Inertial sensor development platform
The SWS61111 (formerly SWP210) tool can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics. The SWS61111's high performance inertial sensor interface ASIC, the SWS1110 (formerly SWI210) is a configurable ASIC that offers ultra-low noise front-end, highly configurable open- and closed-loop (force-feedback) operation and high voltage capabilities. MEMS and ASIC designs use SWS61111 to evaluate issues such as parasitic modes of oscillation, electrical and mechanical coupling, high-volt effects and temperature behaviors, and also to evaluate SWS's SWS1110 high performance ASIC, which is offered in die format with optional customization. The SWS61111 consists of a programming board, an ASIC daughter board with a sensor placeholder, a USB interface, and associated PC software. Si-Ware Systems, Cairo, Egypt, http://www.si-ware.com.
High-power Kelvin test contactor
The ecoAmp Kelvin contactor meets the needs of high-voltage/ current test with high thermal and mechanical stability, to 500+ Amperes. The contactor is based on Multitest's Cantilever technology. It has low, stable contacting resistance to achieve equal current symmetry over I/Os within the contactor. Maximum inductance is 4.5nH for 0.5mm pitch, in -60 to +175??C. Thermal management within the contactor supports temperature stability during test. The ecoAmp offers a lifespan of 1 million insertions. Multitest, Rosenhim, Germany, www.multitest.com/ecoAmp.
LED test suite
TEMPO 24 (Thermal Electrical Mechanical Photometric Optical) tests combine the IES LM-79-08 photometric test with nearly a dozen other LED performance tests, including binning and color point evaluation, chemical compatibility, and TM-21 lifetime projection tests to ensure reliability in LED luminaires. Cree currently provides TEMPO Services out of its Durham, NC and Santa Barbara, CA centers. Cree, Durham, N.C., www.cree.com.
One-piece jetting cartridge
The NexJet System for jetting uses a newly designed jet cartridge and new software control for semiconductor packaging applications such as flip chip underfill, CSP, BGA, PoP underfill, precise coating, and adhesive dispensing. The Genius Jet Cartridge one-piece jet is quickly and easily removed without tools. The cartridge dispenses up to 50 million cycles before replacement. It has built-in memory to store usage data like the number of cycles and cartridge type, which is communicated to the jetting tool and compared to the recipe for process control. The NexJet System's precision software control enables jetting of low- and high-viscosity fluids. Nordson ASYMTEK, Carlsbad, CA, www.NordsonASYMTEK.com.
High-throughput defect inspection/metrology
eview cluster tool
The CIRCL suite -- a new generation of KLA-Tencor's LDS front side macro defect inspection module; a new, modular edge inspection, profile and metrology module based on KLA-Tencor's VisEdge technology; a dedicated wafer back-side inspection module; and a flexible optical defect review and classification module -- can be implemented at lithography, outgoing quality control, and other process modules. The cluster tool monitors the wafer's front and back side, and edge for defects. In parallel it measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling, which uses results from one measurement to trigger other types of measurements as needed. The tool detects and bins macro defect types on the front side of the wafer, from particles to defocus defects spanning several die, to full-wafer defects such as missing resist. It catches low percentages of non-critical defects. A reticle ID check verifies that the correct reticle was used for printing. Macro overlay error monitoring checks layer-to-layer pattern registration. Back-side inspection finds particles and scratches, while edge defects are detected and binned. Edge Bead Removal (EBR) metrology monitors film concentricity and edge integrity to prevent delamination defects. Edge profile measurements are automated and calibrated to identify excursions that can result in water bead leakage or film delamination during immersion lithography. Automated high-resolution optical defect review and automated classification of front-side, back-side and edge defects aid in defect source identification. KLA-Tencor Corporation, Milpitas, CA, www.kla-tencor.com.
