On the Move
John Boruch returns to the role of Amkor Technology Inc.'s (Chandler, Ariz.) president and COO, following the resignation of Bruce Freyman. Boruch joined Amkor in 1984 as corporate vice president of sales, was promoted to president in 1992, CEO in 1999, and vice chairman in 2004. "I'm glad to be back in the role as president and COO of Amkor, and I'm excited about the future of our company," says Boruch. "My initial focus is to articulate a clear direction for the future through a renewed focus on total customer satisfaction."
Wan Choong Hoe is the new COO of STATS ChipPAC Ltd. (Singapore), reporting directly to Tan Lay Koon, the company's president and CEO. Hoe previously worked at National Semiconductor Singapore Pte. Ltd., where he held senior management positions.
Universal Instruments Corp. (Binghamton, N.Y.) promoted Ian deSouza to president. Formerly serving as the company's senior vice president of Operations and Systems, deSouza replaces Ian McEvoy.
SEMI (San Jose, Calif.) has appointed Tetsuro (Terry) Higashi chairman of its Board of Directors. Higashi is the chairman of Tokyo Electron Ltd. He succeeds George Chamillard, chairman of Teradyne Inc.
Frank Gitmans is now the managing director of FEINFOCUS' global headquarters in Garbsen, Germany. Gitmans is responsible for all aspects of the company's headquarters operations, including R&D, systems and tube manufacturing, sales, and profitability.
NEXX Systems Inc. (Billerica, Mass.) recently named Mark Welsh as product marketing manager for the Stratus electrodeposition product line. Welsh is responsible for Stratus product development, as well as roadmap and market requirement efforts. He has 20 years of product and sales management experience in semiconductor processes and OEM equipment.
Nathan John is Anadigm's (Tempe, Ariz.) new vice president of worldwide marketing. John is responsible for new product definition and market expansion for the company's line of programmable SoC devices.
Honeywell Electronic Materials (Sunnyvale, Calif.) recently named Theo Gibson as its director of information technology. He has been with the company for 5 years, and has held various roles of increasing responsibility in the aerospace and transportation systems business segments.
Michael O'Donoghue is the new executive director of IMAPS (Washington D.C.). O'Donoghue replaces Richard Breck, and brings more than 15 years of international business and association management experience to the position.
Binghamton Semiconductor Packaging LLC (Binghamton, N.Y.) has appointed Ron Blankenhorn interim CEO and vice president of sales and marketing.
Scott J. Jewler was appointed chief strategic officer of STATS ChipPAC Ltd. Jewler formerly held various management positions at Amkor Technologies Inc., including senior vice president of the Assembly Business Unit and vice president of Laminate Products.
Pac Tech GmbH, a German supplier of services, equipment and chemicals for semiconductor wafer bumping, has appointed Thorsten Teutsch president of its U.S. operations in San Jose, Calif.
Carsem (Scotts Valley, Calif.) is increasing its capacity for the micro-leadframe package (MLP) family to a total of 155 million units per month. In September 2003, Carsem had a monthly capacity of 50 million in its Malaysian factories. Since then, it has been increased to a current capacity of 90 million, and the company plans to ramp to 135 million by November 2004.
Asymtek (Carlsbad, Calif.) has added four new teams of sales distributors to represent their line of automated fluid dispensing systems in China: D-TEK, Leeport, Antais Electronics Technology Company Ltd. (ATS) and Samurai Spirits Inc. (SSI). These new representatives join Asymtek's long-term distributor, Electronic Scientific Engineering (ESE), to form a strong network to serve all market segments and regions in China.
ASAT Holdings Ltd. (Hong Kong and Pleasanton, Calif.) announced financial results for the first quarter of fiscal year 2005 (ended July 31, 2004). Net revenue in the first quarter was $55.5 million, a 12% decrease compared to $63.0 million in the fourth quarter of fiscal 2004.
STATS ChipPAC Ltd.'s Singapore operation has recieved ISO/TS 16949:2002 certification. The company has achieved the same certification in South Korea, Malaysia, China and Taiwan.
Sporian Microsystems Inc. (Boulder, Colo.) has received a follow-on contract from the U.S. Department of Energy to develop a high-temperature MEMS sensor that will be used to monitor temperature and pressure under extremely harsh conditions — up to 1,400°C. The contract will extend into late 2006.