By Dr. Phil Garrou, Contributing Editor
This week, let’s take a look at the latest Yole update on Fan out Packaging by Jerome Azemar that was presented at the IMAPS 2018 Device Packaging Conference.
As we have discussed before, fan out packaging can be embedded in laminate or embedded in mold cmpd (EMC) . Chips can be placed face up or down with various options for interconnections.
Their look inside a smartphone gives an interesting perspective on where fan out packages are being used and where they can be used.
Yole sees automotive radars as an interesting market for fan out solutions
– fan out used in Rf and radar applications
– since 2015 Infineon has shipped > 10MM Radar IC in eWLB packages
Yole reports that technical challenges still exist for fan out as shown below:
They see high density fan out (like TSMCs InFO) fan out being in competition in the future for HPC (high performance computing) and AI (artificial intelligence) applications with silicon 2.5D solutions.
While panel production would certainly reduce costs (more units per operation) such technology is not ready and will have large capital equipment costs. They see production being mainly on wafer through 2022.
CMOS Image Sensor Market
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