New Products


Hybrid Module Assembly System

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APS 1-H is a versatile hybrid module assembly system that combines a solid foundation and advanced technology to handle complex hybrid assembly at high throughput rates. The solid foundation enables the system to attain ±0.0005" (0.012 mm) 3-sigma placement repeatability. It also meets hybrid module production challenges with highly repeatable performance and configuration flexibility. To complement its accuracy, the hybrid module assembly system supports various die presentation formats, including wafer, gel-pak, surftape and waffle packs. It features a large, flexible tabletop that accepts up to 108 2-in. waffle packs or a custom configuration to meet unique application requirements. The system provides multiple methods for component alignment and upward vision. Components are optically aligned during travel from pick-up to placement, maximizing throughput and utilization. The upward vision system provides a secondary means to align devices such as flip chips, BGAs and QFPs. Tyco Electronics Automation Group, Willow Grove, Pa.,

Multichip Die Bonder

Model 4501 is the most flexible and versatile die bonder on the market. Starting with a 25 × 6" die bond placement area, the system offers numerous technologies in one chassis, including epoxy-stamping, two reservoirs; epoxy-dispensing; eutectic die bonding with fully programmable oven; dual magnification optics; auto changer for stamping and pick-up tools (18 different tools possible); auto changer for wafer/waffle/gel-pak (up to 200 different die in the chassis); flip chip; look-up camera; and tape-and-reel. This material flexibility combines with the linear motor control design to offer a high-speed, accurate (±5 µm) die bonder capable of handling 6-mil-square die down to 15-µm thicknesses. F&K Delvotec, Foothill Ranch, Calif.,

Advanced Packaging Dispense System

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DispenseJet DJ-9000 is fast, easy to clean and delivers capabilities for advanced packaging. The dispenser jets underfill, silver epoxy, UV-cure adhesives, encapsulants and conformal coatings. Ideal for stacked-die and densely packed boards, the system jets in spaces as tight as 200 µm. Small underfill fillets, wet-out areas, dot diameters and shot volumes are achieved with the new jet. Jetting overcomes limitations of needle dispensing to deliver the following benefits: speed — high flow rates up to 50 mg/sec; high shot rate up to 200 dots per second; no Z-axis motion; jets "on the fly" with no stopping between dots; less height sensing; and no needle backtracking to prevent fluid stringing. Quality — high accuracy; smaller wet-out areas; round, uniform dots; and improved line quality. Low cost-of-ownership — small, wetted path means less fluid waste; cleaning in 10 min. without tools; reasonably priced consumable parts; no under-board support required; and one jet handles multiple fluid types. Asymtek, Carlsbad, Calif.,

Mass Imaging Technologies

This company's mass imaging technologies allow virtually any semiconductor packaging material typically deposited by a dedicated dispensing system to be imaged using a screen printing platform. Advantages to this technology include faster throughput compared to dispensing; reduced factory floor space; better control of material deposition; lower control of material usage; and more. Notable innovations have addressed the needs for precise alignment of singulated substrates within a carrier, and the challenge of depositing materials onto partially populated substrates: New edge referenced virtual panel tooling (ERVPT) independently aligns any number of singulated substrates before lifting to the printing position, effectively panelizing the substrates with speed and precision; PumpPrinting stencils and ProFlow technology solve the challenge of partially populated substrates and material management, and the stencil underside can be CNC-machined to clear obstructions without impairing process control or repeatability. DEK International GmbH, Zurich, Switzerland,

Flip Chip Capillary Underfill

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Hysol FP4547FC is the first capillary flip chip underfill designed to be compatible with clean and no-clean flux residues. This underfill protects lead-free flip chip devices, and allows them to meet JEDEC Level 3/260°C moisture test requirements. By incorporating two patented additives that remove and neutralize flux residues from between the flip chip die and substrate, the material delivers results on high-performance assemblies. This underfill meets the new JEDEC requirements for lead-free flip chip assembly, while providing good thermal cycle performance and simplifying the assembly process. In most cases, post-assembly flip chip cleaning processes may be eliminated, saving manufacturing time and capital resources. Ideal for OEMs and subcontractors assembling lead-free flip chip packages, the underfill is qualified on build-up laminate flip chip packages at JEDEC L3/260°C and on ceramic flip chip packages at JEDEC L1/260°C. Henkel Corp., Industry, Calif.,

