In the News


NSF and NRI Pledge $2M to Further Nanoelectronics Exploration

SAN JOSE, CALIF. - The National Science Foundation (NSF) and the Nanoelectronics Research Initiative (NRI), a consortium of members of the Semiconductor Industry Association (SIA), announced they have each pledged $1,000,000 to fund a national university-based research program to sustain the U.S.’s place as a global leader in the semiconductor industry. Working both independently and in conjunction with government organizations, research will focus on new approaches in emerging areas of electronics and other quantum variables (e.g., spin, phase, etc.).

“This is a very big deal over some very small structures. With these tiny nano transistors -10 nm in size - we will be able to build 10 billion transistors in the space of a period made by a ballpoint pen,” says Dr. Paolo Gargini of Intel Corp. and chairman of the council overseeing this effort.

“The global semiconductor industry is facing a critical technology transition over the next 10 to 15 years,” notes SIA president George Scalise. “The technology leaders of 2020 will be determined by actions taken today.”

Tessera Transfers Licensing and Technology to UAF

SAN JOSE, CALIF. - Tessera Technologies, Inc. has transferred its MicroBGA chip scale packaging (CSP) technology to the University of Alaska Fairbanks (UAF), to further the development of an advanced technology center on the UAF campus, making the college a resource for regional enterprise development and government projects.

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“Our work with the University of Alaska Fairbanks illustrates how collaborations between the country’s engineering universities and leading technology suppliers can offer new capabilities to academic faculty, students, and business and government agencies,” notes Nicholas Colella, senior VP of the Product Miniaturization Division at Tessera. “We look forward to continuing our relationship with UAF to help catalyze high technology growth in Alaska.”

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By using Tessera’s technology in semiconductor packaging, this OEM’s microelectronics center allows UAF the ability to provide packaging and assembly services for a variety of semiconductor devices, including EEPROM, DRAM and Flash memory chips.

The center - the only one of its kind in Alaska - houses a 123,000-sq.-ft. Class 10 cleanroom facility that meets and exceeds Federal Standard 209E requirements; complete with science laboratories and classrooms.

ASAT Appoints New President and CEO

HONG KONG & PLEASANTON, CALIF. - The Board of Directors for ASAT Holdings Ltd. recently appointed Robert Gange as president and CEO. Prior to this, Gange was the CFO of ASAT, a position he’s held since 2002. Gange succeeds Harry Rozakis.

“Bob has played a key role in managing the transition of ASAT’s manufacturing to China. In addition, his financial leadership was crucial to the successful bond refinancing last year and the recent $30 million financing with the Company’s two largest shareholders,” says Henry Montgomery, chairman of the Board of Directors of ASAT Holdings Ltd.

Arthur Tsui will step into Gange’s vacated position as the company’s CFO. Since 1999, Tsui has served as ASAT’s corporate controller. “Arthur is a great addition to ASAT’s senior management team. He has a proven track record in corporate finance and a strong background in the semiconductor assembly and test sector,” says Gange.

Upcoming Conference Will Target Nanotechnology

SAN FRANCISCO, CALIF. - The International Congress of Nanotechnology (ICNT) will hold its annual conference from October 31-November 4, 2005. Some 125 speakers and 50+ poster presenters from 35 countries will cover a comprehensive spectrum of the emerging field of nanotechnology.

This is an opportunity for organizations to showcase their products and services, and gain access to a rapid growing membership of business and technology leaders - scientists and engineers. For more information, please visit