Insights From Leading Edge

IFTLE 145 GPU Roadmap, IEEE 3DIC back in SF; ConFab 2013 Pkging

NVIDIA has publically updated their roadmap with the announcement of the GPU family that will follow 2014’s Maxwell family. That new family is Volta which will use stacked DRAM, which will be connected to the GPU with TSV.

NVIDIA is targeting a 1TB/sec bandwidth rate for Volta, which to put things in perspective is over 3x what GeForce GTX Titan currently achieves with its 384bit, 6Gbps/pin memory bus (288GB/sec). This would imply that Volta is shooting for something along the lines of a 1024bit bus operating at 8Gbps/pin, or possibly an even larger 2048bit bus operating at 4Gbps/pin. Volta is still years off, but this at least gives us an idea of what NVIDIA needs to achieve to hit their 1TB/sec target [link]

GPU Technology Conference in San Jose. CEO Jen-Hsun Huang was visibly anxious to unveil the company’s Volta, their upcoming GPU targeted for a 2016 release.

"Volta is going to solve one of the biggest challenges facing GPUs today, which is access to memory bandwidth," Huang told the attendees.

Move up t Move down The Volta GPU will introduce stacked DRAM which will deliver 1 terabyte per second of memory bandwidth.

Below is a shot of the Volta with stacked DRAM (drawn to scale)

Huang didn’t provide a timeline for Volta’s release, but 2016 seems reasonable since  Nvidia debuts new GPU architectures every two years.
Huang said that Nvidia will be putting the stacked DRAM and the GPUs onto the same silicon substrate and inside of the same packaging before it welds that package to a peripheral card.
4th Annual IEEE 3DIC Coming to SF in October
The IEEE 3D meeting 3DIC has rotated through Germany and Japan and is back in San Francisco this October 2-4 (link). Paper submission deadline is April 30th.
3D & Packaging Lineup for SST Confab
The full description of SSTs ConFab  2013 can be found here (link)
This years packaging and 3D sessions are co-sponsored by the Component, Packaging and Manufacturing Society (CPMT) of IEEE.

For all the latest on 3DIC and advanced packaging, stay linked to IFTLE.


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