Table of Contents

Solid State Technology

Year 2011
Issue 7



Technology trends to watch

Peter Singer, Editor-in-Chief

Industry Forum

Materials integration, new architectures are top priority at 22nm


World News.html

World News

Tech News

SEMICON West preview: Potential $45B power device market looks to new substrates, packaging, process flows

Alternative energy applications may help drive the power semiconductor market to $45 billion by 2014, according to IHS iSuppli.

Tech News

SEMICON West preview: The future of MEMS: Rethinking MEMS business strategies and manufacturing technology for volume systems markets

Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business.

Tech News

Mobile SoCs can have low power without dopants, says SuVolta

SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channel (DDC) technology.

Tech News

One year later: Amkor/TI high-density copper pillar bump technology

In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages???shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.

Product News.html

Product News


Cover Article

Solutions for MEMS sensor fusion

When multiple MEMS sensors are included in a system, it is necessary to implement sensor fusion algorithms to take advantage of individual sensor capabilities for better overall performance. Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, Coppell, TX USA

Yield Optimization

Scan diagnostic analysis assists SoC fab debug/process monitoring

Steve Palosh, Freescale Semiconductor, Austin, TX USA; Geir Eide Mentor Graphics Corp., Wilsonville, OR USA


Package-on-package: thinner, faster, denser

Lee Smith, Amkor Technology, Chandler, AZ USA

Multi Die Packaging

Performance enhancements for multi-die DRAM packages

R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C

Power Mangagement Ics

Power management ICs for green energy applications

Lou N. Hutter, Dongbu HiTek, Seoul, S. Korea


Undiluted slurry data improves CMP metrics

Advanced Packaging

The search for a

Arthur L. Chait, EoPlex, Inc., Redwood City, CA USA

450mm Wafers

Handling the 450mm Wafer with Structural Ceramics

Frank J. Ardezonne, President, End-Effectors, Santa Clara, CA