New Products


CO2 Laser

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CeramTec computer-controlled CO2 lasers perform scribing, cutting, and drilling with minimum hole diameters of 0.10 mm, turning out substrates in various outside contour geometries, hole patterns, cutouts, and snape-lines. Substrates are sized up to 8 × 10 in., in thicknesses from 0.010 to 0.060 in. Multiple laser-scribed substrates, in all common machine formats, range from 2 in.2 to 5 × 6 in. Finishing options include laser-cut edges and treated edges. CeramTec U.S.A., Laurens, S.C.,

Interlock Switches

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GKN Series safety key-operated switches provide features for safety position detection of protective guards or doors in an industry-standard package. A choice of five switch contact configurations, including two configurations with three contacts, is available. The configurations with three contacts provide cost-effective safety monitoring when used in conjunction with a safety module. The rotating head allows actuator engagement from the front, back, or either of two top positions for four different actuation entry points. The series provides a choice between three standard key actuators, including a flexible key actuator that allows for minor misalignment. A large internal wiring cavity reduces installation time. Honeywell Electronic Materials, Sunnyvale, Calif.,

Package Design Software

Direct integration of Package Thermal Designer (PTD) V2.0 with Allegro Package Designer from Cadence Design Systems has been introduced. Its user interface incorporates a tree structure that quickly defines BGA, multichip, and stacked die packages. Boundary conditions render 3-D models of the component within minutes. All displays are presented as color-contour plots of the gradient through the device at any layer. PTD is designed as a standalone tool, and provides trade studies to explore design alternatives to optimize IC performance and reduce overall production and materials costs. It allows thermal models to be completely integrated and transferable to other ECAD tools, from IC design through the board level design process. Harvard Thermal Inc., Harvard, Mass.,

BGA Connector

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Combining the shieldless AirMax VS design with BGA connector technology, this connector allows designers to optimize footprint, via, and routing options. Using air as the dielectric between adjacent conductors, the AirMax VS connector system offers high signal density and low insertion loss and crosstalk without the use of space-consuming metal shields. The insert-molded leadframe assembly (IMLA) enables the same connector to be used for differential pair, single-ended, or power signals. The design also allows systems to migrate from 2.5 to 25 Gbps without redesign of the basic platform. The BGA termination uses buried vias and microvias, reduces or eliminates the need for backdrilling, and reduces layer count and applied cost. The connector is available in 3-, 4-, and 5-pair versions. The 5-pair version accommodates 63 differential pairs or 95 single-ended lines per in. FCI, Etters, Pa.,

QFN Sockets

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RTI 900-113X pogo pin sockets are designed to meet most low-pin-count failure analysis and engineering test requirements for QFN, LLP, QFP, BGA, LGA, LLP and other small packages. Several lid styles are available, including a screw-down FA lid for micro-probing, a dual-latch lid, a dual-latch clam-shell lid for engineering, and other special-purpose lids. The sockets are designed for bench test, liquid crystal analysis, ESD testing, back-side emission, micro probing, characterization, and low-volume engineering and production testing. Options include multiple center ground pads and heated sockets for liquid crystal testing. Mini-DUT cards and many types of fixtures are available for almost any type of FA, engineering, or production application. Robson Technologies Inc. (RTI), Morgan Hill, Calif.,

Absolute Pressure Transducers

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The 700 series incorporates all-welded Inconel variable capacitance sensors, which provide direct, total pressure measurement independent of gas composition. Their repeatability and corrosion resistance make them suitable for pressure semiconductor processing, including CVD and etch. Internally heated and precisely controlled from 45º to 123ºC, the heated sensors provide immunity from ambient temperature changes with typical zero stability of better than 0.002% FS/ºC. Operable from a ±15 VDC power supply, they provide a 0- to 10-VDC output signal that is linear with pressure and has a resolution of more than 1 part in 20,000. Full scale ranges from 100 mT up to 1000 T are offered with accuracy of ±0.15% of reading. Each is fitted with a 0.5-in. O.D. tube stub and a 15-pin D electrical connector, and is fully CE-compliant. A variety of optional pressure fittings are also available. Setra Systems Inc., Boxborough, Mass.,

Thermal Protection Device

ALPHA CoolCap thermal protection devices cool components and semiconductor packages during high-temperature lead-free reflow and rework processes. The reusable, custom-fitted caps keep semiconductor packages below 245° or 260°C, and minimize temperature variation within packages from over 10° down to 2° to 5°C, while minimizing warpage, popcorning, and delamination. The devices can be used in no-clean, water-soluble, or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment, requiring no adhesive and leaving no residue. The devices sit on the PCB over the component to be protected during lead-free reflow and rework, and will not create solder bridges, solder balls, or other process defects. Cookson Electronics Assembly Materials, Jersey City, N.J.,

Wafer Inspection System

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The Falcon product line delivers 100% surface, probe mark and bump inspection of finished wafers in their pre-sort, post sort or post-dicing stages. Integrating 2-D and 3-D inspection, measurement and metrology capabilities, the Falcons deliver the versatility and efficiency to address all visual yield assurance needs in one compact platform. Intelligent auto-learning and extensive off-line review and recipe setup options enhance the systems productivity. The Falcon targets wafer-level in-line inspection at the FAB end-of-line, bumping, and packaging facilities. On-the-fly scanning detects surface defects from micron to macro-levels, as well as multiple, missing or misplaced probe marks, bump size and placement deviations. Two available sensor types provide fast and high precision height measurement for comprehensive bump height, volume and co-planarity analysis. Off-line setup and review features maximize utilization. Camtek U.S.A., Santa Clara, Calif.,

Dispensing System

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The Spectrum S-820 Series dispensing system is designed for batch processing for semiconductor packaging, such as underfill, cavity fill, die attach, and encapsulation. The closed-loop system performs with a wide range of fluids, processes, and substrates, and integrates with most jets, pumps, and valves from Asymtek, including the DispenseJet DJ-9000. Jet on-the-fly (JOF), a software feature, drives the DJ-9000 to dispense lines of dots without stopping. Calibrated process jetting (CPJ) uses weight control to ensure precise volumetric repeatability and optimize line speed for JOF operations. Dynamic dispense control (DDC) offers precise and flexible control parameters through closed-loop servo technology. Mass flow control (MFC) uses weight-controlled dispensing and automatic calibration to deliver fluid amounts consistently throughout production, working in conjunction with DDC. Asymtek, Carlsbad, Calif.,

Digital Dispenser/Controller

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The microprocessor-driven, digital-timer DX-300 Series digital dispenser/controller is comprised of the DX-300 and the DX-315. DX-300, with operating pressure of 0 to 100 psi, is designed for general fluid dispensing and to control various dispensing valves, such as the Techcon TS56200 Series diaphragm valve or the TS1212 pinch tube valve. DX-315, designed for low-viscosity fluid dispensing, has an operating pressure of 0-15 psi. Each features 10 programmable memories for storing and recalling the most frequently used dispensing cycle timing. To control material “tailing” and waste, each has an adjustable vacuum and a vacuum-driven “suck-back” feature, monitored by a built-in vacuum gauge. With its small footprint of 6.0 × 6.5 × 7.0 in. and a locking mechanism, each is stackable to conserve workspace. Full shot time range is 0.008 to 99.999 sec. in 1-ms increments. Techon Systems, a brand by OK International, Garden Grove, Calif.,

-Lee Mather