PV and IC industries converge
I had the good fortune to tour a solar cell manufacturing plant in East Germany earlier this year, and it was an eye-opening experience.
Things are looking bleaker by the month for companies serving semiconductor makers.
Report from VLSI Symposium: Planar CMOS to 22nm, at most
This year’s VLSI Symposium meeting (June 16-19, Waikiki, HI) highlighted 45nm to 16nm CMOS technology.
Intel eyes scalable FBC technology for 15nm and beyond
Among the papers presented by Intel at the VLSI Symposium was one describing fabrication of the smallest reported floating body cell (FBC) planar devices, with functional devices measuring down to 30nm gate length (#9.4, “A Scaled Floating Body Cell Memory with High-k + Metal Gate on Thin-Silicon and Thin-BOX for 15nm Node and Beyond”).
Dow Corning targets maskless lithography with latest e-beam photoresists
Dow Corning Electronics’ silicon lithography solutions group announced the commercial availability of Dow Corning XR-1541 e-beam resists, designed to enable the development of next-generation, direct-write lithography processing technology.
Commodity price pain, or sustainable opportunity?
Resource constraints are appearing with increasing frequency in our work and personal lives. Those constraints usually present themselves in the form of higher prices—as predicted by the classic supply-and-demand economic model.