Assembly Workcell

Newport MRSI-605 AP is an ultra-precise, high-speed assembly workcell for epoxy die attach, eutectic bonding and flip chip. Closed-loop force control enables the handling of delicate components such as GaAs die. Linear motors with glass-scale encoder feedback provide high precision. One throughput improvement offered by the system is a six-tool turret for automatic tool on-the-fly changes. Each tool features closed-loop, independent force control and rotates over a full 360°, valuable for high-power RF applications. Some machine features include 10-µm placement accuracy, epoxy stamping, two dispense pumps, eutectic bonding and direct pick from multiple wafers. The workcell can be configured for standalone production, cassette-to-cassette material handling or in-line with other process equipment. Ease of use is a major advantage due to the Windows software with an intuitive design that reduces operator training and improves programming efficiencies. The software is complemented by the advanced vision system that can locate and align complex die over a 360°. Newport, Corp., North Billerica, Mass.,

High-performance Reflow Oven

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ELECTROVERT OmniExcel 7 is a high-performance reflow oven that delivers reflow and curing processes while focusing on reduced lifecycle costs. An innovative chamber design ensures uniform heat transfer, zone-to-zone segregation and up to 50% reduction in energy consumption. The combination of heat on intake and closed-loop blower control ensures a stable environment for various production requirements or product mass. Nitrogen consumption is reduced by 30 to 40% by balancing airflow patterns within the full system and the integration of curtain modules to control incoming air. The system also meets numerous processing needs including curing, lead-free and hybrid package processing. It also can be configured with 7 or 10 heating zones. With a 24" process width, it is capable of handling large boards and pallets. Speedline Technologies, Franklin, Mass.,

Wafer Bumping Paste

SE-CURE 7501 paste is formulated for in-situ stencil wafer bumping applications, and provides superior printing performance in the bumping process, even with bump pitches below 125 µm. The paste features a viscosity that remains stable over a minimum of a manufacturing shift, providing a stable and consistent printing operation. Removal of all organic residues or cleanliness is vital to the performance and acceptance within the semiconductor packaging industry. The bumping paste was engineered to be a drop-in solution with all the other process modules of the patented bumping process such that further current chemicals would not be modified or changed. The paste is available with Sn/Pb, and optimized formulations are available for lead-free and other solder alloys. Kester Inc., Des Plaines, Ill.,

Lead-free Kit

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SlimKIC 2000 Lead-free Kit handles the higher process temperatures required by lead-free assemblies. The kit includes a stainless steel thermal barrier that offers heat protection up to 350°C and medium-temperature thermocouples rated up to 400°C. The kit's optional KIC Auto-Focus provides the best "first guess" and automatic optimized oven setup for lead-free applications. There is no product wastage from improper formulas and product yields are greater. The user-friendly software uses patent-protected technology to automate most of the time-consuming tasks associated with profiling. It also maintains a library of hundreds of the most popular solder pastes and adhesives to quickly define the appropriate process window. The powerful user interface guides the operator through the profiling process, minimizing the potential for improper oven setup and yield-reducing defects. KIC, San Diego, Calif.,

In-line AOI System

The high-speed AutoInspector Series Ultra II identifies assembly defects on PCBs and enables in-line process control. Inspections include paste, pre-solder, and post-solder SMT and mixed-technology boards as well as solder balls on BGAs, wafer bumps and substrates. The inspector is a true multi-application platform and can be deployed anywhere in the assembly process, from post-print to post-wave inspection. With the company's quad-angle lighting, no hardware adjustments are necessary when changing the inspection application. These SMEMA-compatible inspection systems can be operated in- or off-line. To save time and for ease of use, the programs can be done 90% off-line. Programs can be transferred with no additional tuning requirements. A solid unibody frame, three-point-suspension design, ultra-high precision linear stage, quad speed digital cameras and high-resolution optics provide a copy-exact hardware platform that offers maximum program transferability and maximum equipment reliability. Comprehensive off-line tools enable centralized engineering support and multi-part program rollout. Machine Vision Products (MVP), Carlsbad, Calif.,

All-temperature Cleaner

AQUANOX A4520 is for enhanced cleaning of a spectrum of pastes, fluxes and uncured adhesives used in the electronics and semiconductor industries, and featuers low VOC. The cleaner has less waste and emmisions than other cleaning products, and has proven effective on cleaning more than 95% of lead-free pastes. The low-foaming concentrated cleaner is effective at temperatures ranging from ambient to 160°F for removal of no-clean, rosin, tacky, and lead-free flux, pastes and uncured adhesives via spray, immersion or manual applications. The cleaner offers greater than 50% throughput increases for lead-free and no-clean materials. Because the material operates at lower temperatures and concentrations, fewer chemicals are used. For spray applications, the product will work in a concentration range of 5 to 30% diluted with de-ionized water. Kyzen Corp., Nashville, Tenn.,

