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Solid State Technology
Technology trends to watch
Peter Singer, Editor-in-Chief
Materials integration, new architectures are top priority at 22nm
SEMICON West preview: Potential $45B power device market looks to new substrates, packaging, process flows
Alternative energy applications may help drive the power semiconductor market to $45 billion by 2014, according to IHS iSuppli.
SEMICON West preview: The future of MEMS: Rethinking MEMS business strategies and manufacturing technology for volume systems markets
Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business.
Mobile SoCs can have low power without dopants, says SuVolta
SuVolta is tackling the low-power challenge of mobile SoC devices with its PowerShrink platform and undoped, deeply depleted channel (DDC) technology.
One year later: Amkor/TI high-density copper pillar bump technology
In late June 2010, Amkor and TI announced that they had qualified and begun production of the industry's first fine pitch copper pillar flip chip packages???shrinking bump pitch up to 300% compared to then current solder bump flip chip technology.
Solutions for MEMS sensor fusion
When multiple MEMS sensors are included in a system, it is necessary to implement sensor fusion algorithms to take advantage of individual sensor capabilities for better overall performance. Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, Coppell, TX USA
Scan diagnostic analysis assists SoC fab debug/process monitoring
Steve Palosh, Freescale Semiconductor, Austin, TX USA; Geir Eide Mentor Graphics Corp., Wilsonville, OR USA
Package-on-package: thinner, faster, denser
Lee Smith, Amkor Technology, Chandler, AZ USA
Multi Die Packaging
Performance enhancements for multi-die DRAM packages
R. Crisp, et al., Tessera, San Jose, CA USA; W. Chang, et al., Powertech Technology Inc., Hsinchu, Taiwan, R.O.C
Power Mangagement Ics
Power management ICs for green energy applications
Lou N. Hutter, Dongbu HiTek, Seoul, S. Korea
Undiluted slurry data improves CMP metrics
The search for a
Arthur L. Chait, EoPlex, Inc., Redwood City, CA USA
Handling the 450mm Wafer with Structural Ceramics
Frank J. Ardezonne, President, End-Effectors, Santa Clara, CA