Ceramic Substrates

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Low-cost metallized ceramic (LCMC) substrates mix thick-film processing with Ni-Au plating in a patented process that significantly reduces solder leaching. Pattern definition holds to 0.004-in lines and spaces, and LCMC ceramic panels can be fabricated in a 5 × 7-in format, yielding 1.0-μm gold finishfor gold wire bonding and 2 μm of gold for brazing and eutectic die attach. Incorporating proprietary plated-copper-on-thick-film technology (PCTF), these RoHS-compliant substrates suit miniature DC/DC converters, sensors, attenuators, RF resonators and filters, low-pass filters, and other components. Remtec Inc., Norwood, MA,

Component Cleaning Brush

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MicroBrush brushes mechanically remove contamination directly under BGAs, QFPs, PLCCs, and other remote areas of device packages. Available in 0.22- and 0.44-mm diameters, the brushes can be operated manually or by ultrasound for rework
epair processes where substantial residues from solder balls, fluxes, and other metallic and non-metallic residues frequently remain under components. MicroBrush meets all ESD protection requirements. SEHO USA Inc., Ashland, VA,

Reworkable Underfill

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Loctite 3549 is a high-flow underfill specifically formulated to fill the space beneath CSPs and BGAs. It cures rapidly at low temperature, minimizing thermal stress to other components and allowing for in-line curing, increasing device throughput. When fully cured, Loctite 3549 protects solder joints against mechanical stress such as shock, drop, and vibration in handheld devices. Compatible with modern lead-free solder materials, it is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. It also features a 14-day pot life at room temperature, and up to seven days at 40°C processing temperature. The Electronics Group of Henkel, Irvine, CA,

Center-probe Socket

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Designed for use with Delta handlers, this center-probe RF socket incorporates built-in, replaceable aligning features to accommodate the Delta nest. Its contacts provide the same test height, regardless of lead pitch, and contain a copper alloy with nickel-gold plating. The socket’s body is reusable for multiple devices - only the interposer needs replacement. An integral hard stop facilitates device placement and probe activation. Solderless spring probes enable the socket to pressure-mount to the test board. Specifications include a probe self-inductance of 0.51 nH, insertion loss of -1 dB at 18 GHz, and >70-mΩ contact resistance. Aries Electronics Inc., Frenchtown, NJ,

Semiconductor Modeling Software

SEMulator3D provides silicon-accurate, 3-D models of devices and chips fabricated with semiconductor processing equipment, and enables users to document and certify a wafer fab’s manufacturing process and modifications. It analyzes and optimizes micro-scale devices, fluidic components, and subsystems using geometric or topographic parameters as input from existing mask-layout data files and process flows; and from devices and structure measurements fabricated by production equipment. SEMulator3D performs error and physical feature detection, and enables viewing of complex structures, electrical/mechanical connectivity, and dynamic cross-sections; measuring of distances; control of cross-sectional layer properties; importing/combining parts of native CAD formats; and manipulating 3-D images. Coventor Inc., Cary, NC,

Chip Resistors

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APX Series Aluminum Nitride (AlN) chip resistors make power handling capability upgrades possible without increasing footprint size. Thermal conductivity properties allow designers to avoid costly redesigns. Manufactured using thick-film technology, the resistors suit RF, microwave, power supplies, switches, relays, and similar demanding applications. They are available in 10 Ω to 2 kΩ resistance values. International Manufacturing Services Inc. (IMS), Portsmouth, RI,

Stand-alone AOI

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The OptiCon BasicLine stand-alone AOI system enables high-fault coverage by means of a modularly extendable camera, which allows alternative selection between a 1- and 4-M camera module. Based on a linear drive system, OptiCon BasicLine results in up to 50% higher test speed compared to earlier generations. Its Quattro illumination concept allows a high-contrast display with 16 illumination settings, enabling display of shorts, laser labelling, and polarity markings, thereby eliminating interfering effects of soldermasks and fluxes. For higher test coverage, additional options for THT components, color inspection, 3-D measurement, and angled-view inspection are available. GÖPEL electronic, Jena, Germany,

Electroformed Bond Blades

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The ZHFX series dicing blade introduces a bond with wear properties that allow for continuous processing of oxide wafers. In addition, it offers greater stability when half-cut dicing during the dicing-before-grinding (DBG) processing of lithium tantalite wafers.

