Element Six Introduces New Thermal Grade of CVD Diamond - DIAFILM TM130 for Semiconductor Heat Management
October 21, 2014
Synthetic Diamond Market Leader Expands Portfolio to Offer Customers More Diamond Thermal Management Options SAN DIEGO – INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS (BOOTH #530) -- Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130. DIAFILM TM130 has a thermal conductivity in excess of 1300 W/mK and is available in both metallized and un-metallized wafers form. Similar to Element Six's material grades in its DIAFILM TM range, TM130 offers full isotropic heat spreading in both planar and through plane directions. Enhancing its already extensive portfolio to offer customers more options to address unique thermal management needs, Element Six now provides a total of five material grades spanning five levels of performance ranging from 1000 W/mK to 2000 W/mK.

RS Components Introduces Duo of Integrated Dual-Wavelength Red and Infrared Laser Diodes that Offer Stable Power Output
October 21, 2014
RS Components < http://hken.rs-online.com/> (RS), the trading brand of Electrocomponents plc < http://www.electrocomponents.com/> (LSE:ECM), the global distributor for engineers, has introduced a pair of new single-chip dual-wavelength red/infrared laser diodes that offer high output characteristics in a compact size. Manufactured by Panasonic, a worldwide leader in optoelectronic semiconductors, these devices are ideal for use in optical disk drives, barcode readers and a multitude of sensing-based applications such as laser distance sensors for industrial use, or flow cytometers in biomedical applications. < http://photos.prnasia.com/prnh/20141003/8521405762> RS263 - Panasonic Laser Diodes  

TRIQUINT SEMICONDUCTOR: No Expedited Proceedings for Stock Suit
October 21, 2014
The Delaware Court of Chancery denied a motion for expeditedproceedings in In re TriQuint Semiconductor, Inc. StockholdersLitigation, C.A. No. 9415-VCN, according to the company's July 31,2014, Form 10-Q filing with the U.S. Securities and ExchangeCommission for the quarter ended June 28, 2014.

North American Semiconductor Equipment Industry Posts September 2014 Book-to-Bill Ratio of 0.94
October 20, 2014
The Semiconductor Equipment and Materials International issued the following news release: North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in September 2014 (three-month average basis) and a book-to-bill ratio of 0.94, according to the September EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 0.94 means that $94 worth of orders were received for every $100 of product billed for the month.

PRWeb Newswire
October 19, 2014
  (PRWEB) October 19, 2014         The report "Silicon carbide (SiC) in semiconductor market by technology, product, and application, by geography - forecast and analysis to 2020", defines and segments the silicon carbide in semiconductor market into various segments with an in-depth analysis and forecasting of revenues. This research report also identifies the factors driving this market, various restraints, challenges and opportunities impacting it along with the future roadmaps.       The Silicon Carbide (SiC) in Semiconductor Market expected to reach $3182.89 Million by 2020, growing at a CAGR of 42.03% from 2014 to 2020.         Browse 86 market data Tables and 49 Figures spread through 250 Pages and in-depth TOC on "Silicon carbide (SiC) in semiconductor market".             http://www.marketsandmarkets.com/Market-Reports/silicon-carbide-electronics-market-439.html           Early buyers will receive 10% customization on this report.       Request for Customized Report @   http://www.marketsandmarkets.com/requestCustomization.asp?id=439   The Silicon Carbide material is used in many commercial applications including electronic systems, abrasive materials, cutting tools, body armors, automobile brakes, and lighting applications.

