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Solid State Technology
Defect removal using dry cryogenic aerosols
The high particle removal efficiency of cryogenic aerosol cleans can provide yield advantages in the BEOL after in-line testing, without altering substrate properties. Jeffery W. Butterbaugh, FSI International, Chaska, MN
Plasma etch challenges for FinFET transistors
New constraints and challenges associated with FinFET manufacturing are reviewed from the etch point of view. Keren J. Kanarik, Gowri Kamarthy, and Richard A. Gottscho, Lam Research Corp. Fremont, CA.
The effect of pumping methods on wet etching processes
The effect of pumping methods on the etching of PE-TEOS wafers was investigated. Jung-Soo Lim, R. Prasanna Venkatesh, and Jin-Goo Park, Dept. of Materials Engineering, Hanyang University, Ansan, 426-791, Korea
Low cost AlN substrate technology for HBLED and power semiconductors
A technology has been developed that allows A1N to be sintered at lower temperatures. This allows the material to be sintered and flat fired in a continuous furnace very similar to furnaces used for alumina. Jonathan Harris, CMC Laboratories, Tempe, AZ
The move to 450mm: Europe's perspective
The European Equipment and Materials 450mm Initiative (EEMI450) provides Europe's perspective on the transition to 450mm wafers in this excerpt.
The internet of things
Pete Singer, Editor-in-Chief
Driving down HB-LED package costs
Griff Resor, Resor Associates,
Interposer ecosystem examined
Dr. Phil Garrou, Contributing Editor
Advanced packaging in the new decade
E. Jan Vardaman, Techsearch International
Common Platform Technology Forum looks to the future
The 2012 Common Platform Technology Forum took place March 14 at the Santa Clara Convention Center, with registration topping 1200 attendees by noon.
Inside Apple's new iPad display technology
The new Apple iPad, generation 3, uses a 2048 ?? 1536, 264 ppi retina display, quadrupling the pixels of the previous generation.
AMD and GLOBALFOUNDRIES form new agreement
AMD amended its wafer supply agreement with GLOBALFOUNDRIES Inc., with a negotiated wafer price mechanism for 2012.
Elpida files for bankruptcy
Elpida Memory Inc. resolved to file a petition for the commencement of corporate reorganization proceedings at today's meeting of the board of directors, and filed the same with the Tokyo District Court.