Compatible with the 6000 Series and 600 Series fully automatic dicing saws; and 3000 Series, 300 Series, and 500 Series automatic dicing saws, the ZHFX series lowers dress frequency during processing, and shows high continuous processing performance. Disco Hi-Tec America Inc., Santa Clara, CA,

EDA Tool

The Version 7.4 advanced layout EDA tool incorporates proprietary bond wire optimization and 3-D design tools to reduce design time and improve time-to-market and yields. It accommodates emerging technologies such as stacked die, 3-D design, automated IC package routing, and co-development and design-for-manufacture (DFM) platforms, and suits the semiconductor packaging, hybrid/MCM, IC test, and RF/microwave industries. CAD Design Software, San Jose, CA,

BGA Socket Adapter

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Soldering a device to an adapter protects the device by allowing it to be plugged in after the board is processed, facilitating device upgrade or replacement in the future. In the past, semiconductor manufacturers and OEMs either used large test sockets that required major board space and additional holes, or attached devices directly to the board, making future upgrade
eplacement difficult and potentially causing damage.

This 0.50-mm-pitch BGA socket adapter uses both male and female pins in an interstitial pattern, and has screw-machined terminals with multi-finger contacts in a compact socket. At only 2.00 mm larger than the device package, with no required external hold-downs, its design suits development and validation of BGA and LGA devices, while offering low signal attenuation up to 2.5 GHz. The socket side is available with either tin/lead or lead-free tin/silver/copper solder balls. Advanced Interconnections Corp., West Warwick, RI,

Die Attach Adhesives

A low coefficient of thermal expansion (CTE) helps reduce CTE strain in the new AAA2300 series electrically insulating die attach adhesives. Designed for 1-mil or thinner bond lines, ultra-fine silica filler won’t damage the bottom die; even without the polyimide buffer layer. These adhesives are solvent-free, and will cure to a void-free bond line in a fast-ramp, snap-cure oven, or in a box oven for batch processing. The lower-CTE AAA2301 and AAA2303 suit same-die stack applications requiring a gap-filling bond line in place of a dummy die; and pyramidal-die stack on bleed-prone, nitride-passivated die without polyimide final passivation. Advanced Applied Adhesives (AAA), San Diego, CA,

Processor Socket

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The lead-free, 775-position LGA775 processor socket enables the use of microprocessors that support PCI express signaling in desktop PCs. Using proprietary BGA technology for motherboard attachment and an LGA interface to the microprocessor, LGA775 performs as a <4-nH, low-inductance device with <1-pF pin-to-pin capacitance to optimize high-speed electrical performance. A low, normal-force contact with wiping action produces consistent electrical performance. A pre-installed pickup cover facilitates placement using conventional pick-and-place equipment, while its BGA termination technology allows the socket to self-center on the PCB pads and self-level in the Z-axis direction. When the chip has been seated properly, an integrated lever system actuates the socket. FCI, Etters, PA,

Printable Thermal Interface Material

The PCM45F-SP phase-change material (PCM) is the first to be available in a printable format. Unlike most PCMs, which are usually supplied in a tape and roll format and affixed in small patches, the PCM45F-SP can be screen printed in various shapes, allowing for more flexibility during chip manufacturing.

PCM45F-SP can be applied to a component, heatsink, or spreader, and offers thermal reliability after thermal cycling and HAST. It changes phase at 45°C to assure surface conformance, and its filler size distribution achieves a higher packaging density than conventional PCMs. PCM45-SP is available in paste form in various size containers. Honeywell International Inc. Tempe, AZ,