High repetition rate EUV source
The EQ-10HR operates at a high pulse rate of 10kHz to simulate the requirements of high-volume manufacturing for EUV lithography implementation. Patented electrodeless “Z-Pinch” tech-nology inductively couples the current into the discharge plasma, making
the plasma extrem-ely stable and controllable; the plasma is confined away from source components, reducing debris. Energetiq, Woburn, MA; ph 781/939-0763, www.energetiq.com.
Nondestructive Hall mobility testing
The LEI 1605 manually measures electron mobility (EM) through a non-destructive contactless means on a variety of substrates and materials in situ, without van der Pauw Hall and Parallelepiped or Bridge Type methods. Electron mobility can be measured afTer each epitaxial layer deposition, enhancing the ability to monitor specific stages of process control. Optional upgrades allow for measuring electron mobility in the range of ∼300-20,000 cm2/v.sec and sheet resistance from ∼100O-3kO/square, as well as a mapping capability. Lehighton Electronics, Lehighton, PA; ph 717/917-6940, www.lehighton.com.
Confocal materials microscopy
The LSM 700 laser scanning microscope combines fluorescence and reflection techniques enables high-precision examination of semiconductors, metal, glass, and polymers with precise 3D imaging. (Image is a 3D surface topography of a solar collector.) Carl Zeiss, Thornwood, NY; ph 914/681-7627, www.zeiss.com.
300mm coat/develop cluster for 3D integration
The ACS300 GeN2 is a modular system for coating, baking and developing of 200mm-300mm wafers, for various special spin coating applications such photosensitive polymers like polyimide, PBO or Cyclotene (BCB). Features include concurrent wafer processing without mechanical changeover, closed bowl coating technology, and a 6-axis robot for handling heavier substrates such as stacked wafers or carrier solutions. Suss MicroTec, Garching, Germany; ph 49/89-32007-395, www.suss.com.
Source mask optimization sofTware
The Tachyon SMO (source mask optimization) sofTware co-optimizes and analyzes scanner source and mask design simultaneously, extending 193nm low-k1 imaging, with what the company claims is a 40% process window improvement vs. previous iterative techniques. Features include customized simulation and optimization engines and edge placement error metric optimization; measured parameters from ASML scanners (custom and freeform DOE models) and a proprietary pupil modeling capability. Brion Technologies, Santa Clara, CA; ph 408/653-1500, www.brion.com.
Solar, coating pumps
The RUVAC WH Roots pump series (4400 and 7000) incorporate a hermetically sealed motor and integral liquid cooling technology in a small and energy-efficient package. The motor is isolated by an epoxy-encapsulated enclosure instead of the traditional metal “can,” enabling lower temperature, eliminating shafT seals, and potential for leaks. Integrated liquid cooling in the gear cover and motor housing reduces half the amount of heat radiated into the ambient area. The pumps can be started at atmospheric pressure with an optional by-pass-line. Oerlikon Leybold Vacuum, Cologne, Germany; ph 49/221-347-1261, www.oerlikon.com/leyboldvacuum.
Full-wafer contact probe card for flash memory
The Harmony OneTouch ATC for 300mm flash memory wafers (128MB NOR to 64GB NAND devices) provides as much as 25% improved planarity over the company’s previous-generation platform. Improved X/Y placement accuracy offers high accuracy at both hot and cold test insertions using the same probe card. It supports the company’s RapidSoak technology that reduces by up to 50% the time required to reach thermal equilibrium, and improves scrub consistency by compensating for temperature variation related to wafer chuck movements. FormFactor, Livermore, CA; ph 925/290-4681, www.formfactor.com.