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Solid State Technology
IEDM preview: 20nm and below
As the industry works to perfect 28 and 22nm devices now in volume manufacturing, attention must turn to next-generation 14nm, 10nm and 7nm technologies presently in development. Those to be presented at IEDM are previewed. Pete Singer, Editor-in-Chief
Automated data analysis improves yield of MOCVD epitaxial process in LED manufacturing
Integration of collection and analysis are vital. Mike Plisinski, Data Analysis & Review Business Unit, Rudolph Technologies Inc., Tewksbury, MA
New CMP process holds promise of lower costs, improved efficiencies
Implementing third-generation low-abrasive copper slurry. Christopher Eric Bannon, Texas Instruments Inc., Dallas, TX
The scare of overcapacity
How changes in cpex affect fab capacity. Christian Gregor Dieseldorff, SEMI Industry Research & Statistics, San Jose, CA
CoWoSprocess cuts power, boosts performance, shrinks footprint
A silicon wafer with TSVs is used as a carrier to integrate multiple chips in a single device to reduce power, improve system performance, and reduce form factor. Jerry Tzou, TSMC, Hsinchu, Taiwan
Forecast for 2013
Nobody can predict the future, of course, but 2013 is shaping up to be a good year for the semiconductor industry and its suppliers.
IMAPS 2012: A review
The 45th Symposium on Microelectronics (IMAPS 2012) was held September 9-13 in San Diego. Here's a quick review of some of the 3D and advanced packaging papers presented at the meeting.
Semiconductors and healthcare converging
Semiconductor technology is increasingly being implemented in a variety of healthcare applications.
Analyst: Fab spending softness 2012 extending into 2013
Fab equipment spending continues to soften in 2012, but don't hope for a reprieve until later in 2013.
TV makers expanding low-brightness LED backlit models into entry-level market
When LCD TVs were first competing against plasma TVs, one key differentiating argument was their brightness.
Europe to unite research efforts in Silicon Europe cluster alliance
A cluster of partners from across Europe are forming a new cluster alliance to cooperate in research, development, and business and reassert Europe's position as a leading world center for energy-efficient micro-/nanoelectronics, and information/communications technology.
Laser spike anneal for photoresists outperforms hotplate bake
Researchers at Cornell University have developed a new laser-based method for ultra-fast anneal of thin photoresist films.
New level of repeatability required for 3D NAND
Historically, manufacturers have increased memory density by packing more cells together in a single plane. As traditional dimensional shrinks become increasingly difficult, the industry is transitioning from planar to 3D NAND architectures by stacking memory cells onto the same silicon substrate.