Issue



Product News


05/01/2009







TC vacuum gauge controller

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A low-cost benchtop thermocouple vacuum gauge controller measuring atmosphere to hard vacuum, the MAS-200LED-V vacuum gauge measures vacuum in Torr and features a 531 type thermocouple vacuum gauge tube that senses vacuum and displays the results on a large LED readout. It is capable of performing measurements from 0.001 to 760 Torr, it enables troubleshooting for vacuum system. Packaged in a rugged case, the MAS-200LED-V vacuum gauge controller operates on 115 VAC, can output readings to an optional RS232 serial connection, and can also be used as a vacuum transmitter to a PLC or similar device. MV Products, Billerica, MA; ph 978/667-2393, drolph@massvac.com, www.massvac.com.

Automatic impedance matching network

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The CPMX1000, designed as a cost-effective alternative for power applications up to 1250W, handles RF currents of 20A and is designed with air-variable capacitors. It can be used as a stand-alone unit or controlled remotely, with DeviceNET, standard RS-232, and analog control options. The system features PROTRAK, a high-speed tuning algorithm that gradually slows the system as it approaches the tuning point, allowing a precise match in high-Q loads. The Match Pro adjusts input impedance to 50O in response to the changes in load characteristics during the process. The CPMX1000 is configured to operate at fixed frequencies from 2-27.12 MHz and features automatic and manual modes with local and remote manual control of tuning capacitors, and the ability to preposition capacitors to the optimal plasma ignition point prior to turn-on. Comdel, Inc., Gloucester, MA 01930; ph 800/468-3144, marybeth_masterson@comdel.com, www.comdel.com.

DUV interferometer

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The FizCam DUV interferometer measures optics and optical systems at 193nm wavelength deep ultraviolet (DUV), even in the presence of vibration and air turbulence. A single-camera, high-speed optical phase sensor measures in less than 5msec. Short acquisition time enables measurement accuracy in heavy vibration and air flow. The components are built to the specifications of DUV optics manufacturing, stainless/electroless nickel plated, and the laser path is entirely contained in a purged nitrogen environment. The system includes the interferometer, beam line containment and alignment system, and complete high-speed computer system. Motorized controls include 2?? discrete optical zoom, focus, polarization, input beam alignment, transmission flat tip/tilt, and optional return flat tip/tilt. 4Sight wavefront analysis software enables 2D and 3D analysis and visualization, as well as comprehensive filtering, masking, database, and import/export. 4D Technology Corp., Tucson, AZ; ph 520/294-5600, info@4dtechnology.com, www.4dtechnology.com.

Measurement and analysis of micro- and nano-fibers

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The Fibermetric system powered by the Phenom personal electron microscope is designed to discover and quantify the properties of woven and nonwoven fiber samples quickly, making direct observation and measurement of micro- and nanofibers faster, more accurate, and easier. The integrated turnkey system for sub-micron fiber imaging and automated measurement automatically collects hundreds of measurements per image and generates fiber and pore size distribution plots for quality control and for predicting application properties such as filtration efficiency. The Fibermetric system requires no laboratory infrastructure or specially-trained personnel. Sample loading time is <30sec, and an automated measurement capability generates statistically valid data quickly. Magnifications up to 24,000?? produce accurate information on fibers as small as 100nm in diameter. It features a 4.9nm/pixel resolution and a Gaussian fit function, which automatically finds and measures fibers and pores. Nanofibers with diameters of 100nm are routinely measured with >97% accuracy. FEI, Hillsboro, OR; ph 503/726-7698, dan.fineberg@fei.com, www.fei.com.

FIB-SEM workstation

The AURIGA CrossBeam (FIB-SEM) workstation has a redesigned vacuum chamber, now with 15 ports for different detectors. A charge compensation system enables the local application of an inert gas flush to neutralize electrostatic charging of non-conductive samples and detect secondary electrons as well as backscattered electrons. The GEMINI FE-SEM column’s special in-lens EsB detector offers images with good material contrast, and its design enables analysis of magnetic samples. Features include simultaneous milling, high-resolution SEM imaging, and a high-resolution FIB with a top-level resolution of =2.5nm. Other features include advanced gas processing technology for ion and e-beam-assisted etching and deposition. The system can be upgraded up to a full CrossBeam workstation, including FIB column, gas injection system, charge compensation, and various detectors. Carl Zeiss SMT AG, Peabody, MA and Oberkochen, Germany; www.smt.zeiss.com.

