Late in March, Advanced Packaging's editors and publisher arrived at Windsor Castle Hotel in Windsor, England for a "Meet the Editors" Reception. The day before our presentation, a troop of Royal guards played marching music and clumped through the cobbled streets with their furry black hats and official-looking overcoats. The quaint setting and customs contrasted with our cutting-edge technology magazine, yet the warm reception we received seemed complementary.
What did we say? Well, we talked about how the premier edition of AP was first produced as a quarterly in 1992. In fact, we were the first publication serving the back-end process 12 years ago. In the first edition, I served as industry liaison, a person who sets up panels, conventions and serves on boards. I knew that the publication would turn into the leading educational trade journal in the field, even then. By the time PennWell purchased AP, it had become a monthly with Jeff Demmin, an engineer who had worked in the packaging field, as its editor-in-chief. Last year, I became the editor-in-chief, when Demmin returned to the industry.
Next, after the history review, I talked about our December 2003 BPA circulation statement with its 25,005 completely one-year qualified readership. Our approach to selecting readers is to keep a fairly balanced group with 23.6 percent coming from research and development, 21.5 percent from corporate management, 19.1 percent packaging/assembly/process engineers and 18.5 percent in engineering management. Unlike other magazines in the field, 3,988 subscribers receive the magazine digitally, and 3,344 of these are international subscribers.
Beginning with this issue, facing the back page, our advisory board members will be writing monthly articles covering their area of expertise. This month, Wayne Johnson, Ph.D., professor at Auburn University, kicks off the new column by talking about the growth of electronics assemblies in automobiles and how packages withstand this high-temperature environment.
In September, there will be a lead-free supplement accompanying the magazine's regular issue. Because this is such an important topic, we will produce Webcasts, starting June 29th, on various aspects of lead-free in electronics, including regulations and global restrictions.
In 2002, we began the APA awards program. If you have a new product or service in the back-end assembly area introduced in the past year, please be sure to register for this prestigious award bestowed at SEMICON West. Registration information can be found on our Website: www.apmag.com.
Our job is to serve the reader through education. We build bridges.