IN THE NEWS
IMAPS Turns 40
Stephen M. R. Covey will kick off IMAPS 2007 with strategies for leadership.
SAN JOSE, CA - IMAPS 2007, November 11-15 in San Jose, will mark IMAPS’ 40th year in the industry with an international presence, professional development courses and technical sessions, and an open-attendance marketing forum. IMAPS began in the Silicon Valley region as the International Society for Hybrid Microelectronics (ISHM), and will celebrate the anniversary by returning to the area. Its 2007 symposium and exhibition, chaired by Greg Caswell, will host translated sessions from Japanese and Chinese contributors - bringing technology and business developments in Asia to the U.S. base. This year initiates IMAPS’ collaboration with China Electronics Packaging Society (CEPS) and China Institute of Electronics (CIE), which involves delegations from the China societies.
Keynote speakers will also bring international themes to the conference. Stephen M. R. Covey, co-founder and former CEO of the Covey Leadership Center, will present the conference’s “kick-off” keynote. The Covey strategy is globally recognized from The 7 Habits of Highly Effective People, by Steven R. Covey, Ph.D., the keynoter’s father. Jim Miller, VP of product operations, Cisco Systems, will also speak. Miller manages new product introductions (NPIs) and lifecycle management for the global manufacturing organization. He holds a BS in aerospace engineering from Purdue University, a MS in mechanical engineering from the Massachusetts Institute of Technology (MIT), and a MS in management from the Sloan School of Management at MIT. He was named an “MIT Leaders for Manufacturing” fellow. Another industry veteran, Dongkai Shangguan, Ph.D., Flextronics International, will round out the keynote roster. Shangguan, VP for assembly technology and platform realization under Flextronics’ corporate technology group, develops advanced packaging solutions and design for manufacturing (DfM) and excellence (DfX) strategies. He holds degrees in mechanical engineering and materials from Tsinghua University, China, and the University of Oxford, U.K., respectively, and an MBA from San Jose State University (CA).
Names in the News
Henkel Corporation promoted Michael Todd, Ph.D., to vice president of product development and engineering for semiconductor and assembly technologies. Todd will maintain his duties related to product development in mold compound, die attach, wafer-level underfill, and chip-scale packaging (CSP) underfill at the company’s Irvine, CA, headquarters, and will expand these initiatives to Henkel’s Yantai and Linyuangong, China; Tainan, Taiwan; and Hemel Hempstead, U.K., facilities. To align R&D and applications efforts with customer requirements in key U.S., Europe, and Asia regions, Todd plans to focus on materials that enable reduced footprints and costs savings.
Michael Todd, Ph.D.
Todd holds a Ph.D. in materials science engineering from the University of California, Irvine, and is a member of Advanced Packaging’s Editorial Advisory Board.
Randy Castillo joined J. P. Sercel Associates (JPSA) as field service engineer, bringing 18 years experience with laser and electromechanical fields. He will perform customer service and support, and will provide applications support. He has served in the U.S. Marine Corps. as a communications specialist servicing Navy sonar systems, and held positions with Honeywell, Electro Scientific Industries (ESI), Laser Services, and Laser Advantage.
Ken Gilleo, Ph.D. joined the technical advisory board of Mirror Semiconductor Inc., bringing chemistry, electronics, and packaging experience to the start-up packaging company.Gilleo, owner, ET-Trends LLC (Warwick, RI), and author of MEMS/MOEMS Packaging (McGraw-Hill, NY), holds a Ph.D. in chemistry from the University of Connecticut and has worked in electronics sectors for 40 years. Mirror remaps off-the-shelf die to create new interconnect pin-outs without altering die performance.
Ken Gilleo, Ph.D.
France-based ViTechnology appointed Jean-Yves Gomez as CEO, aiming to leverage Gomez’s experience in semiconductor and optoelectronics manufacturing toward its existing competencies in automated optical inspection (AOI) and measurement (AOM) markets. I’ve confronted the challenges of electronics assembly and optical inspection - miniaturization and a high mix of components - from a semiconductor standpoint, Gomez said, adding that he will use these experiences to further the company’s long-term strategies in these sectors. Gomez served in various market research, product development, engineering, and production positions with Thomson Semiconductors (subsequently SGS-Thomson and STMicroelectronics) from 1984 through 2007.
F&K Delvotek was awarded a 2006 Supplier Excellence Award by sensor supplier Sensata Technologies, who has been using F&K wire bonding systems for many years. The award reportedly reflects outstanding performance and continuous improvement in supplying materials, equipment and services in 2006. Sensata evaluates nominees based on six criteria: cost, environmental responsibility, technology, responsiveness, assurance of supply and quality.