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Solid State Technology
BCDMOS designed for 700V driver chips
A specialized ultra high voltage BCDMOS process at the 0.35??m node deploys thin n-epitaxial technology to support high voltage applications. Jae Song, Dongbu HiTek, Seoul Korea.
Material support: helping displays deliver higher performance
Metal oxide transistors increase electron mobility by a factor of up to 40 compared to conventional technology, at a comparable cost base. Andreas Weisheit, Linde, Shanghai, China, and Greg Shuttleworth, Linde, Guildford, UK.
Testing probe cards that contain complex circuitry
State based testing is a simple, highly scalable method to describe activation details for probe card circuitry. Greg Olmstead and Bob Davis, Rudolph Technologies, Inc., Flanders, NJ.
Defect detection in die stacks with acoustic imaging
A new simulation technique makes imaging easier and faster for stacked die and other multi-layered structures. Tom Adams, Sonoscan, Inc., Elk Grove Village, IL.
Understanding shape-dependent mask CD uniformity
Process development teams will need to consider the impact of shape-dependent mask CD uniformity on design rules and wafer yields Aki Fujimura, D2S, Inc., San Jose, CA
A new era for equipment suppliers
The semiconductor equipment industry received quite a jolt recently.
Advances in wafer underfill processing
At ECTC 2012, Toray presented results of their study on suppressing wafer level underfill (WUF) material entrapment at copper pillar/pad joints.
Wafer bonding enables better LEDs
In my discussions with LED manufacturers in different regions of the world, I have found that engineers are confronting similar challenges concerning wafer bonding, particularly in the processing of vertical LED (VLED) chips.
Nanoimprint lithography???s role in 450mm
During SEMICON West in July 2012 there was increased momentum and growing industry consensus on the timing for the 450mm wafer transition.
imec plans 450mm cleanroom with govern ment investment
imec will build a 450mm wafer fab cleanroom at the research organization???s site in Belgium, with a new EUR100 million government investment, announced by the Flemish Minister of Innovation Ingrid Lieten.
Printed electronics standards initiative starts with substrate materials
IPC ??? Association Connecting Electronics Industries and JPCA (Japan Electronics Packaging and Circuits Association) released their first operational-level standard for the printed electronics industry, IPC/JPCA-4921, Requirements for Printed Electronics Base Materials (Substrates).
SEMICON West hosts 2012 ITRS updates
2012 is an even-number year, meaning that only updates, rather than major revisions, are made to the International Technology Roadmap for Semiconductors (ITRS).
Chipmakers see a flat future in H2
Reporting Q2 numbers and issuing Q3 guidance, chipmakers like ON Semiconductor Corporation (Nasdaq: ONNN), Texas Instruments Incorporated (TI, NASDAQ:TXN), STMicroelectronics (ST, NYSE:STM), AMD (NYSE:AMD), and Intel Corporation (NASDAQ:INTC) consistently reported flat or lowered guidance, citing macro economic conditions.
Flat chip sales in June, says SIA
Global semiconductor sales stayed flat in June 2012, hitting $24.38 billion (a decline of 0.1% from May 2012), reports the Semiconductor Industry Association (SIA). Year-over-year (Y/Y), sales fell just 2% in June, a slower decline than the semiconductor industry has seen since October 2011.
Apple out-buys all other semiconductor purchasers
Apple Inc. is not only the world???s leading OEM in terms of semiconductor purchasing, its also is increasing semiconductor buying at a faster rate than other top firms, reports IHS.
LED fab equipment capex to brighten in H2
Barclays Capital Inc. analysts held conversations with the LED supply chain at SEMICON West, confirming for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers.
The energy behind energy at SEMICON West
At SEMICON West, keynoter Shekhar Y. Borkar, Intel Fellow and director of extreme-scale technologies at Intel, focused on the energy demands of ubiquitous computing, and how technologies developed for super computers will later be adopted into smartphones.
Intel, TSMC take stakes in ASML to push EUV, 450mm forward
ASML launched the ASML Holding N.V. Customer Co-Investment Program, wherein customers can take up to 25% stake in the semiconductor manufacturing tool supplier, funding research primarily on EUV lithography and 450mm tools.