Table of Contents

Solid State Technology

Year 2012
Issue 3


Cover Article

Defect removal using dry cryogenic aerosols

The high particle removal efficiency of cryogenic aerosol cleans can provide yield advantages in the BEOL after in-line testing, without altering substrate properties. Jeffery W. Butterbaugh, FSI International, Chaska, MN


Plasma etch challenges for FinFET transistors

New constraints and challenges associated with FinFET manufacturing are reviewed from the etch point of view. Keren J. Kanarik, Gowri Kamarthy, and Richard A. Gottscho, Lam Research Corp. Fremont, CA.


The effect of pumping methods on wet etching processes

The effect of pumping methods on the etching of PE-TEOS wafers was investigated. Jung-Soo Lim, R. Prasanna Venkatesh, and Jin-Goo Park, Dept. of Materials Engineering, Hanyang University, Ansan, 426-791, Korea

Led Packaging

Low cost AlN substrate technology for HBLED and power semiconductors

A technology has been developed that allows A1N to be sintered at lower temperatures. This allows the material to be sintered and flat fired in a continuous furnace very similar to furnaces used for alumina. Jonathan Harris, CMC Laboratories, Tempe, AZ


The move to 450mm: Europe's perspective

The European Equipment and Materials 450mm Initiative (EEMI450) provides Europe's perspective on the transition to 450mm wafers in this excerpt.



The internet of things

Pete Singer, Editor-in-Chief


Driving down HB-LED package costs

Griff Resor, Resor Associates,


Interposer ecosystem examined

Dr. Phil Garrou, Contributing Editor

Industry Forum

Advanced packaging in the new decade

E. Jan Vardaman, Techsearch International



Common Platform Technology Forum looks to the future

The 2012 Common Platform Technology Forum took place March 14 at the Santa Clara Convention Center, with registration topping 1200 attendees by noon.


Inside Apple's new iPad display technology

The new Apple iPad, generation 3, uses a 2048 ?? 1536, 264 ppi retina display, quadrupling the pixels of the previous generation.


AMD and GLOBALFOUNDRIES form new agreement

AMD amended its wafer supply agreement with GLOBALFOUNDRIES Inc., with a negotiated wafer price mechanism for 2012.


Elpida files for bankruptcy

Elpida Memory Inc. resolved to file a petition for the commencement of corporate reorganization proceedings at today's meeting of the board of directors, and filed the same with the Tokyo District Court.

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