Where should products be manufactured?
With large sectors of manufacturing, including chipmaking, moving from the US and Europe to Asia, what impact is this having on national economies?
SEMI, VLSI add up 2006 chip, equipment numbers
Demand for new semiconductor manufacturing equipment surged in December, during what was the final fiscal month for most North American companies, according to the latest data from SEMI.
Intel unveils 45nm chip with high-k, metal gates
Claiming “a significant breakthrough in transistor technology,” Intel Corp. says it has advanced its 45nm process technology from a SRAM test chip unveiled in Jan. 2006 into working 45nm micrprocessors, chips that incorporate a hafnium-based high-k dielectric material and a new combination of metals for the transistor gate electrode.
Pushing the limits of CMP mechanical control
Any chemical-mechanical planarization (CMP) process can be conceptually separated into chemical and mechanical components.
Stretching silicon mobility with strain engineering
For years, semiconductor manufacturers depended on a happy coincidence: smaller transistors are less expensive to manufacture and also deliver better performance.
A sub-100nm manufacturing technique for for hot-spot removal
In today’s advanced integrated circuits (ICs), critical manufacturing challenges such as hot spots are becoming routine phenomena.
Exposure equipment trends in TFT-LCD manufacturing
Made manifest by any trip to an electronics store, LCDs are now everywhere in applications from cell phones to televisions.
Freescale’s process and fab strategy puts a new spin on MRAM
Freescale was recently honored with a product award for its magnetoresistive random access memory (MRAM) product, the Freescale MR2A16ATS35C 4-Mbit MRAM.
Smaller OEMs keep pace with new trends in software
Today, the cost of developing and maintaining software is rising faster than other costs associated with semiconductor equipment design, largely due to an increased emphasis on automation and process control.