22nm, early-EUV photomask inspection
The Aera3 third-generation mask inspection system emulates the optical system of the lithography scanner, allowing users to immediately see if a defect will cause problems or can safely be ignored. Detection sensitivity is 50% improved vs. the previous Aera2 system; the system also features a more powerful light source (193nm) and smaller pixel size (67nm). An optional EUV module can detect defects as small as 12nm. Applied Materials, Santa Clara, CA; 408/563-0647, www.appliedmaterials.com.
The JSM-7001FTTLS LV scanning electron microscope combines an objective lens and detector technologies to image a wide variety of samples, including magnetic materials. In-lens detectors with energy filtering provide topography and Z contrast images. "Gentle Beam" technology reduces charging and improves resolution, signal-to-noise, and beam brightness, especially at low beam voltages (down to 100V). The system operates at low magnification (10X) with no distortion of the image or EBSD pattern. A low vacuum mode enables imaging of nonconductive samples at high kV and beam currents. An optional STEM detector allows imaging of thin samples with sub-0.8nm resolution. JEOL, Peabody, MA; 978/536-2309, www.jeolusa.com.
The PROVE system offers in-die photomask registration and overlay metrology for 193nm lithography. Autofocus and calibration enables <0.5nm repeatability and <1nm accuracy, working with NA=0.6 for greater depth-of-focus and large working distance. It measures local registration errors in areas where registration markers cannot be placed, and eliminates required marker space to increase useable mask areas. Individual masks are measured relative to design, with results superimposed to extract resulting local overlay error. Carl Zeiss SMT AG, Jena, Germany; +49/3641-64-2242, www.smt/zeiss.com/sms.
CMP polishing pads
The VisionPad 6000 is designed to improve defectivity and dishing for interlayer dielectrics and Cu bulk applications. A low-defect and low-hardness polymer chemistry and optimized pore size exceed removal rates of the IC1000 polishing pads—the company claims customer tests show 50%-60% reduction in scratch defects and 35% reduction in dishing, with equivalent nonuniformity. VisionPad 5200 CMP polishing pads achieve 10%-30% increased removal rate for W, ILD, and Cu bulk processes and 10%-20% reduction in defectivity in W and Cu applications, with better dishing and erosion in W applications vs. the IC1000 pads. Dow Electronic Materials, Newark, DE; 302/366-0500, www.dow.com.
Thermal analysis software
The FloTHERM 3D computational fluid dynamics simulation software provides bottleneck and shortcut fields to help engineers identify where and why heat flow congestion occurs in electronic designs, and identifies thermal shortcuts to resolve the problems. Enhancements in FloTHERM 9 include XML model and geometry data importing to enable integration into existing data flows, and a direct interface to Mentor Graphics' Expedition PCB design platform. Mentor Graphics, Wilsonville, OR; 503/685-7000, www.mentor.com.
Switch mainframes for semi test
These switch matrix mainframes (six-slot Model 707B and single-slot Model 708B) offer an embedded test script processor so test scripts can be executed within the instrument, enabling faster connect-source-measure sequences, and a digital control platform that supports faster command-to-connect speeds—overall system throughput is improved by up to 40% without changing any code, the company claims. Features include an updated front panel interface to simplify tasks e.g. configuration management and switch pattern programming, and a choice of GBIP, LXI, or USB interface options. Keithley Instruments, Cleveland, OH; 440/248-0400, www.keithley.com.
Wafer-edge metrology, inspection
The Visedge CV300R-EP edge metrology and inspection tool provides a calibrated measurement of the wafer edge profile, including slope of the bevel on which the film edge may land. It offers simultaneous edge defect inspection and multilayer metrology in the near-edge and top bevel regions, as well as patterned areas (including partial die). Other capabilities include multichannel (specular, scatter, phase) defect imaging and binning in the near-edge, top/bottom bevel, and apex regions of the wafer; enhanced performance of low-contrast films; ability to detect buried edges in dielectric films; and a rotating optical head to eliminate "blind spots" and "stitching" errors. KLA-Tencor, Milpitas, CA; 408/875-3000, www.kla-tencor.com.
Dual-chamber CVD diamond reactor
The Model 665 hot-filament CVD dual-chamber diamond deposition reactor can accommodate up to 18 100mm-dia. substrates at a time, doubling the throughput of the previous Model 650 (1.1µm/hour) but at 40% lower cost. Process controller and associated electronics, gas distribution, and pressure (vacuum) control simultaneously serve the two chambers. The system uses existing recipes with only minor pump down/cooldown step-time modifications. Target markets are CMP pad conditioners and diamond-coated electrodes for water treatment, and development of higher-volume deposition equipment for diamond interlayers on semiconductor wafers. sp3 Diamond Technologies, Santa Clara, CA; 408/492-0630, www.sp3inc.com.
Magnetically levitated turbopumps
The HiPace M series offer high pumping speeds (300 l/s, 700 l/s and 800 l/s) and high compression ratios for all gases, optimized to run in all orientations with a low vibration signature. The pumps are rated Protection Class IP54 for harsh industrial environments. An intrinsically low dynamic magnetic field does not interfere with even the most sensitive equipment. An integrated electronic drive unit reduces the need for cabling and cable failure. Power consumption and run-up time also have been reduced. An optional sealing gas connection safeguards against particulate buildup and oxidizing gases. Pfeiffer Vacuum, Nashua, NH; 408/956-2578 x309, www.pfeiffer-vacuum.com.