High-accuracy Die Bonder

The FINEPLACER Lambda, with ±0.5-μm placement accuracy, provides automatic touchdown and die placement with a motorized configuration for cotnrolled bonding after manual alignment of die and substrate. The system offers up to 10 programmable microscope positions. Finetech, Tempe, AZ, Visit Finetech at Booth 727.

Die Bonder

The 2200 evo twin-head multi-chip die bonder incorporates a modular machine concept, optional advanced tape feeder cutter (ATFC), and more than 98% uptime. A bonding area for die attach and flip chips, and an epoxy dispensing area with integrated camera, fit into the small footprint. Datacon Technology GmbH, Radfeld, Austria, Visit Datacon, a division of BESI, at Booth 818.

Electro-deposition System

The Stratus S300 electro-deposition system integrates active boundary-layer thinning and vertical processing for up to 20 wafers per plating. It suits production of redistribution layers (RDLs), through-silicon vias (TSVs), and solder bumps. NEXX Systems, Billerica, MA,

Vacuum Soldering Systems

The VLO series of vacuum soldering systems integrate heating and cooling platens intended for efficient ramp-up and cool-down of substrates. Individually controlled rigid platens allow for mixed load processing at up to 450°C, and temperature homogeneity across the platen. Applications include flip chip, MEMS, optoelectronics, multichip modules (MCMs), and other packages. centrotherm, Blaubeuren, Germany, Visit centrotherm at Booth 610.

Automated Dispensing System

The DispenseMate D583/585 platform provides automated precision dispensing for batch production, lab, prototyping, and R&D applications. Designed for solder paste; conductive, ultraviolet (UV), and surface-mount adhesives; and gasketing, sealing, and silicone/epoxy encapsulation, the systems uses proprietary dispense control technology. The 583 model hosts a 325- × 325-mm range of motion; the D-585 has 525 × 525 mm. Asymtek, Carlsbad, CA, Visit Asymtek at Booth 1017.

LTCC Materials for Lead-free

Green Tape low temperature co-fire ceramic (LTCC) technology combines the benefits of high-temperature co-fired ceramic (HTCC) and thick film technologies.The materials set suits gold, silver, and mixed-metal systems, and is available in several thicknesses, cavities, and cutouts. The materials cover 951 organic binder and solvent system for RF modules, multi-chip packages (MCPs), single-chip packages, and Ceramic PWBs; and the 943 low loss tapes for microwave components in gold, silver, and mixed-metal high-frequency circuits. DuPont Microcircuit Materials, Wilmington, DE, Visit Dupont at Booth 419.

QLF Package

An open-tooled, high-performance 28-lead quad-lead flat package (QLFP) for millimeter-wave frequencies features a copper/molybdenum (CuMo) heatsink, kovar seal ring, gull-wing leads, and both differential and single-ended RF ports. Electrical performance characteristics are up to 40 GHz, and the cavity will fit most 3- or 4-mm devices. The heatsink supports most power device applications, and achieves hermeticity with either a combo lid or seam sealing to the kovar seal ring. Kyocera America Inc., San Diego, Calif., Visit Kyocera at Booth 519, and Kyocera Industrial Ceramics Corp. at Booth 309.

Underfill Encapsulants

Designed to enhance thermal-cycle performance in flip chips, the underfill encapsulants incorporate silica filler to reduce coefficient of thermal expansion (CTE). The encapsulants are engineered for desirable morphology and particle-size distribution. The materials flow into gaps as fine as 18 μm, offer reportedly fast inline cure, and adhere to organic substrates and to die passivations. CTEs range from 23 ppm/ºC to 40 ppm/ºC. Zymet Inc., East Hanover, NJ, Visit Zymet at Booth 830.