Global Solar PV Market and Solar Thermal Market in Europe 2014-2018 Forecasts and Analysis in New Research Reports at Sandlerresearch.org.
October 17, 2014
  Dallas, Texas (PRWEB) October 17, 2014       One of the major trends in this market is the increase in investment by various governments. Various national authorities across the globe are encouraging companies to manufacture PV modules.   Analysts forecast the Global Solar PV market to grow at a CAGR of 20.3 percent over the period 2013-2018. According to the report, one of the major driving factors in the market is the increase in government support. There is continuous increase in government support in terms of FIT programs, investment tax credit, and other tax benefit schemes.         The report covers the present scenario and the growth prospects of the Global Solar PV market for the period 2013-2018. The report includes the segmentation of the Global Solar PV market based on the following criteria: technology, end-user, and geography.       The Global Solar PV Market 2014-2018 has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the APAC and EMEA regions; it also covers the Global Solar PV market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Semiconductor and Other Electronic Component Manufacturing in Canada Industry Market Research Report Now Available from IBISWorld.
October 16, 2014
  New York, NY (PRWEB) October 17, 2014       The Semiconductor and Other Electronic Component Manufacturing industry produces a range of input devices that are necessary in the production of electronics, including circuits and memory chips. In the past five years, the industry has contracted due to the continued offshoring trend that has pervaded much of Canada's manufacturing sector. In addition, greater competition from US and East Asian manufacturers, which offer lower-priced products due to more competitive labour costs, have contributed to the industry's decline. "As such, although demand for downstream electronics is on the rise, the inputs are being manufactured elsewhere," according to IBISWorld Industry Analyst Darryle Ulama. As a result, in the past five years, industry revenue is expected to decline at an annualized 5.1% to $2.5 billion, including an 8.0% decline in 2014.           The broader electronics value chain is highly globalized, with product design, raw material procurement and manufacturing segmented across facilities in different regions.

Wireless connectivity semiconductors serve health and fitness; EE INDUSTRY UPDATE; Brief article
October 01, 2014
Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices, according to a new report from IHS Technology. Shipments this year for wireless semiconductors in health and fitness will reach a projected 61.2 million units, up 11% from 55.0 million in 2013.

Enabling researchers to chase electrons and measure P[OMEGA]; MATERIALS SCIENCE; Editorial
October 01, 2014
  The materials science field is poised for significant advancement as researchers investigate graphene, polymers, nanomaterials such as carbon nanotubes, and exotic dielectrics, according to Alan Wadsworth, market development manager for the Hachioji Semiconductor Test Division of Keysight Technologies. He cited Yole Developpement predictions that the market value for graphene materials for opto and electronic applications will increase at an 18.5% CAGR through 2018 and then at a 35.7% CAGR through 2024.         [ILLUSTRATION OMITTED]           "New materials science applications are growing, and investment is ramping up quickly," he said. Researchers involved in such applications, he said, typically need to measure extremely small currents and extremely large resistances.         A DMM can make current measurements down to 10 nA or so, but you need a picoammeter to go lower. Similarly, you'll need an electrometer, which Wadsworth defines as a high-performance DMM, to make resistance measurements beyond a gigaohm and up into the petaohm range--as well as low-current measurements. An electrometer, he said, can serve as an ohmmeter, voltmeter, and charge meter as well as an ammeter. He added that most picoammeters do not include voltage sources; most electrometers do.           Wadsworth cited several test challenges in making low-level measurements.

Modular systems automate IC test; SEMICONDUCTOR TEST; integrated circuits; Editorial
October 01, 2014
  Modular instruments provide a flexible, scalable way to test semiconductors--some of these individual instruments are described in a recent EE special report. (1) However, some modular-instrument vendors will put together subsystems or complete turnkey systems, along with software and DUT interfaces, that you can easily deploy. For example, Marvin Test Solutions builds systems based on its PXI instruments and ICEasy semiconductor-test software toolset. And Aeroflex offers a variety of systems and subsystems based on its own and--as required--third-party PXI and AXIe instruments.           [FIGURE 1 OMITTED]     And at NIWeek 2014, National Instruments adopted a turnkey approach with the introduction of the NI Semiconductor Test System (STS) series (Figure 1), which supports automated test of RF and mixed-signal devices. But despite the turnkey flavor of the new system, which integrates with handlers, for example, Luke Schreier, senior group manager of test systems, emphasized that the systems are based on the open-architecture PXI platform and are fully accessible to the customer. The approach, he said, is particularly beneficial for customers with RF and mixed-signal test needs.       Speaking at NlWeek, Rebeca Jimenez, vice president for worldwide test operations at Integrated Device Technology, and Glen Peer, director of test at IDT, described their early use of the NI STS.


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