Ion beam deposition (IBD) tool
The SPECTOR-HT ion beam deposition (IBD) tool performs thin-film deposition for optical products. It is designed to deposit quality films at a lower cost than PVD, evaporative coatings, and ion-assisted deposition. The SPECTOR-HT reportedly offers up to 400% higher throughput, 300% better target utilization and 50% higher material uniformity over previous SPECTOR generations. The IBD tool is fully automated, achieving accelerated deposition rates at speeds comparable to PVD. It delivers an increased deposition rate on lot sizes up to twice as large as those in previous SPECTOR generations. Veeco, Plainview, NY, www.veeco.com.
Benchtop metrology system
The Optiv Classic 321GL tp benchtop vision-measuring metrology system suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more. It features 6.5x motorized CNC zoom optics for 0.002mm accuracy. Touch probes can be added for multi-sensor measurement. The Classic 321GL tp boasts calibrated lighting, a high-resolution color CCD camera, a laser locator and an 8-segment LED dual angle ring light, improving edge detection. The Classic 321GL tp includes PC-DMIS Vision image processing software and full online 3D CAD capabilities for live programming of the machine to compare measured values to nominals. The software's MultiCapture feature finds all 2D characteristics in the field of view and measures them simultaneously for optimized stage movement. Hexagon Metrology, part of the Hexagon AB Group, North Kingstown, R.I., www.hexagon.com.
Thin wafer debond and cleaning tools
A lab-scale suite of thin wafer separation and post-debond cleaning tools target compound semiconductor device processing. Cee 1300CSX is a semi-automatic thermal debonder for high-temperature slide-off debonding of thinned III-V and CS materials (GaAs, GaN, InP, and SiC) in a laboratory setting. The ZoneBOND low-stress, room-temperature debonding separation tool has compliant seal clamps and fail-safe abort hardware to accommodate thinned III-V and CS materials. Higher precision in this generation of the tool targets highly mechanically and thermally sensitive debonding materials on 2-12" wafers. Cee 300MXD megasonic cleaning system applies uniform acoustic energy to spinning substrates, gently removing adhesive residues and contaminants without damaging fragile device structures. Brewer Science, Rolla, MO, http://www.brewerscience.com.
Die attach adhesives
DELOMONOPOX die attach adhesives promise strong mechanical/environmental protection, low-temperature cure, and compatibility with various chip packaging substrates (silicon, epoxy, gold, PEI, PET and PEN). DELOMONOPOX adhesives cure in seconds at low temperatures. The adhesives can be used to bond and encapsulate die, protecting against mechanical damage, humidity, and extreme temperatures. DELO's die attach adhesives are built on the same chemical basis as its chip encapsulants for dam and fill. DELOMONOPOX products are available as unfilled non-conductive products, or filled for grounding or conductive products. DELO, Sudbury, MA, www.DELO.us.
Higher-throughput vacuum pumps
The STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers improve throughput from 40-90% with a new rotary design. The pumps' fully integrated controller eliminates connection cables and racks, and features a small power supply. The STP-iXR1606 series delivers high reliability in dirty environments with equivalent IP54 protection against dust and humidity. It has I/O remote, RS232C, RS485 and STP-link standard communication ports, with Profibus and DeviceNet available as options. The magnetically-levitated TMPs require no maintenance. Edwards Limited, Crawley, West Sussex, UK , http://www.edwardsvacuum.com/.
Touchscreen display manufacturing tool
The Rainbow Process Unit touchscreen display manufacturing method reportedly reduces cost and improves speed over current methods, with environmental benefits. It produces fine line circuitry down to 5??m: coating, imaging and developing a substrate in an automated process. Its proprietary etch wet resist is 100% solids- and solvent-free, and does not require pre-drying before imaging. UV LEDs and standard photo-tools create tracks and gaps of 20??m and below. Power consumption on the unit averages 3kW. The process can be done additively using an imaged seed layer to create electroless plated nickel or copper with a Rainbow imaged plating resist to create tracks. It can also be done subtractively using sputtered metal on plastic using a Rainbow imaged etch resist to create tracks. Grid patterns of 5 x 300??m pitch offer more conductivity than ITO or conductive polymers, while maintaining good transparency. Rainbow Technology Systems, Hillington, Scotland, www.rainbow-technology.com.
Solid State Technology, Volume 55, Issue 5, June 2012