Hybrid Laser Saw
The fully automatic Hybrid Laser Saw HLS 300A incorporates a Disco diamond blade saw platform and a Synova Laser Microjet (LMJ) processing module in a 2-in-1 turnkey system. LMJ involves a hair-thin water jet guiding the laser through total internal reflection, while simultaneously cleaning the kerf of the ablated material and preventing wafer surface contamination or deposition.
The hybrid operation allows for any programmable sequence of the two processes, depending upon the material characteristics of the wafer. It’s reportedly also possible to run both processes in the same cutting pass for increased throughput. The HLS can dice wafers up to 300 mm in a fully automatic mode from cassette to cassette. Both processes require only a common de-ionized water supply. Synova, Lausanne Switzerland, www.synova.ch. Disco Corp. Tokyo, Japan, www.disco.co.jp.
Henkel’s Hysol QMI 5100 DDF and Hysol QMI 5200 DDF are pressure-sensitive dicing die-attach films on expandable polyolefin film that combine two functionalities into one product. They can be used for attachment of ICs and components in advanced packaging processes including stacked die, PBGAs, CSPs, and array packages.
Equally suited to both die-to-laminate and die-to-die applications, they do not require UV exposure for die pick-up. Wire bonding and mold processes can be done without DDF cure. Wafers can be laminated at low temperature from 70°C down. Performance for both dicing and die attach processes is reportedly good, with no die flying, good bond line control, no bleed, and no creep. The films are available in 10 and 20 µm thicknesses. electronics group of Henkel, Irvine, CA. www.henkelna.com
Failure Analysis Tools
The suite of de-processing failure analysis (FA) tools from Oxford Instruments allow for a range of processes from passivation removal to anisotropic oxide removal from small die or packaged device, through to 300 mm wafer.
The PlasmalabµEtchICP is a fast and low-damage tool for small die and packaged devices. Back-end processes include removal of bulk Si then stops on buried oxide (BOX); BOX then stops on thin active Si layers; and thin active Si layers removal.
The PlasmalabµEtch 300 and 200 are designed for 300- and 200-mm wafer FA, respectively, offering dual chamber RIE an PE in a single compact system. It performs polyimide removal, SiNx removal, anisotropic IMD removal including low-K oxide, cross section preparation for SEM imaging, run to run reproducibility, and selectivity to underlying material.
All three tools feature Oxford’s proprietary Plasma Accelerator for advanced die processing, developed for fast de-processing of packaged devices using focused plasma. Four metal layers can reportedly be exposed in less than 5 minutes using both ICP and RIE processes. Oxford Instruments, Bristol, UK. www.oxford-instruments.com
Benchmark Pick-and-Place Handler
The MT2168 benchmark pick-and-place handler from Multitest was designed with a minimized number of pick-and-place transitions, featuring self-teaching processes that replace manual adjustments for stability and reduced sensitivity to adjustments. The base unit is scalable from “engineering” to “state-of-the-art” and “high-end” configurations optimized for parallelism, test time, and throughput requirements. Contact site pitch and number is flexible and easily adapted, so existing loadboards and test programs can be used. Features include throughput up to 20,000 uph, up to 16 contact sites, index time 0.38 sec. and soak capacity equivalent to 3.5 JEDEC trays. The MT2168 “one-for-all” platform is suited to the needs if integrated device manufacturers (IDMs) as well as for subcontractors. Multitest, Rosenheim, Germany. www.multitest.com
Single-wafer Spin Processor
The DaVinci Prime, from SEZ Group, is the next-generation of the DaVinci family, designed as a bridge tool between front-end of line (FEOL) and back-end of line (BEOL) processes. It performs post deep reactive ion (DRIE) residue clean to 45-32 nm. Dual-use (FEOL and BEOL) reflects increasing overlap of application requirements in wet cleans as technology becomes more complex. Designed to improve yield at 65 nm and beyond, features for advanced processes include A-Jet technology for non-damage particle removal with DIW or DI + media, advanced surface drying technology to prevent watermarks or pattern collapse, Dual-sided processing, multi-chemical recirculation, Low-RPM chucks for puddling and wafer soak applications, and advanced bevel clean-only processing (BCO). It can be configured for either single or dual front-end robots. SEZ Group. Villach, Austria, www.sez.com