Dual-row Quad Leadless Package

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QLP-DR is a low-cost, leadframe-based, near chip scale package that offers good electrical and thermal performance for wireless applications. The significance of the package is in the leadframe design that features two rows of staggered I/O terminal pads with an exposed die pad for die grounding and improved thermal performance. The package provides the advantages of a single row quad flat no-lead (QFN) package, including performance, reliability and manufacturability, with the added benefit of up to 50% more I/O terminal pads for the same body size. By using the same materials set and manufacturing process as a standard quad leadless package, QLP-DR offers a high-performance solution with high yield and reliability at a lower cost than many laminate- or tape substrate-based chip scale packages and wafer-level chip scale packages. STATS, Boise, Idaho,

Digital X-ray System

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Dage XD6600 offers magnification of up to 5,800X and acquires images with a resolution of 1,300 × 1,000 pixels and more than 65,000 levels of grayscale over the 16 × 18" inspection area. An improvement over existing technology with >4× the number of pixels and 4× the grayscale level, the X-ray system inspects and analyzes larger images at increased levels of detail of the subtle grayscale differences needed for quality control. Inspection analysis is controlled by the ImageWizard, Rev10, which is an easy-to-use and intuitive operating software system enabling procedures to be taught simply, and providing the user with more time for analysis without effecting throughput. The inspection system comes standard with the following: A 19" digital LCD monitor providing a large and clear field of view; <600nm minimum feature recognition; oblique angle view from 0° to 45° for any view 360° around any position over the inspection area; and up to 5,450X magnification (1,400×, geometric). Dage Precision Industries, Fremont, Calif.,

Leadframe-based Technology

AmKard is the first fully molded, leadframe-based multimedia card technology, extendable to other memory card standards including SD, RS-MMC, miniSD, MemoryStick/DUO, xD, etc. Compared to existing lidded laminate packaging technology, AmKard's overmolded die assembly of multiple components reduces the cost of memory cards up to 50%. The leadframe integrates die pads, seven-pin connector and internal connectivity, eliminating the need for higher cost laminate substrates. Connector integration is achieved through a combination of half-etching and reverse downset technology, which also enables die stacking. The fully molded leadframe fits into existing leadframe manufacturing infrastructure because of design simplicity. Memory capacity expansion can be supported without changes to the leadframe design using die stacking. Amkor Technology, Chandler, Ariz.,

Shieldless High-speed Connector

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AirMax VS connector system is for use in the design of high-speed computing and network systems, from 2.5 to 6.25 Gb/s with built-in scalability to greater than 12 Gb/s. Using air as a dielectric, the design eliminates the requirement for interleaving shields to significantly reduce size, weight and cost over alternative connector systems. The connector is a scaleable, inverse two-piece backplane connector system with a common insert molded leadframe assembly (IMLA) for both differential pair signal and single-ended signal designs. Options for both connections are provided in the same IMLA. The system allows for mix-and-match IMLAs or signals within an IMLA, which reduces cost by providing the flexibility to stock and use the same connector for various design options rather than requiring distinct parts for separate design projects. FCI Electronics, Etters, Pa.,

Solderable Polymer Thick Film

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PI-1000 Solderable Polymer Thick Film is a screen printable, directly solderable conductor, designed to reduce manufacturing time and improve electrical and thermal performance of circuit interconnects vs. existing polymer thick films. The formulation develops true, robust metallurgical joints. Instead of relying on passive point-to-point contact, its active combination of continuous micro-soldered metallic chains and interfaces is interwoven with a tough, thermosetting polymer, yielding high electrical, thermal and mechanical stability. The thick film can be screen printed or dispensed; the cured material requires no etching or post-bake. A new additive manufacturing process allows rapid cycle times, with no toxic wet chemicals and virtually no unusable waste. The technique eliminates typical copper-bearing acidic by-products generated during conventional subtractive manufacturing. By replacing the copper-etch technique with direct printing of a solderable interconnect, the simplified process helps lower capital equipment costs and improve throughput in PCB fabrication. Dow Corning Corp., Midland, Mich.,

