Issue



Packaging revenue outgrows package unit growth


07/03/2012







Growth in smartphones and tablets and resurgent automotive demand are increasing IC demand. In turn, increased demand for product functionality is driving up IC packaging revenue faster ??? a 9.8% CAGR ??? than IC unit growth ??? 7.3% CAGR 2010-2016, says New Venture Research (NVR).


Handheld electronics will boost the growth of special purpose logic (SPL) communications chips by 16.7% CAGR revenue through 2016, versus 3.5% CAGR in units. Packages for mobile components are dominated by FPGA and QFN designs, which are at opposite ends of the pricing structure. The third most popular packaging type, QFP, is decreasing in usage over time.





IC device and packaging revenue forecast ($M), 2010-2016. SOURCE: New Venture Research.



Wireless infrastructure products are also in high demand, which is helping boost consumption for standard cell and programmable logic device (PLD) chips. These devices will grow at a CAGR of 16.1% in terms of revenue through 2016, while the device units are projected at 15%. High-I/O BGAs are the package of choice over the forecast period ??? package revenue growth is projected to be slightly higher, at 16.3% CAGR through 2016.


Logic chips are in demand for a host of products, pushing 32-bit MCUs to an 11.1% CAGR unit demand, although only 4.7% device revenue CAGR, through 2016. QFPs and BGAs are the highest-demand package designs, although the QFP is waning. Thus, the package revenue is growing at a CAGR of 12.8% through 2016 for 32-bit MCUs.


This information is included in the newly released report "The Worldwide IC Packaging Market, 2012 Edition", from New Venture Research (NVR), a technology market research firm.???M.C


Solid State Technology, Volume 55, Issue 6, July 2012


More Solid State Technology Current Issue Articles

More Solid State Technology Archives Issue Articles