Table of Contents

Solid State Technology

Year 2011
Issue 9



A new look for Solid State Technology

We are launching new designs for Solid State Technology's magazine and website! Starting with this October issue, you'll see a whole new look to Solid State Technology's print and digital issues.


Chinese LED manufacturing: More than just LEDs

There has been a lot of talk about how China is ramping???and subsidizing???its entire energy sector???spanning coal, solar, wind, and nuclear???but also energy efficient products like electric cars and, yes, LEDs and LED lighting.


What's driving MEMS commercialization

In my annual "Commercialization Report Card" market study, the MEMS industry infrastructure is one of 14 critical success factors.

Industry Forum

Answering the call to innovate

As technology developers, we often realize innovations through a combination of multiple factors, including market research, internal idea generation, and even by chance.



Is PC softness dragging down Intel's 22nm plans?

Intel's Fab 24 in Leixlip, Ireland (the '1270' line) is being removed from the company's 22nm roadmap, according to Barclays' CJ Muse. Citi's Tim Arcuri added that the planned Fab 24 migration is being put "on hold" with a deeper strategic decision over Fab 24's fate coming at 14nm or 10nm.


Inside the first 450mm printed wafer

During SEMICON West 2011, SEMATECH announced the world's first 450mm imprinted wafer, accomplished by EV Group (EVG).


SEMI revises fab capex forecast down, still record year

SEMI has revised its World Fab Forecast to a 23% year-on-year increase, down from the 31% growth forecast in May.


Cover Article

Integration and 3D-ICs driving developments in wafer bonding

Megatrends driving wafer bonding are heterogeneous and 3D integration.

Mask Making

Model-based mask data prep using overlapping shots for 20nm devices

As semiconductor devices push into the 20nm process node and beyond, new techniques are needed to extend the viability of 193nm immersion.

Wafer Inspection

Improved SRAM detection through scattered light collection

A new optical scheme for inspection of advanced SRAM patterns offers enhanced defect signal-to-noise ratio (SNR), enhanced defect capture rate, and higher throughput.

Increasing Fab Efficienc

Turn-key collaborative programs for next-generation materials

For many years, semiconductor manufacturers have been striving to control escalating R&D and manufacturing costs.