New Products


HB-LED mask aligner

Click to Enlarge

The EVG620HBL adds a high-intensity UV light source and five cassette stations to enable continuous fabrication of devices—up to 165 wafers/hour throughput aligned for 150mm wafers (up to 220 WPH in first print mode), with "sub-minute" tool conversion time for different substrate sizes. Pattern resolution is ≤0.6µm (vacuum) and 2.0µm (proximity). Accuracy is ±1µm (topside live) and ±1.5µm (bottom side). A recipe-controlled microscope illumination spectrum ensures best pattern contrast with various wafer and layer materials, including sapphire, silicon carbide (SiC), aluminum nitride (AlN), metal, and ceramic. Other features include separate adjustable wafer contact force for wafer wedge compensation and contact exposure besides proximity exposure capability. EV Group, St. Florian, Austria; +43/7712-5311-0,

Wafer inspection for LEDs

Click to Enlarge

The ICOS WI-2220 LED wafer defect inspection provides sensitivity to critical defects (while minimizing noise introduced by process variations) and offers "outstanding" over- and underkill performance (die misclassification) at high inspection speed, the company claims. Features include: compatible with 2-8 in. wafer sizes (whole and diced), resolution down to 0.7µm, macro inspection sensitivity in the pre- and post-dice inspection (i.e. front- and back-end), and integrated real-time classification and metrology. New proprietary inspection and data processing technology enables low-image distortion, advanced optic filtering, rule-based binning (RBB) for real-time auto defect classification, and advanced metrology capabilities. It can be upgraded to the WI-2250 for flexible configurations. KLA-Tencor, Milpitas, CA; 408/875-3000,

Si wafer double-side lapping

Click to Enlarge

The AC-2100L system, a new version of the microLine double-side lapping system, features independently driven inner and outer pin rings for maximum process control, and automatic force calibration to compensate for weight loss of the upper lapping wheel due to typical process wear. It can be configured with a non-contact, optical gauge for in-situ wafer thickness metrology for closed-loop process control. A new larger lapping wheel (2100mm outside dia.) allows use of five carrier rings, for a batch size of twenty 300mm wafers—or up to eight 450mm wafers, the company notes. The machine head swivels out for easier cleaning and maintenance. Peter Wolters, Rendsburg, Germany; +49/0-4331-458-0,

Photomask registration correction

Click to Enlarge

The RegC builds an ideal closed-loop application from the company's PROVE registration metrology tool, enabling correction of high-end photomasks for remaining registration errors after the pattern generation process, to reduce the overlay error in wafer printing. Current results give evidence of registration improvements over 50%. It can be used to significantly correct the registration errors of any single photomask or groups of photomasks of the same mask set toward optimal wafer overlay values, or to correct the diminutive pellicle impact on the overall registration budget (the RegC process can be run after the pellicle has been applied). Carl Zeiss SMS, Jena, Germany; +49/3641-64-2242,

Variable-property BARC

Click to Enlarge

The ARC 300 series of ArF bottom antireflective coatings provides broad photoresist compatibility and variable optical properties, allowing for a range of n and k values in a single BARC platform. It provides low reflectivities (<0.1%) for a variety of substrates and film thicknesses. Ideal application is in extending leading-edge ArF dry and immersion lithography processes in both single- and double-patterning schemes, the company says. The ARC 300 is designed for use with the company's new OptiStack simulation software, which lets users optimize lithography conditions while maintaining the desired multilayer thicknesses, so that existing optical proximity correction (OPC) and etch recipes can be used. Brewer Science, Rolla, MO; 573/364-0300,

Surface imaging software

Click to Enlarge

The Leica Map software, based on Digital Surf's Mountains technology, is used to visualize and quantify features of measured surfaces, characterize surface texture and geometry and generate visual surface metrology reports with full traceability. A "Start" version offers real-time surface imaging (used with the company's Montage software) by generating a depth map and extended focus image. A version for the company's dual-core 3D microscope adds ISO 16610 filtering techniques for separating surface roughness and waviness, basic functional analysis (bearing ratio, depth distribution, etc.), and the ability to extract sub-surfaces (e.g., mechanical and electronic components and MEMS). A Premium version is compatible with single-point tactile and optical profilometers and scanning probe microscopes as well as with optical microscopes. Leica Microsystems, Wetzlar, Germany; +49/6441-29-0,

3D simulator for IC, MEMS fabrication

Click to Enlarge

The SEMulator 3D 2011 software for semiconductor and MEMS virtual fabrication provides a 3×-4× performance boost in model building time—e.g., more than 3× faster for a 25nm flash memory application, the company says—with robust 3D mesh generation capabilities that create silicon-accurate meshes for physics-based simulations used to optimize the performance and manufacturability of semiconductor and MEMS devices. New to the 2011 version is the first release of SEMulator3D Reader, a downloadable interactive 3D model viewer that lets users share device models that can be interacted with directly: manipulate the 3D view, see a cross section at any location, toggle visibility of layers, animate the fabrication process, and add comments and annotations for each process step. Coventor, Cary, NC; 919/854-7500,

Sapphire wafer carriers

New carriers for sapphire wafers feature ±1.2µm thickness and part-to-part uniformity, with parallelism to 10 arc-sec (depending upon size) and Moh 9 hardness, second only to diamond. They are resistant to chips, chemicals, and scratches, and impervious to solvents and etchants. They are custom-fabricated in 2-6"dia.
sizes (thinness to 0.018-in), and can be supplied with flats, laser markings, and other special characteristics. Meller Optics, Providence, RI; 800/821-0180,

More Solid State Technology Current Issue Articles
More Solid State Technology Archives Issue Articles