Aluminum Substrate Material

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Giving automotive lighting system designers a lighter, cooler and less expensive method of mounting visible LEDs, this company developed Anotherm substrate, an economical anodized aluminum substrate material with high thermal conductivity. High-power LEDs and other components can mount directly onto the thermally-conductive aluminum alloy material so that the heat produced by the LED is conducted away from the circuitry, thus eliminating the need for attached heatsinks. In effect, the PCB becomes the heatsink, which lowers assembly and material costs by eliminating external heatsinks, mounting clips and other hardware. Solderable thick film conductors can be screen-printed directly to the substrate to connect surface mount packaged components or wire-bonded die. Its rugged construction gives the substrate material the ability to operate in temperatures up to 400°C, or up to 175°C, using high-temperature solder. TT electronics IRC Advanced Film Division, Corpus Christi, Texas,

Off-line Device Programmer

The 4700 is designed for high-density devices and longer programming times, including Flash. It achieves this by combining 64 Mb in 15 sec. with the company's FX4socket modules. FX4 socket modules program up to four devices simultaneously. With 11 programming sites, up to 44 devices can be programmed simultaneously, allowing customers to take advantage of 4× the throughput of any competitive machine on the market today. This combination means higher throughput, reduced cost per device and faster turnaround, resulting in higher profits. The programmer, however, is not limited to FX4 socket modules and can use any of the more than 400 proprietary automated socket modules available. Support includes the latest FPGAs, MCUs, PLDs and memories including flash in packages from the smallest microBGAs to the largest QFPs. While other systems require entire sites to be changed out when programming different device technologies, the programmer requires only a socket module change. Because the system is an off-line programmer, production lines are never slowed down, resulting in more product production and higher profit margins. BP Microsystems, Houston, Texas,

Phase Change Materials

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Honeywell PCM45 phase change thermal interface materials are among a suite of products designed to address thermal management challenges. Unlike traditional phase change materials or thermal greases, these materials maintain their form under continuous pressure. This avoids the tendency of other products to "pump-out" of interfacial gaps within the package and, thus, impair thermal performance. These materials exhibit excellent surface wetting characteristics resulting in low contact resistance, but do not degrade with use because of pump-out. Using a proprietary filler material provides the same high thermal conductivity of more costly boron nitride-filled systems at a cost of ownership comparable to standard phase change materials. Also, these materials offer ease of use in roll format and are available in pad form, bulk and screen printable. They offer reworkability higher than other materials and can be introduced in various stages of the supply chain without impact to form or material performance. Honeywell Electronic Materials, Sunnyvale, Calif.,

X-ray Inspection System

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WBI-FOX features automatic wafer die inspection and analysis, as well as full results documentation. The inspector's wafer mapping, fiducial marking, automatic handling and preconfigured inspection recipe capabilities result in a cost-effective system that improves process analysis and defect reduction. The system achieves its best throughput based on selected die inspection. Operators can predefined inspection recipes and a configuration wizard enables users to set up new recipes. The automated wafer handling system with transport FOUP and robotic arm ensures efficient handling and process time. Generally, a single image can be taken and analyzed in 2 sec., including selection, movement to the respective position, imaging, and void calculation/analysis. The precision and thorough documentation (reporting) capabilities of the system make it a reliable tool for an enhanced QA process. Proprietary True X-ray Intensity (TXI) controls output X-ray intensity, ensuring consistent quality images — a critical feature for an inspection system that is providing real-time images and defect analysis. The automated handling system ensures that the integrity of the wafers is maintained throughout the inspection process. FEINFOCUS, Stamford, Conn.,

Stacked-package Module

Package-in-Package (PiP) is a new family of 3-D packages that stack packaged and bare chips into one JEDEC standard CSP. A pre-tested LGA, and a BGA or KGD are stacked and interconnected with wire bonding and are molded into a CSP that is indistinguishable from a one-chip package. The module enables a new function in the shortest time-to-market and with minimum risk by stacking packages and KGD sourced from the established supply chain. A lower PiP packaging cost, compared to the equivalent cost of separately packaged chips, and a significantly reduced final test complexity both result in a module with lower cost of ownership. A typical stacked-package module integrating an ASIC and two to three memory chips has a 13 × 13-mm footprint, 1.4-mm profile, 341 ball count at 0.5-mm pitch. ChipPAC Inc., Fremont, Calif.,

Flip Chip Bonder

A high-speed flip chip bonder, FCX501 is suited to the mass production of various compact high-frequency electronics devices. The system is capable of ultrasonic and thermosonic flip chip bonding processes that create a nonmetallic bond with high thermal and electrical conductivity. The system can handle various interconnect technologies and die/substrate combinations. Panasonic Factory Automation, Elgin, Ill.,