The Case for Integration
The limits of traditional CMOS scaling are at hand, combined with an unprecedented financial crisis in the electronics industry.
Analyst: 2H09 recovery for DRAM…maybe
2008 was a big game of “chicken” in the DRAM sector, as firms floored their investment and output pedals in 2008 hoping competitors would give up first.
Steady progress reported on HK+MG for 32nm and beyond
Chipmakers are trying many paths toward high–k metal gate dielectric (HK+MG) CMOS for 32nm and beyond.
NIST creates toughness test for low–k films
Researchers at the National Institute of Standards and Technology (NIST) have updated a well–known technique for measuring material properties to gauge the mechanical strength of low–k films, to help devicemakers better identify interconnect dielectric film candidates.
Wafer–based solar cells aren’t done yet
The solar industry’s recent growth spurt has shown that success brings new challenges.
The Discover Solar software package is a reengineered version of the company’s inline defect analysis and data management system to target high–volume photovoltaic production, offering automated process control and the ability to perform root cause analysis closer to real time.
The technomics of 22nm
What is the most viable path to enabling the design shrink to 22nm? Will a solution emerge that overcomes the technical and economic hurdles currently being anticipated in both manufacturing and design?