Insights From Leading Edge



IFTLE 347: ASE Embedded Packaging Solutions

At the recent IMAPS Carolina Chapter meeting Rich Rice of ASE gave an update presentation on “Embedded Packaging Solutions”. Specifically:

  • SESUB- Semiconductor Embedded In Substrate
  • aEASI –Advanced Embedded Active System Integration
  • FOWLP- Fan Out Wafer Level Package

SESUB

– ASE offers SESUB through the JV with TDK

– embedding IC releases surface space for other components or allows reduction in overall substrate size

– short copper connections improves parasitics

– ~ 2 dozen SESUB programs underway

IFTLE 347ASE 1

aEASI

– combining leadframe and laminate technologies

– embedding for power devices                        

– good current capability, i.e. ~ 60A; 1.9W/mm2

– 300um Cu heat spreader on back of die      

 – 32um thick Cu lines for low resistance

– low resistivity Ag nano die attach materials keep processing temp and electrical resistance down

IFTLE 347ase 2

IFTLE 347ASE 3

FOWLP

– die are embedded in a reconstituted plastic wafer that is then processed like a silicon wafer

– FOWLP can provide size/electrical benefits for a wide variety of products including PMIC, AP, RF devices in mobile applications demanding miniaturization and performance.

IFTLE 347ASE 4

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