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Solid State Technology
The Next Transistor
New transistor technologies in development include high mobility transistors with III-V
channel materials, tunneling and quantum-well FETs, and more "exotic" approach involving
silicon nanowires, CNTs and graphene. Pete Singer, Editor-in-Chief.
Thin die stacking for wide I/O memory-on-logic
Wide I/O DRAM is pushing thin wafer processing into high-volume manufacturing readiness. Thorsten Matthias, J??rgen Burggraf, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner, EV Group, St. Florian am Inn, Austria.
Bias temperature instability mechanisms
NBTI is considered to be one of the most diffcult reliability challenges facing the
semiconductor manufacturing community today. Christopher L. Henderson, Semitracks, Inc.,
and David W. Rose, Keithley Instruments, Inc.
TSV inspection in 3D advanced packaging applications
Laser triangulation provides fast, accurate and repeatable 3D measurement of TSV nails and
microbumps. Reza Asgari, Rudolph Technologies, Inc., Flanders, NJ.
Laser-Produced Plasma Light Sources for EUV Lithography
Today???s sources have an average power of 50W at intermediate focus, at 80% duty cycle using
pre-pulse technology. David C. Brandt, Igor V. Fomenkov, Bruno M. La Fontaine and Michael J.
Lercel, Cymer, Inc., San Diego, CA.
Funding the future: Managing the cost of R&D
One of the big issues now facing the industry is to how best spend limited funding for research and development, when so much needs to be done.
3.5D interposers: PCB replacement?
At the 15th Symposium on Polymers for Microelectronics (May 8-10 in Wilmington, DE), TSMC and Yole Developpement gave plenary presentations on the use of polymeric materials in wafer-level packaging (WLP) from foundry and overall industry perspectives.
Epidermal electronic systems
Scientists have developed a new type of ultra-thin, self-adhesive electronics device that can effectively measure data about the human heart, brain waves and muscle activity - all without the use of bulky equipment, conductive fluids, or glues.
SEMI educates policymakers on 450mm transition
With estimates for the R&D cost of 450mm wafer transition running in the tens of billions of dollars, public-private partnerships will have a critical role throughout the world. Already, the State of New York is anticipating a $400 million investment in advanced chip research over the coming years and the European Union is funding research in a variety of Key Enabling Technologies including microelectronics manufacturing.
MOCVD capex disobeys fab utilization rules at LED makers
Barclays Capital analysts attended Lightfair International (May 9-11) and gleaned several trends in LEDs and OLEDs for lighting.
Top OSATS raise 2012 capex with test focus
The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capital expenditures during their earnings reports, from initial plans announced in January, report analysts at Citi.
President Obama speaks on
US President Barack Obama toured the University at Albany - State University of New York (SUNY) - Albany Nano-Tech Complex on May 8, speaking about the economy in the College of Nanoscale Science and Engineering's (CNSE) NanoFab Extension Building.
GLOBALFOUNDRIES joins top-20 ranks in Q1 on Elpida bankruptcy
The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel's firm hold on the top of the rankings, registering a 68% higher sales level than Samsung in Q1.
ST's MEMS revenues jump 82% in 2011, but TI holds onto #1 spot
Texas Instruments Inc. (TI, TXN) remained the top manufacturer of MEMS in 2011 with $779.0 million in MEMS revenues, fending off runners-up Hewlett Packard Co. and Bosch in tough competition for market share, according to an IHS iSuppli MEMS Market Brief report.
Large-area TFT-LCD panel makers see rising shipments, revenues in Q2 2012
Large-area TFT-LCD panel shipments declined in Q4 2011 and again in Q1 2012, but should grow 11% to 189.6 million in Q2 2012, with brands and OEMs increasing orders, and panel makers increasing capacity utilization.