Table of Contents

Solid State Technology

Year 2010
Issue 2



Industry Restructuring in Progress: The Haves and Have-Nots

Pete Singer, Editor-in-Chief

Industry Forum

Recession as the mother of innovation

As the industry moves out of the recession, continued innovation investment is the proper path—necessity may be the mother of invention, but perhaps recession is the mother of innovation. Michael Todd, Henkel Corporation, Irvine, CA USA


World News.html

World News

Tech News

ISS: Major consolidation concerns as R&D rift deepens

Tech News

New GaN MOCVD tool for high-volume HB-LED

Tech News

Allvia shows off its Si interposer data

Product News.html

Product News


Cover Article

Temporary bonding enables new processes requiring ultra-thin wafers

A system is described that supports a wafer during backgrinding and subsequent post-thinning processes used in 3D integration. Richard Webb, 3M, Maplewood, MN USA

Package Inspection

Automated inspection improves yield, reduces manufacturing cost of 3DICs

Standards and best practices for automated inspection for the next generation 3DIC and TSV processes are being developed at Sematch's WtW 3D interconnect line. Rudolph Technologies, Inc., Bloomington, MN USA

Next Gen Lithography

Lithography perspective for the 22nm half-pitch

Progress has been made on double-patterning lithography as well as EUVL. Chip manufacturers must now decide which technology to use based on its availability and cost, and requirements of their product roadmap. stefan Wurm, Sematech, Albany, NY USA

Strain Engineering

Modeling of stress and narrow-width effects in shallow trench isolation

Shallow trench isolation (STI) effects cam be accurately simulated with TCAD, allowing technologists to optimize the process to account for and mitigate the impact of these effects in CMOS technologies. Ricardo Borges, Synopsys, Mountain View, CA USA