Issue



Prodcut News


04/01/2010







Nanopatterning tool for HDD

Click to Enlarge

The NuTera HD7000 jet-and-flash imprint lithography platform is designed for pilot and volume manufacturing of patterned media hard-disk drives, enabling sub-20nm lithography with throughput of 300/hr double-sided disks. An "IntelliJet" drop pattern technology dispenses picoliter-sized resist droplets, which improve residual layer thickness uniformity and pattern fidelity, and ultimately disk yields. It integrates smoothly into a fab's existing robotic material handling system, with about half the footprint space of the company's Imprio HD2200 platform. Molecular Imprints, Austin, TX; 512/339-7760, phofemann@molecularimprints.com, www.molecularimprints.com.

Resist stripper for BEOL wafer bumping

The ACL-585 Xl HiPer-Solv aqueous resist stripper is designed for fast, noncorrosive removal of dry film photoresist used in wafer bumping, compatible with Pb/Sn, Sn/Ag, Al, Ti, Cu, Ni, Cr and other thin films found in bump and UBM layers; it also can be used for through-silicon vias (TSV) and other thick -resist processes e.g. in MEMS. It can work in batch immersion and spray applications, removing dry film resists at <70°C temperature (which minimizes evaporative loss), with maximum cycle time 30mins. Increased bath life to 48 hrs translates to added wafer capacity and less chemical usage, the company says. It is 100% wafer-soluble, does not require an intermediate post-process solvent rinse (requires only a DI water rinse, no post-strip rinse solutions or IPA), and is a drop-in replacement—all of which, the company calculates, translates to a 40% cost savings vs. traditional photoresist stripping chemistries. Applied Chemical Laboratories, Sunnyvale, CA; 408/737-8880 x210, info@appchem.com, www.appchem.com.

Rotary tables for 300mm wafers

The RotoRing300&apos;s large 350mm-dia. center opening allows eased extraction of chip dies from precut wafers during semiconductor assembly. Direct drive rotary tables offer larger angle of wafer alignment and complete rotation of the wafer (360° at up to 100rpm) to reduce die transfer time. The large-diameter air bearing system provides stiffness for high payloads; backlash, friction, and wear inherent in conventional worm, screw, and belt drives are eliminated. Up to 24 modules can be installed for higher torque capability than the standard 40Nm. Positioning accuracy is 2 arc-sec even during fast Cartesian (XY) wafer indexing. Tight tolerances on the axial and radial air bearings allow both axial and radial run-outs "well under 10 microns," the company claims. IntelLiDrives, Philadelphia, PA; 215/728-6804, info@intellidrives.com, www.intellidrives.com.

Robust turbopump

Click to Enlarge

The HiPace 60 turbopump has an improved rotor design that enables high pumping speeds (for Ar/CF4/H2/He/N2: 63/51/28/48/64 l/s) and high gas throughputs (for Ar/H2/He/N2: 0.83/55/55/9.2 mbar l/s). Innovative materials double the drives&apos; service life, and runup time has been reduced to 1.1min; it is also insensitive to particle matter and dust. A sealing gas connection safeguards the bearings against particulate matter or oxidizing gases. Remote and sensor functionalities enable pump data such as temperatures to be analyzed. Integrated drive electronics reduce the need for cabling. A variety of drive versions, including Profibus and DeviceNet, are available with no increase in physical size. Aluminum housing makes the pump extremely lightweight (2.2kg), and its surface design offers significantly improved cooling (convection cooling is standard; air/water is optional). Pfeiffer Vacuum, Asslar, Germany; +49(0)/6441-802-169, contact@pfeiffer-vacuum.com, www.pfeiffer-vacuum.de.

Antireflective coatings for KrF, ArF

The ARC DS-K101P developer-soluble bottom anti-reflective coating (DBARC) targets <150nm CD processes for implant and a viable cost reduction for BEOL layers at the 22nm and beyond nodes. It has <1ppb ions while maintaining broad resist compatibility and tunability of its predecessor (ARC DS-K101); it offers "tight" n and k optical constants, while developer solubility can improve throughput by eliminating an etch step, the company claims. The ARC 29L ArF immersion bottom antireflective coating (BARC) also provides broad photoresist compatibility and tuned optical properties (i.e., a lower k value, and <0.1% reflectivity for <40nm-thick films) to enable improved reflectivity control on absorbing substrates (e.g., SiON, TiN, SiN) for use as a top layer in a dual-layer BARC stack or as a single-layer BARC on SiON. Brewer Science, Rolla, MO; 573/364-0300, cwashburn@brewerscience.com (for DBARC) or rcox@brewerscience.com (for ARC), www.brewerscience.com.

More Solid State Technology Current Issue Articles
More Solid State Technology Archives Issue Articles