|Table of Contents|
Solid State Technology
Life after the
Pete Singer, Editor-in-Chief
Innovation on the interface between disciplines
The semiconductor industry is positioning itself on the plane of two complementary axes—the traditional scaling or More Moore axis, and the More than Moore axis. Luc Van den hove, IMEC, Leuven, Belgium
IMAPS 2009: Fusion bonding for 3D/TSV, wafer-level/multichip packaging for MEMS
Getting greener: New fab EHS benchmark tool debuts
Improved tungsten deposition for 3Xnm logic, memory
All-wet stripping process for highly implanted photoresist
An all-wet photoresist removal process has been developed that reduces the number of process steps and eliminates the potential for plasma-induced substrate damage, while minimizing substrate material loss. Ron Nan, Freda Lee, Jey Hung, SMIC, Shanghai, P.R.C.; James. M.M. Chu, Jack Yuan, David Yang, FSI International, Hsinchu, Taiwan R.O.C., Jeffery W. Butterbaugh, FSI International, Chaska, MN USA
Executive viewpoints: The recovery has arrived!
The conventional wisdom is that scaling will continue at the traditional pace defined by Moore's Law well into the future. To gain insight into what technologies will be required , and what impact the recent downturn had on technology development, leading executives provide their perspectives on what 2010 will bring.
For 2010, marketplace optimism abounds
Booming. Recovery. Upturn. Choose your favorite optimistic word, and that is what many analysts surveyed by Solid State Technology are projecting for the semiconductor market in 2010.