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Solid State Technology
Where Have All the New Apps Gone?
Pete Singer, Editor-in-Chief
Etch pushes limits of physics and chemistry
Richard A. Gottscho, Lam Research Corp.,
Back-side illumination, wafer-scale optics drive 2??-5?? jump in CMOS image sensor performance
It's not just 3D packaging technology where CMOS image sensors are driving IC technology these days.
SEMATECH outlines maskless issues, proposes consortium
Among key takeaways from SEMATECH's Litho Forum in New York City in March was a proposal to create a consortium to support multibeam mask writing efforts, similar to what's being done for EUV.
Samsung tips 32-28nm HKMG plans
Samsung's announcement that it has completed testing of its 32nm high-k/metal gate architecture, ramping to volume possibly by year's end???and following quickly with a 28nm version???has the industry buzzing about a possible reshaping of leading-edge semiconductor foundry manufacturing.
DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning
Tracing defects from the lithography step through the SADP process flow to the spacer open step can significantly increase the capture rate of critical defects at the earlier steps. Ofir Montal, et al, Applied Materials Inc.
Improving etch performance using in situ gas flow monitoring and control
Improve etch equipment performance through in situ gas flow monitoring and control. Mukund Venkatesh, et al, Pivotal Systems; Kevin Boyd, IBM.
Avoid throwing darts at a black hole by using diagnosis-driven yield analysis
Layout-aware scan diagnosis combined with dedicated statistical analysis is an effective diagnosis-driven yield analysis flow. Geir Eide, Mentor Graphics Corp.
Holistic substrate inspection for defects at the 32nm node and beyond
A holistic strategy can help to find and correct process-induced defects. Philippe Gastaldo, Altatech Semiconductor S.A.
Cycle Time Reduction
Focus on product quality key to cutting cycle times
The closed-loop approach to quality reduces cycle times and other key manufacturing metrics and also provides the top-line benefits that product quality drives. Karim Lokas, Camstar Systems, Inc.
Technical debt in semiconductor equipment: it's time to pay it down
This is a good time to take stock of your development readiness and how well legacy software assets will support the product roadmap. Dan O???Connor, Foliage.
Production metrology of advanced LED structures using high-resolution X-ray diffraction
The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.
Pyrolysis-electrochemical sensor for monitoring carbonyl sulfide levels in ambient air
A pyrolyzer-electrochemical cell-based sensor can detect COS (as H2S) from tens of ppm up to 100ppm. Dan Chase, et al, Matheson Tri-Gas Inc.