 (the "2013 Form 10-K"), and simultaneously complete and file its Quarterly Reports on Form 10-Q for the quarterly periods ended March 31, 2014, June 30, 2014 and September 30, 2014, which will include the corresponding comparative restated financial statements for the quarterly periods ended March 31, 2013, June 30, 2013 and September 30, 2013, respectively (the "2014 Form 10-Qs"), during the week of February 9, 2015, but no later than February 13, 2015. A copy of the press release is attached hereto as Exhibit 99.1 and incorporated herein by reference.

ZEISS Enters the Software Sector with Analysis Solution; ZEISS has developed and released the new software solution ZEISS AutoAnalysis. The application software analyses aerial images, taken by the ZEISS photomask qualification tool AIMS(TM). It runs fully automated and provides immediate, standardized results.;
January 29, 2015
ZEISS has released the new application software ZEISS AutoAnalysis. The software solution provides fully automated analysis of ZEISS AIMS aerial images in parallel to the measurements as they are being captured. Manual interaction is no longer required, thus eliminating human error, but manual analysis is still available if desired. Analysis results are automatically entered into customized report layouts. ZEISS AutoAnalysis communicates directly with the ZEISS AIMS tools. ZEISS AutoAnalysis has been in use at one customer site for several months. Two more installations will follow in February.

JAPAN: Toyota trials new hybrid semiconductor material
January 29, 2015
Toyota is testing new technology it said could make hybrids and other vehicles with electric powertrains more efficient. The year-long trial in Japan will evaluate the performance of new power semiconductors that use a silicon carbide (SiC) material, fitted to a Camry hybrid saloon prototype and a hydrogen fuel cell-powered bus.

NXP Semiconductors Awarded D-PAS Certification; NXP ICs Now Available for the Manufacture of All U.S. EMV Cards, Reinforcing NXP's Leadership in Payments and Contactless Technologies
January 29, 2015
EINDHOVEN, Netherlands, Jan. 29, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI) today announced that its Integrated Circuit (IC) for secure card payments has been granted D-PAS certification by Discover Financial Services. The certification applies to implementation of EMV across Discover Network.

Graphene Semiconductor gets 4.95 crores in funding from Karnataka Govt Semiconductor focus Fund
January 29, 2015
Karnatka, Jan. 29 -- Graphene Semiconductor Services Pvt. Ltd. today said that it has received Rupees 4.95 crores in a first phase funding from the Karnataka Semicondcutor Venture Capital Fund (KARSEMVEN Fund) recognising the startup's unique approach to semiconductor technology in product realization, from concept, to product deployment.

January 29, 2015
The following information was released by Imperial College London: by Colin Smith A new Instagram series will show off the surprising beauty of the silicon chips being developed by researchers at Imperial to improve health.

Nanostructured semiconductors for efficient water splitting
January 29, 2015
SPIE has issued the following news release: Photoelectrochemical (PEC) water splitting, in which molecular hydrogen and oxygen are directly dissociated from water molecules using semiconductor electrodes, dates back to 1972.1 Certain factors have, however, delayed developments in this field over the last few decades. Limitations include the expense of the required materials, electrode instability against photocorrosion, and poor solar-to-hydrogen (STH) generation efficiencies.2 Recent advances in the field of nanotechnology may enable these bottlenecks to be overcome. PEC water-splitting research currently targets low-cost and Earth-abundant elements that show promising STH conversion efficiencies. The semiconductor materials used usually include inexpensive metal oxides, metal sulfides, and metal carbides. A state-of-the-art device based on tungsten-doped bismuth vanadate photoanodes3 has enabled an STH conversion efficiency of ∼5%. The highest efficiency to date (14%) was achieved using a titanium dioxide-coated indium phosphide photocathode.4 These recent studies show the potential for commercial PEC water-splitting devices.

January 29, 2015
Marvell Semi-conductor Sdn Bhd plans to invest more than RM12 million annually on research and development (R&D) to support its newly-opened design centre at the Bayan Lepas Technoplex Industrial Park

Evonik Industries launches new metal-oxide semiconductor material
January 23, 2015
HIGHLIGHT: Evonik Industries, a speciality chemicals company, has launched iXsenic, a new inorganic metal-oxide semiconductor material.

Surface-mountable LED; New Products: ELECTRONIC COMPONENTS
January 01, 2015
  Osram Opto Semiconductors (Sunnyvale, CA) has launched the first LED with oval light-radiating characteristics for large-screen video walls, gas station price signs, and digital road signs. Features include:           * A compact housing measuring 2.1 x 2.7 x 1.5 mm (including lens).           * Low tilt tolerances per diode.             * A stable and homogenous color appearance.             * Availability in yellow, red, green, and blue.         [ILLUSTRATION OMITTED]           www.osram-os.com     


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Entegris' VaporSorb filter line protects advanced yield production
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