200kV aberration-corrected S/TEM

The JEM-ARm200F atomic resolution analytical microscope enables both atom-by-atom imaging resolution and spatial resolution for atom-to-atom chemical mapping of materials, including energy-dispersive X-ray spectroscopy and electron energy-loss spectroscopy. The new TEM platform achieves high-angle annular darkfield resolution of 0.08nm. The electron column design integrates S/TEM with Cs correction for atomic spatial energy resolution combined with high probe currents for microanalysis. The shielding design safeguards the ultra-high-powered optics from airflow, vibration, and acoustical interference; additional shielding protects against electronic interference, magnetic fields, and thermal fluctuations. Software automation adds tomography and holography. JEOL USA Inc., Peabody, MA; ph 978/535-5900, www.jeolusa.com.

Metal bonding adhesive

Supreme 10HT is a one-part, heat resistant adhesive formulated to cure at elevated temperatures and offer good metal bonding performance and easy, fast assembly. Serviceable over a temperature range of 4 K to 400°F, it exhibits resistance to impact, thermal shock, vibration, and fatigue cracking. The adhesive withstands severe thermal cycling and resists many chemicals including water, oil, fuels, and most organic solvents even upon prolonged exposures. It meets NASA low outgassing specifications. Supreme 10HT achieves strong bonds featuring high shear and peel strength between aluminum, brass, titanium, steel, Nitenol, Kovar, rubbers, and plastic to metal. No mixing is necessary prior to use; the high viscosity remains constant with time and unlimited working life is retained at room temperature. Master Bond, Hackensack, NJ; ph 201/343-8983, technical@masterbond.com, www.masterbond.com.

32nm node all-plane inspection

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The TeraScanXR high-resolution reticle-, aerial- and wafer-plane inspection system offers sensitivity, lower cost/inspection, and faster mask dispositioning inspecting down to the 32nm node. Inspection planes include high-resolution reticle-plane inspection to capture process defects during development and manufacturing; aerial-plane inspection to filter out certain non-printing defects; and wafer-plane inspection to predict which reticle defects will print on the wafer. Features included upgraded optics, electronics, and algorithms to improve overall sensitivity to meet 32nm requirements. A throughput improvement makes the TeraScanXR up to 3?? faster than the previous generation. The platform is designed to accurately predict defect printability regardless of pattern density. KLA-Tencor Corp., Milpitas, CA; www.kla-tencor.com.

Die bonder

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The 2009 SSI soft solder die bonder boasts up to 50% higher speed than conventional equipment. Process control helps cut gas consumption by up to 50%, and reduce cost/chip for applications including a variety of packages and power modules. An advanced fast indexer exchange concept enables fast conversion from one product to another. Benefits include a high-speed point to line pick-and-place, and high-accuracy dispensing technology; capability to handle ultrathin and ultrawide leadframes; product changeover with exchangeable indexer; expandable machine design, multi-process capability and ultra-thin die handling; and a new power package design. Oerlikon Esec, Cham, Switzerland; ph 41/41-749-5847-6330, communications.esec@oerlikon.com, www.oerlikon.com.

Upgraded characterization system

Hardware, firmware, and software enhancements to the Model 4200-SCS semiconductor characterization system include nine new solar cell test libraries that expand capabilities for solar cell I-V, C-V, and resistivity testing applications. An expanded frequency range for the system’s capacitance-voltage (C-V) measurement capability, and support for the company’s new 9-slot Model 4200-SCS instrument chassis. The software upgrade also supports drive-level capacitance profiling (DLCP) providing defect density information on thin-film solar cells; existing Model 4200-CVU capacitance-voltage unit cards can be modified to support this testing technique. The Model 4200-CVU’s frequency range has been expanded to 1kHz-10MHz to support DLCP testing; this also expands the system’s support for testing flat-panel LCDs and organic semiconductors such as organic light-emitting diodes (OLEDs). To address continuing growth in I-V, pulse, and C-V characterization applications, the V7.2 upgrade provides support for a nine-slot instrument chassis. A high-performance triaxial cable kit is included to connect the Model 4200-SCS to a prober. Keithley Instruments Inc., Cleveland, OH; ph 800/688-9951, www.keithley.com.