Headlines


IGBT and Super Junction MOSFET Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019
October 30, 2014
  /PRNewswire/ -- In recent years, environment compatibility, energy efficiency, flexibility and cost reduction have emerged as critical global issues across the semiconductor industry. Over the years, the electronics industry has been launching various power semiconductor solutions, such as insulated gate bipolar transistors (IGBTs) and super junction MOSFETs (metal oxide field effect transistor). IGBTs and super junction MOSFETs are used in switching applications in different end-user applications, including uninterrupted power supplies (UPS), wind turbines, PV inverters, rail tractions, electric vehicles and hybrid electric vehicles, and other industrial applications.

Lucintel anticipates the global adhesive pastes and films market in semiconductor packaging industry to grow at a CAGR of 5.9% during 2012-2017; Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis
October 29, 2014
Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines. Photo -http://photos.prnewswire.com/prnh/20141029/155210

Lucintel anticipates the global adhesive pastes and films market in semiconductor packaging industry to grow at a CAGR of 5.9% during 2012-2017; Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis
October 29, 2014
Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines. Photo -http://photos.prnewswire.com/prnh/20141029/155210

Dow Corning posts 49% higher Q3 net profit
October 29, 2014
(SeeNews Renewables) - Oct 29, 2014 - US silicon-based materials maker Dow Corning Corp said today its third-quarter net profit has climbed by 49% year-on-year to USD 176 million (EUR 138m) as sales increased for the fourth consecutive quarter.

ETF Preview: Broad Market ETFs Mixed: China-Related Funds Outperform Amid Improved Earnings
October 29, 2014
Pre-Market Movers YINN +4.4% UCO +2.5% TVIX +1.4% CURE -1.7% TQQQ -1.44% Broad Market Indicators Broad-market exchange-traded funds, including SPY, IWM and IVV are mostly higher pre-market; likewise, actively traded PowerShares QQQ (QQQ) was down 0.3% pre-bell, after a higher close Tuesday. Funds focused on China gained after China-related stocks rose to a five-week high in Hong Kong trading on the back of higher earnings. U.S. stock futures are mixed as investors wait for a statement from Federal Reserve Chair Janet Yellen at 2 pm ET in Washington. The Fed is expected to announce an end to the monthly bond purchases that have helped stimulate the market.

Walter Launches New Indexable Inserts with Positive Geometry
October 29, 2014
Company expands its Tiger•tec Silver® range with three new positive geometry inserts. The FP4, MP4 and RP4, bring new levels of production efficiency to a wide range of applications, particularly those involving low cutting pressures or small diameters.

ROHM Semiconductor's General-Purpose Automotive MCU System Power Supplies for Idling Stop Systems
October 29, 2014
Advanced design ensures optimum MCU performance even during cranking KYOTO, Japan and SANTA CLARA, Calif., – ROHM Semiconductor has recently announced the development of system power supplies optimized for high-performance microcontrollers in a variety of automotive systems, from electronic power steering to fuel injection, including HEVs and EVs.

EV Group Next-Gen Nanoimprint Lithography Technology Targets Photonics, LED and Bioengineered Device Production
October 29, 2014
SmartNIL(TM) large-area soft nanoimprint lithography process for high-volume manufacturing provides unmatched throughput and cost-of-ownership advantages over competing NIL approaches ST. FLORIAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its SmartNIL(TM) large-area nanoimprint lithography (NIL) process. Available on all EV Group NIL platforms, including mask aligners as well as the industry benchmark EVG(®)720 and newly available EVG(®)7200 UV-NIL systems, SmartNIL provides a low-cost, large-area and high-volume-manufacturing solution for a variety of advanced devices, including: --  Photonic-based devices such as light-emitting diodes (LEDs), lasers and photovoltaics

TSI Semiconductors and Silvaco Extend Collaboration to Accelerate Launch of 0.25um BCDMOS Process; Adoption of Utmost IV and HiSIM_HV2 for Accurate SPICE Modeling of LDMOS Devices
October 29, 2014
Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology. TSI Semiconductors' 0.25um BCD with deep trench isolation is a feature rich platform that enables high growth applications in lighting, automotive, power, automation, and consumer goods. The technology is a new offering at the companies' automotive qualified factory in Roseville, CA where there have been continuous manufacturing operations for over 30 years. TSI's TSBCD25 process imposes stringent requirements on modeling efficiency and model accuracy. This requires a SPICE parameter extraction flow that is easy to set up and utilize with convenient data measurement on different instruments. Flexibility in optimization and acquisition routines as well as plotting of results are key requirements for improved modeling productivity. TSI reviewed several industry leading SPICE modeling tools and ultimately selected Silvaco's Utmost IV as it delivered the required accuracy with the latest CMC standard HiSIM_HV2 model support. It also met the desired productivity and flexibility requirements with clear user examples for the different modeling tasks. Utmost IV covers a wide range of models from active devices such as BJT, MOSFET, high-voltage DMOS to passives, such as resistors, all with a single license.

Global Gallium arsenide (GaAs) Devices Market to Grow at 3.32% CAGR by 2018
October 29, 2014
October 29, 2014 ReportsnReports.com offers "Global Gallium arsenide (GaAs) Devices Market 2014-2018" research report in its store. GaAs is a crystalline compound composed of two elements, gallium and arsenic. It is generally referred to as an III-V semiconductor and is used in devices such as microwave frequency integrated circuits, monolithic microwave integrated circuits, infrared light-emitting diodes, laser diodes, solar cells, and optical windows. GaAs is increasingly being used as a replacement for silicon because of its enhanced electronic properties. For instance, GaAs has high saturated electron velocity and electron mobility, which allows the device in which it is used to function efficiently at frequencies above 250 GHz. Moreover, as a result of the wider band gap, GaAs devices are less sensitive to heat compared to silicon-based devices. In addition, GaAs devices emit less noise than silicon devices, especially at higher frequencies. As a result of these properties, GaAs devices are used in cellphones, satellite communication equipment, microwave point-to-point links, and high-frequency radar systems.


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