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Solid State Technology
Atomic layer deposition for metal gate integration
High-k based transistors have introduced the semiconductor industry to increasingly complex metal gate integration schemes and novel, low temperature deposition techniques such as ALD. Mohith Verghese, ASM America, Phoenix, AZ.
Impact of charge during gate oxide patterning on yield
Detection of non-visual defects in the steps prior to optical inspection was used to trace the cause of a silicon pitting defect. Jungtae Park, Samsung Electronics Co.; Sungjin Cho and Jeff Hawthorne, Qcept Technologies Inc.
2D cross-sectional doping profiling study of advanced CMOS devices
Electron holography (EH), a powerful method for two-dimensional (2D) doping profiling, was used to study 2D cross-sectional doping profiles of advanced CMOS devices. Shu Qin, Zhouguang Wang, Y. Jeff Hu and Allen McTeer, Micron Technology Inc., Boise, ID.
Bonding Wire: Is Scalability the Wave of the Future?
A new technology enables bonding wire to be cast instead of drawn. The wire can be used like traditional copper bonding wire but offers several advantages that make it more cost-effective. Dominik Stephan, RED Micro Wire Pte., Ltd., Singapore.
Volume consumer markets are changing MEMS manufacturing
Changes in the way MEMS are manufactured are primarily being driven by high volume consumer MEMS markets. Eric Mounier and Jerome Baron, Yole Developpement, Lyon, France
Efficiency in sealing: A BKM case study
This case study describes Microchip's experience with perfluoroelastomers o-ring seals. Dalia Vernikovsky, Applied Seals North America Inc., Newark, CA, and Brad Ecker and Seth Urbach, Microchip Technology, Inc., Chandler, AZ.
Price, Power and Performance
At The ConFab 2012, which took place in June at The Encore at The Wynn in Las Vegas, Mike Noonen of GLOBALFOUNDRIES kicked off the Fabless-Foundry Supply Chain session, noting that the manufacturing cycle time is now sometimes longer than the product lifetime.
From The ConFab: State of advanced packaging technologies
As packaging has played a larger and larger role in chip performance, form factor, and capabilities, Solid State Technology's The ConFab has increased its focus on back-end processes.
The demise of sapphire wafers?
"Are we witnessing the demise of sapphire wafers?" was the question recently posed to Griff Resor, Resor Associates. "Not yet!" was his reply.
Government's support for long-term research
The Federal government continues to send encouraging messages that the 2013 budget will include support for basic long-term university technology research in physical science and engineering.
Semiconductor fabs use significantly less energy today, but work remains
Semiconductor manufacturing facilities dramatically decreased their normalized fab energy consumption from 1997 to 2011, shows The International SEMATECH Manufacturing Initiative (ISMI) Worldwide Fab Energy Study.
Guangzhou exemplifies China's LED industry
Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia, with companies throughout the LED lighting supply chain, including new Chinese MOCVD makers, International Solid State Lighting Alliance and China SSL Alliance.
Biggest auto MEMS maker, biggest growth in 2011
Bosch GmbH Automotive Electronics of Germany retained its position as the world's top supplier of automotive MEMS in 2011, according to IHS.
Packaging revenue outgrows package unit growth
Growth in smartphones and tablets and resurgent automotive demand are increasing IC demand. In turn, increased demand for product functionality is driving up IC packaging revenue faster ??? a 9.8% CAGR ??? than IC unit growth ??? 7.3% CAGR 2010-2016, says New Venture Research (NVR).
SEMICON West Products
SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA.