Table of Contents

Solid State Technology

Year 2013
Issue 1


Cover Article

Interdisciplinarity takes imagers to a higher level

Belgian research institute imec shows the opportunities for imagers when teams of designers, software engineers, technologists, and system designers collaborate. Els Parton, Piet De Moor, Jonathan Borremans, and Andy Lambrechts, imec, Leuven, Belgium

3d Integration

Laser debonding enables advanced thin wafer processing

An economically viable method for delivering throughput in fab equipment. Thomas Uhrmann, EV Group, St. Florian, Austria, and Ralph Delmdahl, Coherent GmbH, G??ttingen, Germany


The gleam of well-polished sapphire

If an LED manufacturer wants to improve yield or reliability, it's important to know the source of the problem. Rebecca Howland and Tom Pierson, KLA-Tencor, Milpitas, CA.

Economic Outlook

The Forecast for 2013: Back to business

Analysts see renewed vigor for chip sales. Christian Gregor Dieseldorff, SEMI; Bill McClean, IC Insights; Adrienne Downey, Semico Research; Mark Thirsk, Linx Consulting; Jean-Christophe Eloy, Yole D??veloppement; and Ron Leckie, Infrastructure Advisors.

Technical Forecast

2013 technology forecast: Unprecedented challenges ahead

We asked leading industry experts to give us their perspectives on what we can expect in 2013. The challenges ahead include 450mm, FinFETs and 3D NAND, TSVs and 3D integration, and sensor fusion.



450mm progressing

One of the highlights of SEMI's Industry Strategy Symposium ??? held in January in Half Moon Bay, California ??? was the first public presentation of a fully patterned 450mm silicon wafer.


450mm is the next big opportunity

A major challenge facing the industry in the coming year is how to deliver products faster without affecting budgets or compromising safety and quality.


Printed, flexible electronics scaling up

Excitement is building in the world of printed and flexible electronics. Recent announcements of flexible and curved displays for mobile phones, TVs and other consumer devices will push technologists to solve scale-up challenges in manufacturing, helping migrate products from prototypes to mass production.


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New Products


World's most complex 2d laser beamsteering array demonstrated

RADAR works by reflecting RF waves off of a target, which return to the RADAR system to be processed. The amount of time it takes to return correlates to the object's distance.


Semi execs see a bright 2013, says survey

In its annual study, KPMG found three quarters of semiconductor executives polled believe they will see revenue growth in the next fiscal year ??? that's up from 63% in the previous survey.


Semiconductor leaders see massive industry transformation

The semiconductor industry is undergoing massive transformation as the rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends become the dominant forces in 2013 and beyond, according to industry leaders speaking at the SEMI Industry Strategy Symposium (ISS).


GlobalFoundries adding R&D facility to NY fab campus

GlobalFoundries says it plans to build a $2 billion R&D facility at its Fab 8 campus in Saratoga County, NY.


Fabless IC sales rise

IC Insights says fabless IC suppliers saw sales rise 6% in 2012, compared with a -4% decline by IDMs (those with their own IC fabs), and the overall market's -2% decline for the year.


SRC, DARPA unveil university research center network

Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to six new university microelectronics research centers to support the continued growth and leadership of the U.S. semiconductor industry.


Singapore IME launches 2.5D silicon interposer MPW

Singapore's Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR), has launched a new multiproject wafer service (MPW) for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.


STMicro: 28nm FD-SOI is ready for manufacturing

STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of fully-depleted silicon-on-insulator (FD-SOI) technology with its partners.

Industry Forum

New challenges for suppliers

Over the past 24 months, construction timelines for new wafer production facilities have contracted so much that construction firms are now required to move from bid package to on-site prep in as little as three weeks.